
Microduck Entry 5V R8
ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。
Microduck Power Regen R22 is an open-source printed circuit board by ldcyes, from the ldcyes/OpenDuck repository on GitHub. It is a 4-layer board of 65 × 75 mm with 84 parts on 47 nets, routed with 3,486 tracks and 185 vias.
It is built around the INA226AIDGSR, UCC27511DBVR(UMW) and REF3312AIDBZR, with the TLV76050DBZR-MS, INA300AIDGSR and LM74800QDRRRQ1 among its other parts. Its parts include 31 capacitors, 21 resistors, 9 ICs, 6 connectors and 5 transistors.
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。
打开 Microduck_Power_Regen_R22.kicad_pro;根原理图包含 power.kicad_sch 与 regen.kicad_sch。fp-lib-table、sym-lib-table 和本地 footprints/、符号库随项目交付,不依赖源目录可写。原生 PCB 是本次权威结果;中间生成/路由脚本仅保留过程追踪,不能只运行早期 build.py 覆盖最终板。
| 内容 | 文件 |
|---|---|
| 三页可编辑原理图及浏览版 | Microduck_Power_Regen_R22.kicad_sch、Schematic_R22.pdf、schematic_svg/ |
| 实际板图及叠层 | Microduck_Power_Regen_R22.kicad_pcb、同名 .kicad_pro / .kicad_dru |
| 四层铜 PDF / 前背 SVG | PCB_Copper_R22.pdf、PCB_Front.svg、PCB_Back.svg |
| 正背装配图 | Assembly_Front.svg、Assembly_Back.svg、相应 PNG |
| BOM、源针网及删改映射 | BOM_R22.csv、Pin_to_Net_R22.csv、merge_mapping.json、equivalence_audit.json |
| 安装/焊线/插头/孔位接口 | Board_Interface_R22_Power_Regen.json |
| 制造、保护、承流和验收边界 | Validation_Report.md、Fabrication_Local_Clearances.json、Current_Thermal_Screen.json、DC_Copper_Regen_Loop_Final.json |
| 验证 | drc.json、erc.json、verification/enabled/、final_sha256.json |
只在 SERVO_BUS 和 GND 上合网。保留两域 +3V3、回生 5V、内部 SHUNT / INA / 控制网络的独立性;不能据同名直接合并。主电源 INA226 地址 0x41、回生 INA226 地址 0x42、LM74800、INA300、比较器迟滞、驱动和默认关闭保持源功能。唯一 MPN 替代是有安装实形证据的 J1:SM08B → BM08B,SHR-08V-S / SSH-003T-P0.2-H 及八针网络不变。所有其他 MPN 和值均与现行 R13 两源板逐项核对。
铜图前后层统一使用原生 XY 俯视坐标便于对照;Assembly_Back.svg/PNG 为翻到背面后的镜像装配视图。装配精确编号、坐标和方向以 BOM 与针网表为准。
| Qty | Value | Footprint | References |
|---|---|---|---|
| 17 | 100nF | Capacitor_SMD:C_0603_1608Metric | C4, C5, C6, C7, C8, C10, C11, C12, C15, C102, C103, C104, C105, C107, C108, C109 +1 |
| 6 | 10uF 50V | Capacitor_SMD:C_1210_3225Metric | C13, C14, C16, C17, C18, C19 |
| 4 | 100k | Resistor_SMD:R_0603_1608Metric | R7, R8, R106, R107 |
| 4 | 10R 0.1% | Resistor_SMD:R_0603_1608Metric | R10, R11, R108, R109 |
| 4 | M2 NPTH | MountingHole:MountingHole_2.2mm_M2 | H1, H2, H3, H4 |
| 3 | 22uF 25V X7R | Capacitor_SMD:C_1210_3225Metric | C110, C111, C112 |
| 3 | 680uF 25V 20% | Capacitor_THT:CP_Radial_D10.0mm_P5.00mm | C1, C2, C3 |
| 2 | 60V 2.2mOhm @10V | Microduck_Power_R8:CSD18540Q5B_DNK | Q1, Q2 |
| 1 | +3V3 | Microduck_Brake_R8:WireSignal_0p5mm | P102 |
| 1 | 1.10k 0.1% | Resistor_SMD:R_0603_1608Metric | R9 |
| 1 | 1.25V PRECISION REF | Package_TO_SOT_SMD:SOT-23 | U102 |
| 1 | 1.2k | Resistor_SMD:R_0603_1608Metric | R6 |
| 1 | 10.0k 0.1% | Resistor_SMD:R_0603_1608Metric | R102 |
| 1 | 10k | Resistor_SMD:R_0603_1608Metric | R110 |
| 1 | 17.4k 0.1% | Resistor_SMD:R_0603_1608Metric | R2 |
| 1 | 1k | Resistor_SMD:R_0603_1608Metric | R3 |
| 1 | 1k 0.1% | Resistor_SMD:R_0603_1608Metric | R5 |
