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4 layers220 × 120 mmCandidate filled profile, the printed circuit board in 3D

Candidate filled profile

misko/prompt2device3

The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

Size
220 × 120 mm
Copper layers
4
Thickness
1.63 mm
Parts
569
Nets
428
Pads
1,872
Tracks, vias
22, 17
Pours
9
Routed
Yes
KiCad
KiCad 10.0 (file 20260206)
Created
16 Jul 2026
Updated
3 Nov 2026

Overview

Candidate filled profile is an open-source printed circuit board by misko, from the misko/prompt2device repository on GitHub, published under the MIT licence. It is a 4-layer board of 220 × 120 mm with 569 parts on 428 nets, routed with 22 tracks and 17 vias.

It is built around the OPA2320AIDRGR, TPS62822DLCR and TLV320ADC6140IRTWT, with the RC0402FR-07100KL, RT0402BRD0710KL and CC0805KRX7R9BB104 among its other parts.

Main components

12

README

README.md

prompt2device

The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

The Crow carrier + pod public design package provides native designs and fabrication exports for the 5-carrier/10-pod prototype batch. It is a subset of the local sealed release, not order authorization.

Prompt to device: give an agent a plain-language hardware brief, work through explicit design, review, and physical-test cycles, and finish with the artifacts needed to manufacture the device—not merely a plausible CAD image.

Quick start

1. Give the PCB skill a brief

text
/pcb-design 3S LiPo input → 4× USB-A outputs at 5 V / 1.5 A each + 1× USB-C output at 5 V / 5 A.

2. See fabricated examples

These two projects show the path from a plain-English request to electrical CAD, mechanical CAD, and fabricated hardware. The prompt cells preserve the compact original wording; the links retain the corresponding design-lineage records. Photographs are bench evidence, not production-qualification claims. Exact provenance and claim limits are in fabricated-examples.md.

pluto-rx2-8way-v5 is the fabricated eight-way RF switch board. Its immutable PCB design archive is v0.2.1-2026-08-14, with a sealed 3D PCB render, and its independently versioned v0.8.0-2026-08-28 enclosure has a corresponding installed-assembly render. That enclosure remains an honest INCOMPLETE candidate pending sliced and printed fit, retention, connector-service, and thermal tests. The PCB archive itself predates fabrication and still records DO-NOT-ORDER; RF first-article measurements remain open. The current human-readable engineering study is RF isolation, leakage paths, and a v6 mitigation strategy.

usb-hub-3s-v3 is the closest existing hardware to the quick-start brief: three USB-A outputs and one USB-C output rather than four USB-A outputs. Its latest sealed and fabricated archive is v1.12-2026-07-28. The bring-up journal records physical v1.12 boards and the replacement assembly's successful no-load regulation checks; full load, transient, and thermal qualification is still open.

The exact v1.12 board also has an independently versioned v0.4.0-2026-08-28 enclosure with a corresponding installed-assembly render. Its authored source and replay instructions remain mutable, while the release is an immutable INCOMPLETE candidate: structural and collision screens pass, but printed fit, connector service, retention, and thermal evidence remain open.

3. Follow the prompt-to-device loop

text
plain-language brief
  → fact locks and architecture
  → schematic, placement, routing, and enclosure development
  ↺ independent review, correction, regeneration, and measurement
  → sealed fabrication and mechanical artifacts
  → first article, physical findings, and the next development cycle

Today the governed output can include:

  • native KiCad schematics and a rendered schematic PDF;
  • the routed KiCad PCB plus Gerbers, drill files, BOM, and CPL for fabrication;
  • top, bottom, and 3D PCB renders plus a STEP assembly;
  • when mechanical work is selected, enclosure source, printable STLs, assembly renders, and clearance evidence; and
  • governed Markdown investigations under each project's 01_docs/reports/.

The pipeline already uses board-level CAD/assembly twins as verification instruments. Governed firmware releases and an integrated product-level digital twin are forward work, tracked by IMP-234 and IMP-236.

What this repository is

prompt2device is a code-first prompt-to-device engineering system. It turns a user brief into generated KiCad source, bounded routing candidates, independently graded fabrication evidence, immutable releases, printable enclosures, and measured first-article records.

The product is the workflow under skills/. Boards under projects/ are its active applications; sealed release folders are immutable evidence, not templates to copy.

