TPD3S014DBV

Texas InstrumentsExtended

-40℃~+125℃ 20nA 4.5V~5.5V 500mA Not supported Not supported Soft-start、Under-voltage lockout、Overcurrent Protection、Short-Circuit Protection、Reverse current blocking、Output discharge function SOT-23-6 Power Distribution Switches ROHS

Datasheet JLCPCB LCSC

Part id: ti/TPD3S014DBV
Category: Power Distribution Switches
Package: SOT-23-6
Pins: 6
In stock: 10,408 at JLCPCB (C87384)
Used on: 14 open-source boards

Overview

The TPD3S014DBV is a power Distribution Switche made by Texas Instruments in a SOT-23-6 package with 6 pins. -40℃~+125℃ 20nA 4.5V~5.5V 500mA Not supported Not supported Soft-start、Under-voltage lockout、Overcurrent Protection、Short-Circuit Protection、Reverse current blocking、Output discharge function SOT-23-6 Power Distribution Switches ROHS.

PCBKit's library has its KiCad symbol (Power_Protection:TPD3S014, from KiCad's library) and its footprint (Package_TO_SOT_SMD:SOT-23-6, from KiCad's library), ready for a KiCad board. 10,408 are in stock at JLCPCB (part C87384). 14 open-source boards in 10 repositories on GitHub use it.

Symbol

Power_Protection:TPD3S014From KiCad's library

Footprint

Package_TO_SOT_SMD:SOT-23-6From KiCad's library

From the datasheet

Supply, least: 4.5 V · VIN, recommended operating min · p. 4
Supply, most: 5.5 V · VIN, recommended operating max · p. 4
Supply, absolute maximum: 6 V · VIN, absolute max · p. 4
Works from: -40 °C · Ambient temperature min · p. 1
Works up to: 85 °C · Ambient temperature max · p. 1
Junction, hottest: 125 °C · Operating junction temperature max · p. 4
Takes working: 66 µA · VIN, switch enabled, no load, typical · p. 6
Takes at most: 94 µA · VIN, switch enabled, no load, max over temperature · p. 6
Takes asleep: 20 nA · VIN, switch disabled, no load, typical · p. 6
Gives: 500 mA · Continuous output current max, TPD3S014 · p. 4
Current limit: 850 mA · TPD3S014 current limit typical · p. 6
Junction to air (DBV (SOT-23)): 185.8 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to case (DBV (SOT-23)): 124.7 K/W · Junction-to-case top thermal resistance · p. 5
Junction to board (DBV (SOT-23)): 32 K/W · Junction-to-board thermal resistance · p. 5
Edge: 400 µs · Output fall time typical, CL = 1 uF, RL = 100 Ω, VIN = 5 V · p. 6

What it is and has

Output discharge: Integrated · p. 1
Reverse current blocking: Supported · p. 1
Short-circuit protection: Supported · p. 1
Over temperature protection: With auto-restart · p. 1
Soft start: Built-in · p. 1
ESD protection: Two-channel TVS diode array for USB interfaces · p. 12

Around it

cap 0.1-µF or greater: between IN and GND; Ceramic capacitor, close to the IC. · p. 3

