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Boards using the SIM7080G

16 boards

Boards in 11 GitHub repositories, designed in KiCad, that use the SIM7080G by SIMCom Wireless Solutions (2.7V~4.8V B2、B3、B1 I2C、USB、UART、PCM、SPI NB-IoT、CAT-M PCM语音功能 SMD,17.6x15.7mm 2G/3G/4G/5G Modules ROHS). See how each wires it, with its parts, size, README and files; the SIM7080G’s symbol, footprint and pinout are on its own page.

  • 4 layers38.5 × 47 mmSIM7080, the printed circuit board in 3D

    SIM7080

    techstudio-design/sim7080_dev_board

    SIM7080 Dev Board hardware design files

    55 parts17
  • 4 layers45.7 × 76.2 mmNode v5 0 0, the printed circuit board in 3D

    Node v5 0 0

    VTC-WISDOM/node_hardware

    Schematic/PCB designs for WiSDOM nodes, also includes a few other related hardware projects

    107 parts2CERN-OHL-W-2.0
  • 4 layers88.3 × 112.3 mmSoil metrics, the printed circuit board in 3D

    Soil metrics

    Aryan-git-byte/Soil-metrics

    Portable AI-powered soil monitoring device with LTE connectivity, GPS, touchscreen interface, and real-time soil health analytics.

    74 parts1MIT
  • 4 layers115 × 75 mmInduLink-485, the printed circuit board in 3D

    InduLink-485

    8aChristian/InduLink-485

    The board follows rigorous IPC (IPC-2152, IPC-2221, IPC-7351) standards, complete with galvanic isolation, industrial transient protection (TVS, Schottky, PTC Polyfuse), a wide-input step-down switching power…

    24 partsMIT
  • 4 layers56 × 52 mmEdgeLink S3 Cellular, the printed circuit board in 3D

    EdgeLink S3 Cellular

    CDonohoe-Designs/EdgeLink_S3_Cellular

    EdgeLink S3 Cellular is a four-layer embedded hardware platform combining an ESP32-S3 controller, SIM7080G cellular/GNSS modem, USB-C, battery power management and environmental/motion sensing.

    114 parts
  • 4 layers26 × 30 mmLte m dongle fw, the printed circuit board in 3D

    Lte m dongle fw

    GManSudy/framework-expansion-lte

    An LTE-M / NB-IoT cellular modem built into the Framework Laptop Expansion Card form factor, with a native USB-C plug.

    32 parts
  • 2 layers65 × 40 mmMdb slave esp32s3-sim7080g, the printed circuit board in 3D

    Mdb slave esp32s3-sim7080g

    nodestark/mdb-esp32-cashless

    ESP32-based MDB cashless device for vending machines, supporting EVA DTS DEX/DDCMP telemetry and payments over the MDB protocol via Bluetooth and MQTT

    82 parts190MIT
  • 4 layers25.4 × 57.2 mmSim7080g, the printed circuit board in 3D

    Sim7080g

    absmach/a0

    A0 IoT Gateway

    57 parts16Apache-2.0
  • 4 layers45.7 × 76.2 mmNode v5 0 0, the printed circuit board in 3D

    Node v5 0 0

    VTC-WISDOM/node_hardware

    Schematic/PCB designs for WiSDOM nodes, also includes a few other related hardware projects

    103 parts2CERN-OHL-W-2.0
  • 6 layers45 × 75 mmNode v6 0 0, the printed circuit board in 3D

    Node v6 0 0

    VTC-WISDOM/node_hardware

    Schematic/PCB designs for WiSDOM nodes, also includes a few other related hardware projects

    99 parts2CERN-OHL-W-2.0
  • 6 layers45 × 75 mmNode v6 1 0, the printed circuit board in 3D

    Node v6 1 0

    VTC-WISDOM/node_hardware

    Schematic/PCB designs for WiSDOM nodes, also includes a few other related hardware projects

    96 parts2CERN-OHL-W-2.0
  • 6 layers45 × 75 mmNode v6 2 0, the printed circuit board in 3D

    Node v6 2 0

    VTC-WISDOM/node_hardware

    Schematic/PCB designs for WiSDOM nodes, also includes a few other related hardware projects

    100 parts2CERN-OHL-W-2.0
  • 2 layers104 × 129 mmModbus master, the printed circuit board in 3D

    Modbus master

    magnusbpt/Modbus-wireless

    83 parts
  • 2 layers104 × 129 mmModbus master, the printed circuit board in 3D

    Modbus master

    magnusbpt/Modbus-wireless

    82 parts