Open-source KiCad boards

22 match “asinghani”

Printed circuit boards designed in KiCad and published on GitHub, each with its parts, layers and size, its README and its files; open any of them in PCBKit.

2 layers101.6 × 101.6 mm
Baseplate v1
asinghani/craft18
Bring Minecraft Redstone circuits to life using analog electronics!
49 parts
2 layers11.4 × 7.6 mm
Sot23 adapter
asinghani/craft18
Bring Minecraft Redstone circuits to life using analog electronics!
3 parts
2 layers38.1 × 38.1 mm
Base connector
asinghani/craft18
Bring Minecraft Redstone circuits to life using analog electronics!
21 parts
2 layers22.9 × 20.3 mm
Edge board
asinghani/craft18
Bring Minecraft Redstone circuits to life using analog electronics!
11 parts
2 layers50.8 × 40.6 mm
Button board
asinghani/mpw3-bringup
Bringup and testing of MPW-3 chips from SKY130 tapeout in Nov 2021
3 parts1
4 layers22 × 22 mm
Caravel M.2-card QFN
asinghani/18224-tapeout-s23-bringup
PCB layouts for student project bringup for CMU Open Source Chip Design Spring 2023 tapeout
5 parts
4 layers148.3 × 76.2 mm
Caravel M.2-card QFN panelized
asinghani/18224-tapeout-s23-bringup
PCB layouts for student project bringup for CMU Open Source Chip Design Spring 2023 tapeout
66 parts
4 layers81.3 × 52.7 mm
Manual gpio board v2
asinghani/18224-tapeout-s23-bringup
PCB layouts for student project bringup for CMU Open Source Chip Design Spring 2023 tapeout
50 parts
4 layers91.4 × 101.6 mm
Vga breakout
asinghani/mpw3-bringup
Bringup and testing of MPW-3 chips from SKY130 tapeout in Nov 2021
79 parts1
4 layers70 × 70 mm
449pcb v1
asinghani/drive-by-wireless
F22 Distributed Embedded Final Project: UWB Drive-by-Wireless
56 parts
4 layers81.3 × 52.7 mm
Manual gpio board
asinghani/18224-tapeout-s23-bringup
PCB layouts for student project bringup for CMU Open Source Chip Design Spring 2023 tapeout
56 parts
4 layers81.3 × 43.2 mm
Debugger board v1
asinghani/18224-tapeout-s23-bringup
PCB layouts for student project bringup for CMU Open Source Chip Design Spring 2023 tapeout
54 parts
2 layers65.7 × 51.7 mm
Ice40 catears v1
asinghani/ice40-wearable
iCE40 FPGA boards in wearable form-factors
58 parts
2 layers91.4 × 80.6 mm
Uart breakout
asinghani/mpw3-bringup
Bringup and testing of MPW-3 chips from SKY130 tapeout in Nov 2021
50 parts1
4 layers81.3 × 41.9 mm
Breakout board v1
asinghani/18224-tapeout-s23-bringup
PCB layouts for student project bringup for CMU Open Source Chip Design Spring 2023 tapeout
45 parts
4 layers81.3 × 41.9 mm
Breakout board v2
asinghani/18224-tapeout-s23-bringup
PCB layouts for student project bringup for CMU Open Source Chip Design Spring 2023 tapeout
62 parts
4 layers48.3 × 57.7 mm
Sensor node v1
asinghani/rp2040_aprs_sensor_node
RP2040-based sensor node PCB that communicates on the APRS (Automatic Packet Reporting System) network
57 parts2
2 layers25.6 × 0 mm
Ice40 wearable v1
asinghani/ice40-wearable
iCE40 FPGA boards in wearable form-factors
63 parts
4 layers91.4 × 54.6 mm
Mpw3-common
asinghani/mpw3-bringup
Bringup and testing of MPW-3 chips from SKY130 tapeout in Nov 2021
69 parts1
4 layers81.3 × 73.9 mm
Breakout board v4
asinghani/18224-tapeout-s23-bringup
PCB layouts for student project bringup for CMU Open Source Chip Design Spring 2023 tapeout
98 parts
4 layers99.1 × 83.8 mm
Ibm-5151-pcb
asinghani/ibm-5151-controller
Building a VT100 emulator out of an IBM 5151 monitor and an FPGA
85 partsMIT
4 layers100 × 100 mm
Breakout board v1
asinghani/mpw1-bringup
Attempts at recovering SKY130 MPW-ONE chips (December 2020 // March 2022)
88 parts3