Manual commissioning

Clone the repository, create a branch, and save the user's original request as a UTF-8 text file:

bash
git clone https://github.com/misko/prompt2device.git
cd prompt2device
git switch -c codex/my-board

Create the governed project scaffold and choose its capability profile:

bash
python3 skills/pcb-design/scripts/commission_project.py my-board \
  --brief-file /path/to/original-brief.txt \
  --signal-integrity ordinary \
  --assembly jlcpcb \
  --firmware forbidden \
  --target design

Use high_speed_digital for USB and similar controlled digital links. Use rf only when the board intentionally carries RF/microwave signals. Add --foreign-mating when the floorplan consumes geometry from third-party hardware. Run the command with --help for enclosure and target options. Here --assembly jlcpcb selects the populated JLCPCB PCBA evidence path, not merely bare-board fabrication.

The command reports PCB-SCAFFOLD OK and leaves PCB-COMMISSION explicitly INCOMPLETE. It preserves the prompt and creates an executable commission hold; it does not accept requirements, adopt the seeded schema examples, or run a board producer.

Inspect the selected lifecycle before spending engineering time:

bash
python3 skills/pcb-design/scripts/skill_reference_router.py \
  --profile projects/my-board/01_docs/capability-profile.json \
  --at-stage PCB-COMMISSION \
  --json

Then give Codex this instruction:

text
Read and follow skills/pcb-design/SKILL.md for projects/my-board. Preserve the
original brief, close the commission fact locks, and stop at the first evidence
or operator checkpoint. Do not create firmware unless the brief explicitly
asks.

Do not run rebuild_all.sh yet. The scaffold contains visible schema examples and 01_docs/COMMISSIONING-HOLD.md; both rebuild conductors refuse to run until the commission boundary is reviewed and that marker is deliberately removed.

Start with skills/pcb-design/SKILL.md. Its canonical lifecycle and runnable command map is execution-graph.md.

How execution is structured

The repository deliberately separates three layers:

text
capability profile
  -> disclosure graph (what stages/references are selected)
  -> project conductor (what bounded commands actually run)
  -> owning gates (what exact subjects passed)
  -> review/seal/publication/physical claims
  • The router is planning only. Its output is never execution evidence.
  • projects/<name>/03_src/rebuild_all.sh is the full source/schematic conductor. It intentionally pauses at review and operator checkpoints.
  • rebuild_reuse.sh is the deterministic route-authority replay when the schematic is unchanged; route.yaml selects the authenticated source.
  • Fresh route exploration is a separate candidate workflow; canonical rebuild replays the authenticated route source selected by route.yaml.
  • Layout seal, PCB release seal, publication, ordering, and first article are different claims with different owners.

The declarative lifecycle is:

text
commission -> architecture -> sourcing
  -> schematic -> placement -> routing -> layout seal
  -> fabrication -> assembly verification
  -> release review -> release seal
  -> publication | first article -> production

RF context/source/realized/fabrication stages and foreign-mating import are conditional branches. High-speed digital composes inside the ordinary stages. Enclosures have an implemented parallel INCOMPLETE-candidate release stream and may bind an unchanged PCB release without resealing it. Higher readiness still requires the enclosure skill's recomputable CAD and physical evidence. Firmware is currently an explicit handoff, not a governed release stream; IMP-234 tracks that missing boundary.

Skills and authority

SkillOwns
pcb-designCommission, lifecycle composition, backtracking, reviews, release seal, publication, first article.
kicad-pcbTSX/KiCad schematic conversion, netlist/parity, placement, geometry, routing, DRC, SI/RF realization.
jlcpcb-fabGerber/drill/BOM/CPL, stock/population/rotation, JLC CAD twin, manufacturer staging, bring-up cards.
pcb-enclosureMechanical commission, PCB interface binding, independent fasteners, motion/clearance, mesh/physical evidence, enclosure releases.
shopping-listProvenance-bound purchase lists for self-supplied parts.

Authority is singular. A skill links to another owner's procedure rather than copying it. Project contracts.md files own exact artifact membership. Script --help text owns exact flags. improvements.md tracks work and rationale but never overrides an executable gate or accepted ADR.

