Dev board

12 boards

KiCad boards from 8 GitHub repositories tagged “dev-board”, the most starred first; open any of them in PCBKit.

2 layers50 × 35 mm
ESP32 Dev Board
ProZSolutions/ESP32_Dev_Board
ESP32-WROOM-32U Development Board (KiCad)
19 parts7GPL-3.0
4 layers17.8 × 50.8 mm
Ice40-dip40
esynr3z/ice40-dip40
Lattice iCE40 Ultra/Ultra+ breakout DIP40-like board
47 parts5
4 layers65 × 30 mm
Faux pi-0
DLehenbauer/faux-pi-zero
RP2040 dev board in a Raspberry Pi Zero compatible form factor. Includes DVI and SD Card.
63 parts4
4 layers85.1 × 50.2 mm
AuroraF4
aleko-khomasuridze/AuroraF4
AuroraF4 is a high-performance development board based on the STM32F407VGT6 microcontroller, featuring peripherals like I2C, SPI, UART, and GPIO for versatile applications.
76 parts3
4 layers257 × 117.5 mm
Teacup carrier
thingino/teacup-neo
Universal Ingenic SoC development platform: one carrier + per-SoC interposer modules (T10 through A1, any package) on a DDR4 card edge, with an ESP32-S3 BMC for autonomous LLM-driven development.
157 parts1GPL-3.0
4 layers132.2 × 188.4 mm
SparkFun IoT Node LoRaWAN panelized
sparkfun/SparkFun_IoT_Node_LoRaWAN
Hardware Repository for the SparkFun IoT Node - LoRaWAN Development board
971 parts
2 layers25.4 × 50.8 mm
SparkFun Pico Add On Flipper
sparkfun/SparkFun_Pico_Add_On_Flipper
Hardware design for the SparkFun Pico Add On Flipper Board for XRP
109 parts
4 layers68.6 × 53.3 mm
FPGA TB
vlntnmrx/ICECream
FPGA Dev-Board with ICE40UP5K and audio processing capabilities
111 partsApache-2.0
4 layers133.4 × 31.3 mm
Teacup interposer
thingino/teacup-neo
Universal Ingenic SoC development platform: one carrier + per-SoC interposer modules (T10 through A1, any package) on a DDR4 card edge, with an ESP32-S3 BMC for autonomous LLM-driven development.
35 parts1GPL-3.0
4 layers133.4 × 31.3 mm
Teacup interposer t41
thingino/teacup-neo
Universal Ingenic SoC development platform: one carrier + per-SoC interposer modules (T10 through A1, any package) on a DDR4 card edge, with an ESP32-S3 BMC for autonomous LLM-driven development.
61 parts1GPL-3.0
4 layers86.2 × 56.2 mm
Teacup t41
thingino/teacup-neo
Universal Ingenic SoC development platform: one carrier + per-SoC interposer modules (T10 through A1, any package) on a DDR4 card edge, with an ESP32-S3 BMC for autonomous LLM-driven development.
123 parts1GPL-3.0
4 layers59 × 79.5 mm
SparkFun IoT Node LoRaWAN
sparkfun/SparkFun_IoT_Node_LoRaWAN
Hardware Repository for the SparkFun IoT Node - LoRaWAN Development board
242 parts