| 1 | 1uF 10V | Capacitor_SMD:C_0603_1608Metric | C106 |
| 1 | 2.20M 0.1% | Resistor_SMD:R_0603_1608Metric | R103 |
| 1 | 2.2R | Resistor_SMD:R_0603_1608Metric | R105 |
| 1 | 2.45k 0.1% | Resistor_SMD:R_0603_1608Metric | R1 |
| 1 | 2200uF 16V LOW ESR | Microduck_R22:CP_EEUFR1C222_Horizontal_Clip | C101 |
| 1 | 2mOhm 1% 3W KELVIN | Microduck_Power_R8:WSL2726_Kelvin | RS1 |
| 1 | 2mOhm 1% 3W KELVIN | Microduck_Brake_R8:WSL2726_Kelvin | RS101 |
| 1 | 4.7R | Resistor_SMD:R_0603_1608Metric | R104 |
| 1 | 4S SWITCHED + | Microduck_Power_R8:WirePad_2p4mm_6mm | W1 |
| 1 | 60V BRAKE MOSFET | Microduck_Brake_R8:CSD18540Q5B_DNK | Q101 |
| 1 | 8.38k 0.1% | Resistor_SMD:R_0603_1608Metric | R4 |
| 1 | 80.6k 0.1% | Resistor_SMD:R_0603_1608Metric | R101 |
| 1 | BRAKE CURRENT INA226 0x42 | Microduck_R22:TI_DGS0010A_1p45x0p30 | U105 |
| 1 | BRAKE_ACTIVE_N | Microduck_Brake_R8:WireSignal_0p5mm | P105 |
| 1 | BUS POWERED 5V LDO | Package_TO_SOT_SMD:SOT-23 | U101 |
| 1 | CONTROL 3.3V / RUN DEFAULT OFF | Connector_JST:JST_SH_BM08B-SRSS-TB_1x08-1MP_P1.00mm_Vertical | J1 |
| 1 | GATE SOURCE SINK DRIVER | Package_TO_SOT_SMD:SOT-23-6 | U104 |
| 1 | GND | Microduck_Brake_R8:WireSignal_0p5mm | P101 |
| 1 | GND INPUT | Microduck_Power_R8:WirePad_2p4mm_6mm | W2 |
| 1 | GND OUTPUT | Microduck_Power_R8:WirePad_2p4mm_6mm | W4 |
| 1 | HARDWARE OC LATCH | Microduck_R22:TI_DGS0010A_1p45x0p30 | U4 |
| 1 | I2C_SCL | Microduck_Brake_R8:WireSignal_0p5mm | P104 |
| 1 | I2C_SDA | Microduck_Brake_R8:WireSignal_0p5mm | P103 |
| 1 | IDEAL DIODE + OV CUT | Package_SON:WSON-12-1EP_3x3mm_P0.5mm_EP1.5x2.5mm | U2 |
| 1 | OPEN DRAIN BRAKE STATUS | Package_TO_SOT_SMD:SOT-23 | Q102 |
| 1 | REGEN HYSTERETIC COMPARATOR | Package_TO_SOT_SMD:SOT-23-5 | U103 |
| 1 | RH_LOW | Microduck_Brake_R8:WirePad_2p4mm_6mm | W104 |
| 1 | SERVO 10.8V | Microduck_Power_R8:WirePad_2p4mm_6mm | W3 |
| 1 | SERVO CURRENT / VBUS 0x41 | Microduck_R22:TI_DGS0010A_1p45x0p30 | U3 |
| 1 | SERVO_BUS | Microduck_Brake_R8:WirePad_2p4mm_6mm | W103 |
| 1 | TDK enable sink | Package_TO_SOT_SMD:SOT-23 | Q3 |
| 1 | TDK i7C2W020A120V-P03-R | Microduck_Power_R8:TDK_i7C_P03 | U1 |

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

ldcyes/OpenDuck
已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

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quasiengineer/i8080-sbc
FPGA-based single board computer to run Intel 8080 CPU (up to 3.125Mhz)
It measures 65 × 75 mm and has 4 copper layers, 1.6 mm thick.
84 parts, built around the INA226AIDGSR, UCC27511DBVR(UMW), REF3312AIDBZR and TLV76050DBZR-MS. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
From the ldcyes/OpenDuck repository on GitHub, at the commit this page was made from: the board is hardware/r22-candidate/power_regen/Microduck_Power_Regen_R22.kicad_pcb and its schematic hardware/kicad/AMP_R3/Microduck_Audio_AMP_R3.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Its repository states no licence, so its author keeps all rights: ask ldcyes before reusing the design.