Repository map

PathPurpose
skills/Reusable workflow, references, tools, and project templates.
projects/Active boards, including manufactured and still-evolving designs.
archived_projects/Retired scaffolds and frozen regression/history units.
docs/Documentation index, accepted ADRs, measured proof, and historical context.
tests/Clean and known-bad fixtures proving gates can both pass and fail.
external_hardware/Measured/cited facts about foreign devices this repo must mate with.
improvements.mdForward work registry and retained improvement history.

See docs/README.md for the documentation authority map.

Design model

The board is generated from committed human-owned source:

  • TSX/tscircuit is the standard schematic authoring front end.
  • Shared scripts convert the circuit, generate KiCad geometry/rules, and grade exact identities. Per-board source is configuration, not a copied backend.
  • KiCad's Python API owns geometry and saves; kicad-cli owns headless ERC/DRC/netlist/export checks.
  • Routing operates on immutable candidates. Only a clean, independently graded candidate can become the promoted route chain.
  • Generated 04_kicad/ is a mutable current snapshot and is never hand-source authority. Immutable history lives under release streams.

This makes design changes diffable and rebuildable. It also means a generator defect can become a physical defect, so freshness, parity, nonzero coverage, registered models, and independent review are first-class gates.

Claims and releases

A release is an immutable reviewed candidate archive. It is not automatically an order event. A design can be electrically sound and sealed while remaining DO-NOT-ORDER because stock, uploader selections, physical fit, or first- article evidence is owed.

PCB and enclosure versions are independent streams. Current enclosure release tooling publishes immutable INCOMPLETE candidates bound to one exact PCB release without forcing that PCB to be resealed; it does not yet publish a higher readiness claim from caller-supplied scope status. A future firmware stream, exact product lock, and integrated product-level digital twin remain tracked work, not current release authority.

Toolchain

Core documentation and planning use normal Python 3. KiCad operations require the KiCad-bundled Python where import pcbnew succeeds plus kicad-cli. TSX generation requires the pinned tscircuit/Bun environment. Fresh routing requires the configured KiCadRoutingTools installation; replaying a selected authenticated route authority does not.

Python entry points expose --help; shell-conductor forms are documented in the execution graph. Use the owning current command rather than copying an old invocation from a project journal.

Validate a workflow change

At minimum:

bash
python3 skills/pcb-design/scripts/skill_authority_check.py
python3 tests/t1_skill_progressive_disclosure.py
python3 tests/t1_pcb_documentation.py
python3 scripts/contracts_audit.py --walk --root skills/pcb-design

Run the domain suites affected by the change, then commit at a green boundary.

License

Except where otherwise noted, all original content in this repository is licensed under the MIT License. This includes software, documentation, prompts, schematics, PCB layouts, mechanical CAD files, and generated design artifacts.

Third-party materials remain subject to their respective copyright and license terms and are not relicensed by this repository.

See third-party notices for material provenance and contribution guidelines for new submissions.

