2 layers54 × 46 mm
Final chain
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
27 parts3MIT
Open-source KiCad boards
46 match “misko”Printed circuit boards designed in KiCad and published on GitHub, each with its parts, layers and size, its README and its files; open any of them in PCBKit.
- 4 layers220 × 120 mm
Connector fit prototype
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
11 parts3MIT - 2 layers40 × 40 mm
Cook loadcell
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
33 parts3MIT - 4 layers50 × 73 mm
Route
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
32 parts3MIT - 4 layers50 × 73 mm
Route
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
32 parts3MIT - 2 layers55 × 45 mm
Raw seed
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
33 parts3MIT - 2 layers90 × 70 mm
Xt60-usb supply
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
51 parts3MIT - 4 layers90 × 65 mm
Final chain
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
37 parts3MIT - 2 layers90 × 70 mm
Esp32 laser timing
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
76 parts3MIT - 2 layers80 × 45 mm
Route
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
39 parts3MIT - 4 layers50 × 71 mm
Pluto rx2 8way
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
68 parts3MIT - 2 layers60 × 40 mm
Crow mic pod v3
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
44 parts3MIT - 4 layers150 × 120 mm
Pi usb port switch
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
197 parts3MIT - 4 layers112 × 60 mm
Pluto cal switch
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
77 parts3MIT - 4 layers130 × 90 mm
Route
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
83 parts3MIT - 4 layers92 × 62 mm
Routed final
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
51 parts3MIT - 4 layers130 × 90 mm
Usb controlled debug hub
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
146 parts3MIT - 4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
104 parts3MIT - 2 layers60 × 40 mm
Observed board
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
44 parts3MIT - 4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
116 parts3MIT - 4 layers130 × 90 mm
Usb hub 3s v4
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
95 parts3MIT - 4 layers100 × 60 mm
Usb power 3s
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
100 parts3MIT - 6 layers170 × 120 mm
Rv2 final
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
203 parts3MIT - 4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
114 parts3MIT