4 layers70 × 26.5 mm
ESP32-S3-Dev Board
Vibhors-Tech-Hub/ESP32-S3-Dev-Board
A 4-layer dev board around the ESP32-S3-MINI-1 with dual USB-C ports
52 parts
Open-source KiCad boards
24 match “dev-board-tech”Printed circuit boards designed in KiCad and published on GitHub, each with its parts, layers and size, its README and its files; open any of them in PCBKit.
- 4 layers38.5 × 47 mm
- 2 layers19.7 × 39 mm
Eprom usb emulator sch
dev-board-tech/eprom-usb-emulator
A 28 Pin DIP EEPROM/EPROM/RAM USB emulator
39 parts3GPL-3.0 - 4 layers83 × 117 mm
- 2 layers22.4 × 34 mm
Tech pcb
tux2603/tntech_pcb_workshop
A workshop to create a simple STM32 based MCU development board. Created for the Tennessee Technological University Department of Electrical and Computer Engineering
24 parts5 - 4 layers50 × 50 mm
RP235X FPGA
Oak-Development-Technologies/RP235X-B-Evaluator
Open source repository for storing the files for the RP235X-B Evaluator, an RP235X-B Evaluation board.
86 parts6CERN-OHL-P-2.0 - 4 layers50.8 × 22.9 mm
RPGA Feather
Oak-Development-Technologies/RPGA-Feather
Home of everything RPGA! From schematics and board files to buildable examples!
82 parts20MIT - 2 layers35 × 65 mm
STM32F103RBH6-development board-
Agathiyan-08/STM32F103RBH6-development-board-
This repository contains the schematic files for the stm32f103rbh6 development. I haven't used Via-in-pad technique here and I have checked my PCB manufacturers capability before routing.
51 parts - 2 layers8 × 12 mm
APDS9960 Adapter board
SolderedElectronics/Soldered-Inkplate-4-TEMPERA-with-glass-panel-hardware-design
Inkplate 4 TEMPERA is an easy-to-use, all-in-one device that puts the power of e-paper technology in the palm of your hand.
14 parts5 - 2 layers80 × 84 mm
APDS9960 Adapter board panel
SolderedElectronics/Soldered-Inkplate-4-TEMPERA-with-glass-panel-hardware-design
Inkplate 4 TEMPERA is an easy-to-use, all-in-one device that puts the power of e-paper technology in the palm of your hand.
852 parts5 - 2 layers76.2 × 42 mm
Connectors board
SolderedElectronics/Soldered-Inkplate-4-TEMPERA-with-glass-panel-hardware-design
Inkplate 4 TEMPERA is an easy-to-use, all-in-one device that puts the power of e-paper technology in the palm of your hand.
27 parts5 - 2 layers92.2 × 168 mm
Connectors board
SolderedElectronics/Soldered-Inkplate-4-TEMPERA-with-glass-panel-hardware-design
Inkplate 4 TEMPERA is an easy-to-use, all-in-one device that puts the power of e-paper technology in the palm of your hand.
116 parts5 - 2 layers65 × 65 mm
Project pcba
iihij/buzz-car-line-follower
ESP32-C6 line-following robot (ECE 3011, Georgia Tech). Custom IR/LM339N comparator sensor board (EasyEDA) and KiCad main carrier PCB with DRV8833 motor drive, dual OLED eyes, and NeoPixel.
16 parts - 4 layers49.1 × 15.5 mm
Programmer Board
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
58 parts1MIT - 2 layers160 × 100 mm
RedPitaya Lockbox
TU-Darmstadt-APQ/RedPitaya-Lockbox
Digital controller for laser frequency stabilization based on the RedPitaya STEMlab 125-14 board
110 parts40 - 4 layers70 × 70 mm
Programmer Shell Module
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
11 parts1MIT - 6 layers85 × 85 mm
Controller Board
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
298 parts1MIT - 4 layers54 × 29.5 mm
Shell Module BUS
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
11 parts1MIT - 4 layers54 × 29.5 mm
Shell Module DAISY
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
11 parts1MIT - 6 layers13 × 13 mm
Core Module Intel
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
27 parts1MIT - 4 layers13 × 13 mm
Sensor Module
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
34 parts1MIT - 6 layers13 × 13 mm
Core Module
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
56 parts1MIT - 4 layers85 × 15.7 mm
VoxSense
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
94 parts1MIT - 2 layers85 × 38.2 mm
Programmer Sensor Stencil
MichalVarsanyi/VoxLink
VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.
152 parts1MIT