Parts

569
QtyValueFootprintReferences
80100nFCapacitor_SMD:C_0402_1005MetricC_1V8_OK_VDD, C_ADC_3V3X_OK_VDD, C_ADC_A_AREG_100N, C_ADC_A_AVDD_100N, C_ADC_A_DREG_100N, C_ADC_A_IOVDD_100N, C_ADC_A_VREF_100N, C_ADC_B_AREG_100N, C_ADC_B_AVDD_100N, C_ADC_B_DREG_100N, C_ADC_B_IOVDD_100N, C_ADC_B_VREF_100N, C_ADC_CLOCK_OK, C_ADC_DIGITAL_BAD, C_ADC_DIGITAL_OK, C_ADC_I2C_A +64
44100kΩResistor_SMD:R_0402_1005MetricR_1V8_FB_BOTTOM, R_1V8_OK_BOT, R_ADC_1V8_OK_BOT, R_ADC_3V3X_OK_BOT, R_ADC_CLOCK_OK_PD, R_ADC_DATA_PD, R_ADC_DELAY_GATE_PD, R_ADC_DIG_RST_PD, R_ADC_OK_BOT, R_ADC_PWR_BAD_PD, R_ADC_READY_PD, R_ADC_START_DELAY, R_AUDIO_PD, R_B1N, R_B1P, R_B2N +28
4210kΩResistor_SMD:R_0402_1005MetricR_ADC_DIGITAL_OK_PU, R_ADC_OK_PU, R_ADC_PD1N, R_ADC_PD1P, R_ADC_PD2N, R_ADC_PD2P, R_ADC_PD3N, R_ADC_PD3P, R_ADC_PD4N, R_ADC_PD4P, R_ADC_PD5N, R_ADC_PD5P, R_ADC_PD6N, R_ADC_PD6P, R_ADC_PD7N, R_ADC_PD7P +26
4247uFcrow_usb_power_aux:Murata_GRM32E_1210C_ADC_AC1N1, C_ADC_AC1N2, C_ADC_AC1P1, C_ADC_AC1P2, C_ADC_AC2N1, C_ADC_AC2N2, C_ADC_AC2P1, C_ADC_AC2P2, C_ADC_AC3N1, C_ADC_AC3N2, C_ADC_AC3P1, C_ADC_AC3P2, C_ADC_AC4N1, C_ADC_AC4N2, C_ADC_AC4P1, C_ADC_AC4P2 +26
4015nFCapacitor_SMD:C_0805_2012MetricC_DUMP_TIME1, C_DUMP_TIME2, C_DUMP_TIME3, C_DUMP_TIME4, C_DUMP_TIME5, C_DUMP_TIME6, C_DUMP_TIME7, C_DUMP_TIME8, C_FILTER1N1, C_FILTER1N2, C_FILTER1P1, C_FILTER1P2, C_FILTER2N1, C_FILTER2N2, C_FILTER2P1, C_FILTER2P2 +24
191nFCapacitor_SMD:C_0402_1005MetricC_ADC_CM1N, C_ADC_CM1P, C_ADC_CM2N, C_ADC_CM2P, C_ADC_CM3N, C_ADC_CM3P, C_ADC_CM4N, C_ADC_CM4P, C_ADC_CM5N, C_ADC_CM5P, C_ADC_CM6N, C_ADC_CM6P, C_ADC_CM7N, C_ADC_CM7P, C_ADC_CM8N, C_ADC_CM8P +3
17100nFCapacitor_SMD:C_0805_2012MetricC_IN_HF, C_SPOKE_IN1, C_SPOKE_IN2, C_SPOKE_IN3, C_SPOKE_IN4, C_SPOKE_IN5, C_SPOKE_IN6, C_SPOKE_IN7, C_SPOKE_IN8, C_SPOKE_OUT1, C_SPOKE_OUT2, C_SPOKE_OUT3, C_SPOKE_OUT4, C_SPOKE_OUT5, C_SPOKE_OUT6, C_SPOKE_OUT7 +1
17300ΩResistor_SMD:R_0402_1005MetricR_LDO_ILIM, R_X1N, R_X1P, R_X2N, R_X2P, R_X3N, R_X3P, R_X4N, R_X4P, R_X5N, R_X5P, R_X6N, R_X6P, R_X7N, R_X7P, R_X8N +1
1610ΩResistor_SMD:R_0402_1005MetricR_OUT1N, R_OUT1P, R_OUT2N, R_OUT2P, R_OUT3N, R_OUT3P, R_OUT4N, R_OUT4P, R_OUT5N, R_OUT5P, R_OUT6N, R_OUT6P, R_OUT7N, R_OUT7P, R_OUT8N, R_OUT8P
161uFCapacitor_THT:C_Rect_L7.2mm_W5.0mm_P5.00mmC_A1N, C_A1P, C_A2N, C_A2P, C_A3N, C_A3P, C_A4N, C_A4P, C_A5N, C_A5P, C_A6N, C_A6P, C_A7N, C_A7P, C_A8N, C_A8P
16470uFcrow_usb_analog:Panasonic_EEEFK1A471P_8x10.2_ExactC_HOLD1, C_HOLD2, C_HOLD3, C_HOLD4, C_HOLD5, C_HOLD6, C_HOLD7, C_HOLD8, C_HOLD9, C_HOLD10, C_HOLD11, C_HOLD12, C_HOLD13, C_HOLD14, C_HOLD15, C_HOLD16
