
LIONv3
RodrigoCAndrade/LIONv3-R
The LIONv3-R is an IoT and Direct-to-Satellite board powered by the ESP32-C6, combining local Wi-Fi, Zigbee, and Thread networks with high-density LR-FHSS connectivity for scalable global tracking and telemetry.

The LIONv3-Mini is an IoT and Direct-to-Satellite board powered by the ESP32-C6, combining local Wi-Fi, Zigbee, and Thread networks with high-density LR-FHSS connectivity for scalable global tracking and telemetry.
LIONv3 is an open-source printed circuit board by RodrigoCAndrade, from the RodrigoCAndrade/LIONv3-Mini repository on GitHub. It is a 4-layer board of 50.2 × 40.2 mm with 88 parts on 72 nets, routed with 321 tracks and 459 vias.
It is built around the E80-900M2213S, ESP32-C6-MINI-1-N4 and TCAN3414DRB, with the INA226AIDGSR, TMP112AIDRLR(UMW) and TLV76733DRVR among its other parts. Its parts include 29 resistors, 22 capacitors, 11 ICs, 9 diodes and 5 connectors. It belongs with the radio and wireless and interfaces and adapters boards and the ESP32 and RISC-V boards of this library.

The LIONv3-Mini is a miniaturized version of the LIONv3-R, without an onboard LoRa PCB antenna. Built around the ESP32-C6 with 16 MB of external flash, it offers local connectivity over Wi-Fi, Zigbee and Thread, plus LoRa and LR-FHSS for reliable Direct-to-Satellite (DtS) or terrestrial uplinks from remote sites at higher device densities than conventional LoRa. It is a scalable platform for telemetry, global asset tracking and remote sensing.
docs: Systems engineering documentation, including schematics, datasheets, requirements (SRD), interface control (ICD) and diagrams.hardware: Native KiCad project and manufacturing files.mechanics: 3D models, technical drawings, and physical integration constraints.software: Embedded firmware and support testing scripts.| Render | Hardware Revision | Status | Latest Release | Date | Datasheet | BOM | Manufacturing Info |
|---|---|---|---|---|---|---|---|
![]() | LIONv3-Mini | 🚧 Development | - [blocked] | 05-10-2026 | PDF [blocked] | Available | Gerber |
This board is intended to be fabricated at JLCPCB. The Gerber files, position files and BOM are available. For complete instructions, see the Fabrication Guide. Please note that we do not guarantee the board will work, and any manufacturing issues are the user's responsibility. If you find an error or have suggestions for improvement, please do not hesitate to contribute.
We welcome contributions to this project! To ensure a smooth collaboration and maintain our engineering standards, please review our Contribution Guidelines before opening any issues, modifying the hardware design, or submitting pull requests.
This board was developed from scratch, but draws on the earlier LIONv1 and LIONv2 designed by Diego Anestor Coutinho and Arielli Ajudarte. The v3 introduces several improvements:
This project utilizes a dual-licensing approach to maximize flexibility and adoption:
This work was carried out at the National Institute of Telecommunications (Inatel) with the support of three research laboratories. The EMBRAPII Inatel Competence Center for 5G and 6G Networks (xGMobile) supported this project through its Talent Development Program (PFT xGMobile), alongside the Radio & Communication Laboratory (RadioCom Lab) and the Wireless and Artificial Intelligence Laboratory (WAI Lab). Many thanks to the researchers and staff of all three laboratories for their help and for the infrastructure that made the LIONv3-Mini possible.
Built with ❤️ by Rodrigo de Carvalho Andrade
| Qty | Value | Footprint | References |
|---|---|---|---|
| 11 | 10k | Resistor_SMD:R_0402_1005Metric | R1, R4, R5, R11, R13, R14, R15, R16, R21, R22, R27 |
| 9 | 100nF | Capacitor_SMD:C_0402_1005Metric | C2, C4, C7, C8, C10, C11, C12, C19, C21 |
| 5 | 532610271 | LIONv3-Footprints:Molex_PicoBlade_53261-0271_1x02-1MP_P1.25mm_Horizontal | J1, J2, J3, J4, J5 |
| 4 | 22uF | Capacitor_SMD:C_0805_2012Metric | C1, C9, C15, C16 |
| 3 | 1uF | Capacitor_SMD:C_0603_1608Metric | C3, C13, C14 |
| 3 | 4.7k | Resistor_SMD:R_0402_1005Metric | R2, R3, R7 |
| 3 | LED | LED_SMD:LED_0603_1608Metric | D7, D8, D9 |
| 3 | LOGO | LOGO | G***, G***, G*** |
| 3 | MountingHole_Pad | MountingHole:MountingHole_2.5mm | H1, H2, H3 |
| 3 | PMEG2010ER | Diode_SMD:Nexperia_CFP3_SOD-123W | D3, D4, D5 |
| 2 | 0 | Resistor_SMD:R_0402_1005Metric | R6, R8 |
| 2 | 120 | Resistor_SMD:R_0402_1005Metric | R17, R20 |
| 2 | 5.1k | Resistor_SMD:R_0402_1005Metric | R9, R10 |
| 2 | 50m | LIONv3-Footprints:R1206 | R12, R26 |
| 2 | 59 | Resistor_SMD:R_0402_1005Metric | R28, R29 |
| 2 | BLM21PG221SN1D | Inductor_SMD:L_0805_2012Metric | FB1, FB2 |
| 2 | DNP | Capacitor_SMD:C_0402_1005Metric | C5, C6 |
| 2 | ESD9B3.3ST5G | Diode_SMD:D_SOD-923 | D1, D2 |
| 2 | INA226AIDGSR | LIONv3-Footprints:MSOP-10_L3.0-W3.0-P0.50-LS5.0-BL | U9, U17 |
| 2 | ~ | LIONv3-Footprints:KEY-SMD_L3.9-W3.0-LS5.0 | SW1, SW2 |
| 1 | 10uF | Capacitor_SMD:C_0805_2012Metric | C20 |
| 1 | 15k | Resistor_SMD:R_0402_1005Metric | R19 |
| 1 | 2.2nF | Capacitor_SMD:C_0402_1005Metric | C18 |
| 1 | 3.32k | Resistor_SMD:R_0402_1005Metric | R25 |
| 1 | 3.3nF | Capacitor_SMD:C_0402_1005Metric | C17 |
| 1 | 34.8k | Resistor_SMD:R_0402_1005Metric | R23 |
| 1 | 4.7nF | Capacitor_SMD:C_0402_1005Metric | C22 |
| 1 | 430 | Resistor_SMD:R_0402_1005Metric | R24 |
| 1 | 60.4k | Resistor_SMD:R_0402_1005Metric | R18 |
| 1 | E80-900M2213S | LIONv3-Footprints:WIFIM-SMD_22P-L26.0-W16.0-P1.27-TL | U10 |
| 1 | ESP32-C6-MINI-1-N4 | RF_Module:ESP32-C6-MINI-1 | U3 |
| 1 | SolderJumper_3_Open | Jumper:SolderJumper-3_P2.0mm_Open_TrianglePad1.0x1.5mm | JP1 |
| 1 | TCAN3414DR | LIONv3-Footprints:SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | U21 |
| 1 | TI ESD752DBZR | Package_TO_SOT_SMD:SOT-23-3 | D6 |
| 1 | TLV76733DRVR | LIONv3-Footprints:WSON-6_L2.0-W2.0-P0.65-TL-EP | U15 |
| 1 | TMP112AIDRLR | LIONv3-Footprints:SOT-563_L1.6-W1.2-P0.50-LS1.6-BR | U6 |
| 1 | TPS259474ARPWR | LIONv3-Footprints:VQFN-10_L2.0-W2.0-P0.45-TL | U14 |
| 1 | TYPE-C_16PIN_2MD(073) | LIONv3-Footprints:USB-C-SMD_TYPE-C-16PIN-2MD-073 | U8 |
| 1 | USBLC6-2SC6 | Package_TO_SOT_SMD:SOT-23-6 | U7 |
| 1 | W25Q16JVSSIQTR | LIONv3-Footprints:SOIC-8_L5.3-W5.3-P1.27-LS8.0-BL | U11 |
The 87 most common of 88 parts.

