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Boards using the IP2326

11 boards

Boards in 10 GitHub repositories, designed in KiCad, that use the IP2326 by INJOINIC (-40℃~+150℃ 1.5A 2~3 4.5V~9.5V 700nA 8.4V Charging IC、Balancing IC Support VQFN-24-EP(4x4) Battery Management ROHS). See how each wires it, with its parts, size, README and files; the IP2326’s symbol, footprint and pinout are on its own page.

  • 2 layers108.9 × 47.3 mmPowerBankPD, the printed circuit board in 3D

    PowerBankPD

    NgxLuis/30W-PD-Power-Bank

    PCB design - 30W High-Performance Power Bank utilizing SW3518, IP2326, and BM3451 for a 3S 21700 battery pack.

    105 parts1MIT
  • 2 layers96 × 58 mmRobot Arm Schematics Draft, the printed circuit board in 3D

    Robot Arm Schematics Draft

    2ah33d/esp32-power-actuator-board

    Custom 2-layer ESP32 carrier with 2S LiPo boost charging (IP2326), multi-rail regulation, and high-current servo distribution in KiCad.

    80 parts
  • 2 layers80 × 52 mmVolleyBot, the printed circuit board in 3D

    VolleyBot

    CausticLime1/VolleyBot

    110 parts
  • 4 layers61.3 × 61.7 mmBio thing, the printed circuit board in 3D

    Bio thing

    noahalam77-code/TheraPatch

    82 partsMIT
  • 2 layers100 × 55 mmInvpcb, the printed circuit board in 3D

    Invpcb

    Prajwal-sahyadri-ECE/-Optimized-Powersupply-design-

    A highly detailed PCB to maintain an power supply for a defined hardware architecture specifically for ICS system

    66 partsMIT
  • 2 layers50 × 40 mmPower-2S, the printed circuit board in 3D

    Power-2S

    sastles-com/power-2S-02

    26 parts
  • 2 layers90 × 64 mmDivine light, the printed circuit board in 3D

    Divine light

    tobycm/divine-light

    A handheld device with neopixels so you can have lights wherever you want :b

    88 partsMIT
  • 2 layers58.2 × 107.4 mmHeadphones, the printed circuit board in 3D

    Headphones

    williamthayer/OpenPhones

    Opensource Headphones

    52 parts
  • 2 layers87.2 × 77.2 mmSources, the printed circuit board in 3D

    Sources

    JulCesarCorrea/Basic-EPS

    PCB design para a 4 fase da obsat

    55 parts
  • 2 layers50 × 40 mmPower IP2326-MP1584-FPC-03, the printed circuit board in 3D

    Power IP2326-MP1584-FPC-03

    sastles-com/FPC-isolation-sphere

    直径 100 mm の球体 LED ディスプレイ。約 800 個の WS2812-2020 を ゴールドバーグ多面体 T=81 の球面に配置した "デジタル地球儀" 風ピクセルディスプレイ。

    24 parts