16680pFCapacitor_SMD:C_0402_1005MetricC_FB1N, C_FB1P, C_FB2N, C_FB2P, C_FB3N, C_FB3P, C_FB4N, C_FB4P, C_FB5N, C_FB5P, C_FB6N, C_FB6P, C_FB7N, C_FB7P, C_FB8N, C_FB8P
1410uFCapacitor_SMD:C_0805_2012MetricC_ADC_A_AVDD_10U, C_ADC_A_IOVDD_10U, C_ADC_A_VREF_10U, C_ADC_B_AVDD_10U, C_ADC_B_IOVDD_10U, C_ADC_B_VREF_10U, C_U_1V8_IN_1, C_U_1V8_IN_2, C_U_3V3X_IN_1, C_U_3V3X_IN_2, C_U_CORE_IN_1, C_U_CORE_IN_2, C_VMID1_EXT_10U, C_VMID2_EXT_10U
121uFCapacitor_SMD:C_0603_1608MetricC_ADC_A_AREG_1U, C_ADC_A_DREG_1U, C_ADC_B_AREG_1U, C_ADC_B_DREG_1U, C_AUDIO_CT1, C_AUDIO_CT2, C_PWR_CT, C_PWR_CT2, C_PWR_CT3, C_VCC, C_VMID1_EXT_1U, C_VMID2_EXT_1U
1010nFCapacitor_SMD:C_0402_1005MetricC_AUDIO_OSC, C_CORE_EN_CT, C_SPOKE_DVDT1, C_SPOKE_DVDT2, C_SPOKE_DVDT3, C_SPOKE_DVDT4, C_SPOKE_DVDT5, C_SPOKE_DVDT6, C_SPOKE_DVDT7, C_SPOKE_DVDT8
101MΩResistor_SMD:R_0402_1005MetricR_SPOKE_UVLO1, R_SPOKE_UVLO2, R_SPOKE_UVLO3, R_SPOKE_UVLO4, R_SPOKE_UVLO5, R_SPOKE_UVLO6, R_SPOKE_UVLO7, R_SPOKE_UVLO8, R_VBUS_BE, R_XTAL_FB
10TPD2E2U06DRLRcrow_usb_analog:TI_DRL0005A_TPD2E2U06U_ESD1, U_ESD2, U_ESD3, U_ESD4, U_ESD5, U_ESD6, U_ESD7, U_ESD8, U_USB_CC_ESD, U_USB_VBUS_ESD
844.2kΩcrow_usb_analog:Yageo_RT0603_NominalBodyR_SPOKE_ILIM1, R_SPOKE_ILIM2, R_SPOKE_ILIM3, R_SPOKE_ILIM4, R_SPOKE_ILIM5, R_SPOKE_ILIM6, R_SPOKE_ILIM7, R_SPOKE_ILIM8
8615008160221crow_usb_analog:Wurth_615008160221_RJ45J1, J2, J3, J4, J5, J6, J7, J8
8OPA2320AIDRPackage_SO:SOIC-8_3.9x4.9mm_P1.27mmU_AFE1, U_AFE2, U_AFE3, U_AFE4, U_AFE5, U_AFE6, U_AFE7, U_AFE8
8TMUX4827YBHRcrow_usb_analog:TI_YBH0009_C02_TMUX4827U_ISO1, U_ISO2, U_ISO3, U_ISO4, U_ISO5, U_ISO6, U_ISO7, U_ISO8
8TPS26625DRCRcrow_usb_analog:TI_DRC0010J_VSON10U_SPOKE1, U_SPOKE2, U_SPOKE3, U_SPOKE4, U_SPOKE5, U_SPOKE6, U_SPOKE7, U_SPOKE8
7TPS389001DSERcrow_usb_analog:TI_DSE0006A_ExactU_1V8_OK, U_ADC_1V8_OK, U_ADC_3V3X_OK, U_ADC_OK, U_AUDIO, U_PWR, U_XU_3V3_OK
51kΩResistor_SMD:R_0603_1608MetricR_LDO_PG_BOT_B, R_VMID1_BOT, R_VMID1_TOP, R_VMID2_BOT, R_VMID2_TOP
52N7002K-7crow_usb_analog:Diodes_2N7002K_SOT23_ExactQ_ADC_DELAY_DISCH, Q_ADC_DIG_RST, Q_ADC_PWR_RST, Q_PRE_EN, Q_RST1
54.7kΩResistor_SMD:R_0402_1005MetricR_ADC_I2C_SCL_A_PU, R_ADC_I2C_SCL_B_PU, R_ADC_I2C_SDA_A_PU, R_ADC_I2C_SDA_B_PU, R_QSPI_CS
4SN74LVC1G04DCKRcrow_usb_digital:TI_DCK0005A_SC70_5U_ADC_DIGITAL_BAD, U_ADC_PWR_BAD, U_ADC_READY_BAD, U_BCLK_INV
310kΩResistor_SMD:R_0603_1608MetricR_ADC_BOT, R_LDO_PG_BOT_A, R_PWR_BOT
310uFCapacitor_SMD:C_1210_3225MetricC_IN1, C_IN2, C_IN3
3120pFCapacitor_SMD:C_0402_1005MetricC_1V8_FF, C_3V3X_FF, C_CORE_FF
3169kΩResistor_SMD:R_0402_1005MetricR_ADC_3V3X_OK_TOP, R_ADC_OK_TOP, R_XU_3V3_OK_TOP
3AO3400APackage_TO_SOT_SMD:SOT-23Q_DUMP, Q_TDM_GATE, Q_VBUS
