4 layers144.3 × 143.8 mm
Boards by esl-epfl
21 boardsOpen-source boards designed in KiCad by esl-epfl on GitHub, from 6 repositories. A board’s address here is its repository’s there.
- 4 layers162.6 × 61.5 mm
VersaSens HeEx
esl-epfl/VersaSens
VersaSens: An Extendable Multimodal Platform for Next-Generation Edge-AI Wearables
335 parts9 - 6 layers15.6 × 19.7 mm
ADC Board
esl-epfl/X-MODs
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
74 parts3 - 4 layers15.3 × 45.8 mm
ExtendedRangeSupply
esl-epfl/CHEEP-boards
This chewing gum board is designed to be an extended-range voltage supply + current measurement circuit, intended for connection to the main board through the male pin headers to both sides.
46 parts2 - 4 layers38.5 × 40 mm
Core v mini mcu spiboot fpga
esl-epfl/x-heep-programmer-pmod
PMOD integrating an external SPI flash and an FTDI based programmer for the flash & JTAG debugger for x-heep
39 parts2CC-BY-SA-4.0 - 4 layers53.4 × 38.4 mm
GSR Board
esl-epfl/GSR_monitor
Discrete validation platform for the HEEPidermis low-power SoC, designed for low-noise Galvanic Skin Response (GSR) measurements
159 parts1 - 4 layers15.2 × 34.3 mm
- 2 layers13.1 × 49.3 mm
- 4 layers85.7 × 58.6 mm
- 4 layers15.3 × 45.8 mm
- 2 layers85.1 × 53.9 mm
- 2 layers85.1 × 53.9 mm
- 2 layers85.1 × 53.9 mm
- 4 layers64.1 × 16.2 mm
ADC Board Socket
esl-epfl/X-MODs
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
25 parts3 - 6 layers17.5 × 23.9 mm
CHEEP Board
esl-epfl/X-MODs
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
46 parts3 - 4 layers64.9 × 71.4 mm
CHEEP Board Socket
esl-epfl/X-MODs
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
70 parts3 - 6 layers15.2 × 10.8 mm
Memory Board
esl-epfl/X-MODs
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
19 parts3 - 4 layers69.3 × 16.3 mm
Memory Board Socket
esl-epfl/X-MODs
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
22 parts3 - 6 layers14.8 × 12.6 mm
Power Board
esl-epfl/X-MODs
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
31 parts3 - 4 layers38 × 47.3 mm
Power Board Socket
esl-epfl/X-MODs
Modular hardware platform based on the RISC-V X-HEEP family architecture developed at ESL, targeting ultra-low-power consumption and miniaturization, facilitating the creation of wearable devices for clinical trials
41 parts3 - 4 layers15.3 × 45.8 mm
CurrentSource
esl-epfl/CHEEP-boards
This chewing gum board is designed to be an extended-range voltage supply + current measurement circuit, intended for connection to the main board through the male pin headers to both sides.
39 parts2