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Boards using the TLV9062ID

10 boards

Boards in 10 GitHub repositories, designed in KiCad, that use the TLV9062ID by Texas Instruments (-40℃~+125℃ 0.05pA 0.5pA 1.6mV 1.8V~5.5V 103dB 10MHz 10nV/√Hz@1kHz 2 50mA 530nV/℃ 538uA 6.5V/us Enable/shutdown function、ESD protection、EMI filtering/RF suppression Rail-to-Rail Input, Rail-to-Rail Output SOIC-8 Operational Amplifier ROHS). See how each wires it, with its parts, size, README and files; the TLV9062ID’s symbol, footprint and pinout are on its own page.

  • 4 layers100 × 100 mmDeneme2, the printed circuit board in 3D

    Deneme2

    Gokasimov/STM32-FOC-Control

    A completely from-scratch, bare-metal implementation of Field-Oriented Control (FOC) tailored for ultra-low inductance (3 µH) drone motors (e.g., A2212).

    118 parts2MIT
  • 2 layers72 × 133 mmLoFence, the printed circuit board in 3D

    LoFence

    Alex9779/LoFence_Hardware

    The LoFence V2 PCB is designed with KiCad.

    73 parts1
  • 4 layers60 × 60 mm数控buck, the printed circuit board in 3D

    数控buck

    JasonClock/CNC_Buck

    78 parts1
  • 4 layers49 × 30.5 mmCowloc adsb i, the printed circuit board in 3D

    Cowloc adsb i

    Agilack/cowloc-adsb-i

    An ADS-B receiver module

    83 parts
  • 2 layers89.4 × 66.9 mmE foc, the printed circuit board in 3D

    E foc

    embedded-pro/e-foc-hardware

    hardware to be used with https://github.com/embedded-pro/e-foc

    186 parts
  • 2 layers76 × 53 mmVI Converter MOSFET, the printed circuit board in 3D

    VI Converter MOSFET

    Hawk453/VI_Converter_MOSFET

    PCB of VI Converter with MOSFET

    10 partsGPL-3.0
  • 4 layers52 × 46 mmRouted final, the printed circuit board in 3D

    Routed final

    MLeggiero/taxelscan

    TaxelScan reads a 16 × 32 pressure surface (512 taxels) at 80 frames per second by default and has been measured at 200 fps.

    27 partsMIT
  • 4 layers40.5 × 60 mmEs8390-breakout, the printed circuit board in 3D

    Es8390-breakout

    wemaxon/es8390-breakout

    ES8390 Breakout Board with Class-D Amplifier, Line-Out/Headphone and Line-In

    65 parts
  • 2 layers100 × 115 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    7 parts