3TPS62822DLCRcrow_usb_digital:TI_DLC0008B_VSON_HR8U_1V8, U_3V3X, U_CORE
3XFL4015-471MECcrow_usb_digital:Coilcraft_XFL4015_471MECL_U_1V8, L_U_3V3X, L_U_CORE
2100ΩResistor_SMD:R_0402_1005MetricR_OPA_BLEED1, R_OPA_BLEED2
222pFCapacitor_SMD:C_0402_1005MetricC_XTAL_IN, C_XTAL_OUT
233ΩResistor_SMD:R_0402_1005MetricR_BCLK, R_FSYNC
25.1kΩResistor_SMD:R_0402_1005MetricR_USB_CC1, R_USB_CC2
252.3kΩResistor_SMD:R_0402_1005MetricR_1V8_OK_TOP, R_ADC_1V8_OK_TOP
274LVC1G14GV,125Package_TO_SOT_SMD:SOT-23-5U_DUMP, U_LDO_EN
2SN74LVC1G125DCKTcrow_usb_digital:TI_DCK0005A_SC70_5U_ADC_CLOCK_OK, U_ADC_READY
2SN74LVC2G74DCTRcrow_usb_digital:TI_DCT0008A_SM8U_FSYNC_FF1, U_FSYNC_FF2
2TLV320ADC6140IRTWTcrow_usb_analog:TI_RTW0024A_WQFN24_4x4_EP2.6U_ADC_A, U_ADC_B
10451004.MRLcrow_usb_power_aux:Littelfuse_451_Nano2_2410F_IN
10ΩResistor_SMD:R_0402_1005MetricR_AGND_JOIN
1100kΩResistor_SMD:R_0603_1608MetricR_3V3X_FB_BOTTOM
113kΩResistor_SMD:R_0402_1005MetricR_RT
117.4kΩResistor_SMD:R_0603_1608MetricR_ADC_TOP
11uFCapacitor_SMD:C_0402_1005MetricC_PLL_1U
11ΩResistor_SMD:R_1206_3216MetricR_DUMP
1210kΩResistor_SMD:R_0402_1005MetricR_1V8_FB_TOP
1220nFCapacitor_SMD:C_0603_1608MetricC_RST_T
122ΩResistor_SMD:R_1206_3216MetricR_PRE
130.9kΩcrow_usb_analog:Yageo_RT0603_NominalBodyR_PWR_TOP
133kΩResistor_SMD:R_0603_1608MetricR_LDO_SET
14.7uFCapacitor_SMD:C_0805_2012MetricC_USB_VBUS
14.7uFCapacitor_SMD:C_0603_1608MetricC_LDO_NR4
140.2kΩResistor_SMD:R_0402_1005MetricR_BUCK_FB_TOP
143650-0200crow_usb_power_aux:Molex_43650-0200J_PWR
1453kΩResistor_SMD:R_0603_1608MetricR_3V3X_FB_TOP
1470nFCapacitor_SMD:C_0603_1608MetricC_ADC_START_DELAY
147kΩResistor_SMD:R_0402_1005MetricR_USB_VBUS_BLEED
149.9kΩResistor_SMD:R_0402_1005MetricR_CORE_FB_TOP
1680ΩResistor_SMD:R_0402_1005MetricR_XTAL_DRIVE
1AO3401APackage_TO_SOT_SMD:SOT-23Q_PRE
1B340A-13-FDiode_SMD:D_SMAD_HOLD
1BLM15AG601SN1DInductor_SMD:L_0402_1005MetricFB_PLL
1BZT52C12-13-FDiode_SMD:D_SOD-123D_QIN_GS
1DMP6023LFG-13crow_usb_power_aux:Diodes_DMP6023LFG_PowerDI3333_8Q_IN
1FTSH-105-01-L-DV-Kcrow_usb_digital:Samtec_FTSH_105_01_L_DV_KJ_JTAG
1LT3045EDD#PBFcrow_usb_analog:ADI_LT3045_DD_NoHolesU_LDO
1SMBJ15Acrow_usb_power_aux:Littelfuse_SMBJ15A_SMBD_IN
1SN74AUP3G34DCURcrow_usb_digital:TI_DCU0008A_VSSOP8U_ADC_OUT
1SN74AXC4T245PWRPackage_SO:TSSOP-16_4.4x5mm_P0.65mmU_TDM_XLATE
1SN74LVC1G123DCTRPackage_SO:SSOP-8_2.95x2.8mm_P0.65mmU_RST2
1SN74LVC1G332DBVRPackage_TO_SOT_SMD:SOT-23-6U_FSYNC_OR
1SX5M24.576M20F30TNNcrow_usb_digital:SCTF_SX5M_5032Y_AUDIO
1TCA9406DCURcrow_usb_digital:TI_TCA9406_DCU0008A_VSSOP8U_ADC_I2C_XLATE
1TPD2EUSB30ADRTRPackage_TO_SOT_SMD:Texas_DRT-3U_USB_ESD
1TPS3808G09DBVRPackage_TO_SOT_SMD:SOT-23-6U_CORE_OK