Specifications

Parameter	Conditions	As printed	Page
Input voltage VIN		min -0.3 · max 6 V	4
Input voltage VOUT		min -0.3 · max 6 V	4
Input voltage EN		min -0.3 · max 6 V	4
Input voltage D1		min -0.3 · max 6 V	4
Input voltage D2		min -0.3 · max 6 V	4
Voltage from VIN to VOUT		min -6 · max 6 V	4
Storage temperature, Tstg Tstg		min -65 · max 150 °C	4
Electrostatic discharge V(ESD)	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; all pins; ± rating	max 2000 V	4
Electrostatic discharge V(ESD)	Charged device model (CDM), per JEDEC specification JESD22-C101; all pins; ± rating	max 500 V	4
Electrostatic discharge V(ESD)	IEC 61000-4-2 contact discharge; VOUT, Dx pins; ± rating	max 12000 V	4
Electrostatic discharge V(ESD)	IEC 61000-4-2 air-gap discharge; VOUT, Dx pins; ± rating	max 15000 V	4
Input voltage VIN		min 4.5 · max 5.5 V	4
Input voltage, EN VEN		min 0 · max 5.5 V	4
High-level Input voltage, EN VIH		min 2 V	4
Low-level Input voltage, EN VIL		max 0.7 V	4
Input decoupling capacitance, IN to GND CIN		min 0.1 uF	4
Continuous output current (TPD3S014) IOUT	TPD3S014	max 0.5 A	4
Operating junction temperature TJ		min -40 · max 125 °C	4
Junction-to-ambient thermal resistance RθJA	DBV (SOT-23), 6 pins	typ 185.8 °C/W	5
Junction-to-case (top) thermal resistance RθJC(top)	DBV (SOT-23), 6 pins	typ 124.7 °C/W	5
Junction-to-board thermal resistance RθJB	DBV (SOT-23), 6 pins	typ 32 °C/W	5
Junction-to-top characterization parameter ψJT	DBV (SOT-23), 6 pins	typ 23.7 °C/W	5
Junction-to-board characterization parameter ψJB	DBV (SOT-23), 6 pins	typ 31.5 °C/W	5
See the Power Dissipation and Junction Temperature section RθJA(Custom)	DBV (SOT-23), 6 pins	typ 120.3 °C/W	5
Input – Output resistance RDS(on)	TPD3S014; VIN = 5 V, VEN = VIN, IOUT = 0 A	typ 97 · max 110 mΩ	5
Input – Output resistance RDS(on)	TPD3S014: –40°C ≤ (TJ, TA) ≤ 85°C; VIN = 5 V, VEN = VIN, IOUT = 0 A	typ 96 · max 130 mΩ	5
Current limit, see Figure 27 IOS	TPD3S014; VIN = 5 V, VEN = VIN	min 0.67 · typ 0.85 · max 1.01 A	5
Supply current, switch disabled ISD	VIN = 5 V, IOUT = 0A	typ 0.02 · max 1 uA	5
Supply current, switch disabled ISD	–40°C ≤ (TJ, TA) ≤ 85°C, VIN = 5.5 V, IOUT = 0 A	max 2 uA	5
Supply current, switch enabled ISE	VIN = 5 V, VEN = VIN, IOUT = 0A	typ 66 · max 74 uA	5
Supply current, switch enabled ISE	–40°C ≤ (TJ, TA) ≤ 85°C, VIN = 5.5 V, IOUT = 0 A	max 85 uA	5
Reverse leakage current IREV	VOUT = 5 V, VIN = 0 V, Measure IVOUT	typ 0.2 · max 1 uA	5
Output pull-down resistance RPD	VIN = VOUT = 5 V, disabled	min 400 · typ 456 · max 600 Ω	5
Differential capacitance between the D1, D2 lines ΔCIO	ƒ = 1 MHz, VIO = 2.5 V	typ 0.02 pF	5
(D1, D2 to GND) CIO	ƒ = 1 MHz, VIO = 2.5 V	typ 1.4 pF	5
Dynamic on-resistance D1, D2 IEC clamps RDYN	Dx to GND; GND to Dx	typ 0.2 Ω	5
Input – output resistance RDS(on)	TPD3S014; 4.5 V ≤ VIN ≤ 5.5 V, VEN = VIN, IOUT = 0 A	typ 97 · max 154 mΩ	6
Threshold	Enable input (EN); Input rising	min 1 · typ 1.45 · max 2 V	6
Hysteresis	Enable input (EN)	typ 0.13 V	6
Leakage current	Enable input (EN); VEN = 0 V	min -1 · typ 0 · max 1 uA	6
Turn on time tON	VIN = 5 V, CL = 1 uF, RL = 100 Ω, EN ↑; See Figure 26	min 1 · typ 1.6 · max 2.2 ms	6
Turn off time tOFF	VIN = 5 V, CL = 1 uF, RL = 100 Ω, EN ↓; See Figure 26	min 1.7 · typ 2.1 · max 2.7 ms	6
Rise time, output tR	CL = 1 uF, RL = 100 Ω, VIN = 5 V, See Figure 25	min 0.4 · typ 0.64 · max 0.9 ms	6
Fall time, output tF	CL = 1 uF, RL = 100 Ω, VIN = 5 V, See Figure 25	min 0.25 · typ 0.4 · max 0.8 ms	6
Current limit, see Figure 27 IOS	TPD3S014	min 0.65 · typ 0.85 · max 1.05 A	6
Short-circuit response time tIOS	VIN = 5 V (see Figure 27); One Half full load → RSHORT = 50 mΩ; Measure from application to when current falls below 120% of final value	typ 2 us	6
Supply current, switch disabled ISD	IOUT = 0 A	typ 0.02 · max 10 uA	6
Supply current, switch enabled ISE	IOUT = 0 A	typ 66 · max 94 uA	6
Reverse leakage current IREV	VOUT = 5.5 V, VIN = 0 V, Measure IVOUT	typ 0.2 · max 20 uA	6
Rising threshold VUVLO	Undervoltage lockout; VIN↑	min 3.5 · typ 3.77 · max 4 V	6
Hysteresis	Undervoltage lockout; VIN↓	typ 0.14 V	6
Output pull-down resistance RPD	VIN = 4 V, VOUT = 5 V, Disabled	min 350 · typ 545 · max 1200 Ω	6
Output pull-down resistance RPD	VIN = 5 V, VOUT = 5 V, Disabled	min 300 · typ 456 · max 800 Ω	6
Rising threshold (TJ) TSHDN	Thermal shutdown; In current limit	min 135 °C	6
Rising threshold (TJ) TSHDN	Thermal shutdown; Not in current limit	min 155 °C	6
Hysteresis	Thermal shutdown	typ 20 °C	6
Input leakage current (D1, D2) II	VI = 3.3 V	typ 0.02 · max 1 uA	6
Diode forward voltage (D1, D2); Lower clamp diode VD	IO = 8 mA	max 0.95 V	6
Breakdown voltage (D1, D2) VBR	IBR = 1 mA	min 6 V	6