RodrigoCAndrade/LIONv3-R
The LIONv3-R is an IoT and Direct-to-Satellite board powered by the ESP32-C6, combining local Wi-Fi, Zigbee, and Thread networks with high-density LR-FHSS connectivity for scalable global tracking and telemetry.

ICDT-Inatel-Cubesat-Design-Team/TET-Module
A reliable 1U CubeSat TT&C subsystem featuring an STM32L4 MCU, LoRa radio for long-range communication, CAN Bus, and TMR SPI Flash for critical space applications.



cvaldess/E80-900M2213S_SE050_Breakout
Breakout board for the Ebyte E80-X00M221XS (LR1121/LR2021 dual-band LoRa) with an NXP SE050 secure element — KiCad 10

Gold-Rush-Robotics/pcb_2024
A repository to store work done on PCBs for the 2024 season


It measures 50.2 × 40.2 mm and has 4 copper layers, 1.6 mm thick.
88 parts, built around the E80-900M2213S, ESP32-C6-MINI-1-N4, TCAN3414DRB and INA226AIDGSR. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
From the RodrigoCAndrade/LIONv3-Mini repository on GitHub, at the commit this page was made from: the board is hardware/LIONv3/LIONv3.kicad_pcb and its schematic hardware/LIONv3/Block Diagram.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Its repository states no licence, so its author keeps all rights: ask RodrigoCAndrade before reusing the design.