The 563 most common of 569 parts.

More from misko/prompt2device

12
  • 4 layers156 × 100 mmCrow audio carrier v1, the printed circuit board in 3D

    Crow audio carrier v1

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    340 parts3MIT
  • 6 layers176 × 122 mmRoute, the printed circuit board in 3D

    Route

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    238 parts3MIT
  • 4 layers188 × 92 mmCooksense, the printed circuit board in 3D

    Cooksense

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    226 parts3MIT
  • 4 layers130 × 90 mmProgrammable usb2 hub, the printed circuit board in 3D

    Programmable usb2 hub

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    218 parts3MIT
  • 4 layers130 × 90 mmFinal chain, the printed circuit board in 3D

    Final chain

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    206 parts3MIT
  • 6 layers170 × 120 mmRv2 final, the printed circuit board in 3D

    Rv2 final

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    203 parts3MIT
  • 4 layers150 × 120 mmPi usb port switch, the printed circuit board in 3D

    Pi usb port switch

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    197 parts3MIT
  • 4 layers252 × 92 mmCooksense, the printed circuit board in 3D

    Cooksense

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    195 parts3MIT
  • 4 layers150 × 115 mmUsb controlled debug hub 2a, the printed circuit board in 3D

    Usb controlled debug hub 2a

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    190 parts3MIT
  • 4 layers185 × 120 mmR1b, the printed circuit board in 3D

    R1b

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    182 parts3MIT
  • 4 layers130 × 100 mmUsb controlled debug hub, the printed circuit board in 3D

    Usb controlled debug hub

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    175 parts3MIT
  • 4 layers130 × 100 mmUsb controlled debug hub, the printed circuit board in 3D

    Usb controlled debug hub

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    172 parts3MIT

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    System candidate

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    Dial me spinner main

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  • 12 layers230 × 225 mmFast open switch r1.0, the printed circuit board in 3D

    Fast open switch r1.0

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    Can controller

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Questions

How big is the Candidate filled profile PCB?

It measures 220 × 120 mm and has 4 copper layers, 1.63 mm thick.

What parts does the Candidate filled profile use?

569 parts, built around the OPA2320AIDRGR, TPS62822DLCR, TLV320ADC6140IRTWT and RC0402FR-07100KL. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Candidate filled profile KiCad files?

From the misko/prompt2device repository on GitHub, at the commit this page was made from: the board is projects/crow-usb-carrier-v1/01_docs/research/2026-09-25-ti-tps26625-return-trial-sol/candidate_filled_profile.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.

Can I use the Candidate filled profile design in my own project?

Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).