4 layers80 × 50.5 mm
Boards using the USBLC6-2SC6
16 boardsBoards in 6 GitHub repositories, designed in KiCad, that use the USBLC6-2SC6 by STMicroelectronics (-40℃~+125℃ 150nA 17V 2 3.5pF 5.25V 5A 6V ESD IEC 61000-4-2 Unidirectional SOT-23-6L ESD and Surge Protection (TVS/ESD) ROHS). See how each wires it, with its parts, size, README and files; the USBLC6-2SC6’s symbol, footprint and pinout are on its own page.
- 4 layers33.5 × 66.8 mm
Net bmp
elagil/net-bmp
An Ethernet-connected SWD/JTAG debug adapter (blackmagic probe)
97 parts3GPL-3.0 - 4 layers42 × 65 mm
Icarus Flight Computer
daedalus-ind/icarus-hardware
Hardware of the onboard flight computer for the Icarus rocket.
106 parts2MIT - 4 layers43.7 × 40.9 mm
Adam's Drone FCU
hackclub/OnBoard
💡 Join 1,000 teenagers and make your first PCB with a $100 grant!
82 parts915 - 4 layers130 × 90 mm
Final chain
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
206 parts3MIT - 4 layers112 × 60 mm
Pluto cal switch
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
77 parts3MIT - 4 layers50 × 71 mm
Pluto rx2 8way
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
68 parts3MIT - 4 layers130 × 90 mm
Programmable usb2 hub
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
218 parts3MIT - 4 layers130 × 90 mm
Route
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
83 parts3MIT - 4 layers110 × 90 mm
Usb hub 3s
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
116 parts3MIT - 4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
116 parts3MIT - 4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
104 parts3MIT - 4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
119 parts3MIT - 4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
114 parts3MIT - 4 layers130 × 90 mm
Usb hub 3s v4
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
95 parts3MIT - 4 layers76.5 × 76.9 mm
