Skip to the content

Boards by misko

46 boards

Open-source boards designed in KiCad by misko on GitHub, from 1 repository. A board’s address here is its repository’s there.

  • 4 layers220 × 120 mmCandidate filled profile, the printed circuit board in 3D

    Candidate filled profile

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    569 parts3MIT
  • 4 layers200 × 100 mmCarrier, the printed circuit board in 3D

    Carrier

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    142 parts3MIT
  • 4 layers220 × 120 mmConnector fit prototype, the printed circuit board in 3D

    Connector fit prototype

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    11 parts3MIT
  • 2 layers40 × 40 mmCook loadcell, the printed circuit board in 3D

    Cook loadcell

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    33 parts3MIT
  • 2 layers55 × 45 mmCook loadcell, the printed circuit board in 3D

    Cook loadcell

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    33 parts3MIT
  • 4 layers252 × 92 mmCooksense, the printed circuit board in 3D

    Cooksense

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    195 parts3MIT
  • 4 layers188 × 92 mmCooksense, the printed circuit board in 3D

    Cooksense

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    226 parts3MIT
  • 4 layers156 × 100 mmCrow audio carrier v1, the printed circuit board in 3D

    Crow audio carrier v1

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    340 parts3MIT
  • 2 layers94.5 × 44.5 mmCrow mic pod, the printed circuit board in 3D

    Crow mic pod

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    40 parts3MIT
  • 2 layers60 × 40 mmCrow mic pod v3, the printed circuit board in 3D

    Crow mic pod v3

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    44 parts3MIT
  • 4 layers65 × 42 mmCrowsync recorder, the printed circuit board in 3D

    Crowsync recorder

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    55 parts3MIT
  • 2 layers90 × 70 mmEsp32 laser timing, the printed circuit board in 3D

    Esp32 laser timing

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    76 parts3MIT
  • 6 layers176 × 122 mmRoute, the printed circuit board in 3D

    Route

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    238 parts3MIT
  • 4 layers130 × 90 mmFinal chain, the printed circuit board in 3D

    Final chain

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    206 parts3MIT
  • 2 layers54 × 46 mmFinal chain, the printed circuit board in 3D

    Final chain

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    27 parts3MIT
  • 4 layers90 × 65 mmFinal chain, the printed circuit board in 3D

    Final chain

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    37 parts3MIT
  • 2 layers60 × 40 mmObserved board, the printed circuit board in 3D

    Observed board

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    44 parts3MIT
  • 4 layers150 × 120 mmPi usb port switch, the printed circuit board in 3D

    Pi usb port switch

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    197 parts3MIT
  • 4 layers112 × 60 mmPluto cal switch, the printed circuit board in 3D

    Pluto cal switch

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    77 parts3MIT
  • 4 layers50 × 71 mmPluto rx2 8way, the printed circuit board in 3D

    Pluto rx2 8way

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    68 parts3MIT
  • 4 layers85 × 78 mmPod, the printed circuit board in 3D

    Pod

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    35 parts3MIT
  • 4 layers130 × 90 mmProgrammable usb2 hub, the printed circuit board in 3D

    Programmable usb2 hub

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    218 parts3MIT
  • 4 layers185 × 120 mmR1b, the printed circuit board in 3D

    R1b

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    182 parts3MIT
  • 2 layers80 × 45 mmRoute, the printed circuit board in 3D

    Route

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    39 parts3MIT