Pins, by the datasheet

1 EN: Enable input; logic high turns on power switch. · p. 3
2 GND: Ground. · p. 3
3 IN: Input voltage and power-switch drain; connect a 0.1-uF or greater ceramic capacitor to GND close to the IC. · p. 3
4 OUT: Power-switch output; connect to load. · p. 3
5 D1: USB data+ or USB data–. · p. 3
6 D2: USB data+ or USB data–. · p. 3

Parameters

0V Battery Charge: Not supported
Battery Temperature Detection: Not supported
Charge Current - Max: 500mA
Current - Supply: 66uA
Current - Supply(Max): 94uA
Current Limit: 850mA
Features: Soft-start
Junction Temperature(Max): 125℃
Maximum Continuous Current: 500mA
Operating Temperature: -40℃~+85℃
Rise Time: 400us
Standby Current: 20nA
Supply Current (Iq): 20nA
Thermal Resistance(Junction to Ambient): 185.8℃/W
Thermal Resistance(Junction to Board): 32℃/W
Thermal Resistance(Junction to Case): 124.7℃/W
Voltage - Supply: 4.5V~5.5V
Voltage - Supply(Absolute Max): 6V

Order codes

TPD3S014DBVRLCSC C87384

Pinout

The pins of the TPD3S014DBV
Pin	Name	Type
1	EN	Input
2	GND	Power in
3	IN	Power in
4	OUT	Passive
5	D1	Passive
6	D2	Passive

Show this part on your page

<iframe src="https://pcbkit.io/embed/parts/ti/TPD3S014DBV" title="TPD3S014DBV in PCBKit" width="100%" height="480" style="border:0;border-radius:12px" allow="fullscreen" loading="lazy"></iframe>

For any web page: the part itself, turned and zoomed by the reader.

Open-source boards using it

14See all 14

2 layers104.1 × 58.4 mm
Pocket bob
mwelling/pocket-bob
Simple breakout board for the pocketbeagle boards
131 parts7
4 layers94 × 79.6 mm
Mdt chipdown
andykarpov/mdt-chipdown
MicroDEXED touch custom PCB
141 parts2MIT
4 layers60 × 22 mm
Hypersonic pcb
adaand00/Hypersonic
Platform for audio development with ESP32-S3
38 parts1MIT
4 layers170 × 170 mm
ODROID H3-mITX adapter
rubenbaldewsing/ODROID-H3-mITX-adapter
Adapter board for mounting the ODROID H3(+) onto mITX formfactor. Including onboard LAN management, UART (BIOS) terminal and other features.
66 parts1MIT
4 layers100 × 100 mm
XMOS demo
kakao16/KiCad9_Projects

244 parts
6 layers100 × 75 mm
STM32H743
sneakylizard123-4/STM32H743
This board puts an STM32H743XIH6 and an iCE40 UP5K on the same PCB. The H743 handles control, USB, Ethernet, storage, and audio.
171 partsCERN-OHL-P-2.0
6 layers135.2 × 94.2 mm
Synthesizer
TDT4295-2019-groupA/PCB

155 parts
6 layers83.3 × 61.3 mm
Ecp5
kitspace-test-repos/kicad6-file-collection

211 partsMIT

Parts like it

Questions

Is there a KiCad symbol and footprint for the TPD3S014DBV?

Yes. The symbol is Power_Protection:TPD3S014 and the footprint Package_TO_SOT_SMD:SOT-23-6, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the TPD3S014DBV?

SOT-23-6, with 6 pins. Its footprint is drawn on this page.

Where is the TPD3S014DBV datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the TPD3S014DBV?

JLCPCB lists it as part C87384, with 10,408 in stock; the sellers' links on this page open their listings.

What can replace the TPD3S014DBV?

Parts like it in the library: the TPS22918DBV by Texas Instruments, the TPS2553DBV by Texas Instruments, the AP2553W6 by Diodes Incorporated and the TPS27081ADDC by Texas Instruments. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the TPD3S014DBV?

14 boards in 10 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

TPD3S014DBV

Overview

Symbol

Footprint

From the datasheet

What it is and has

Around it

Specifications

Pins, by the datasheet

Open-source boards using it

Pocket bob

Mdt chipdown

Hypersonic pcb

ODROID H3-mITX adapter

XMOS demo

STM32H743

Synthesizer

Ecp5

Parts like it

TPS22918DBV

TPS2553DBV

AP2553W6

TPS27081ADDC

AP22653W6

TPS2552DBV

SIP32510DT

LP5308B6F