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Open-source KiCad boards

12 match “BerkeleyLab”

Printed circuit boards designed in KiCad and published on GitHub, each with its parts, layers and size, its README and its files; open any of them in PCBKit.

  • 2 layers65.5 × 5.5 mmFF connector, the printed circuit board in 3D

    FF connector

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    12 parts1
  • 2 layers299.1 × 5.5 mmExtension board MM, the printed circuit board in 3D

    Extension board MM

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    12 parts1
  • 2 layers228.9 × 5.5 mmSensor board outline, the printed circuit board in 3D

    Sensor board outline

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    14 parts1
  • 2 layers36 × 9.9 mmEnd connector, the printed circuit board in 3D

    End connector

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    7 parts1
  • 2 layers28.8 × 18.3 mmOff axis end connector, the printed circuit board in 3D

    Off axis end connector

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    8 parts1
  • 2 layers228.9 × 5.5 mmTMP117 section 5cm, the printed circuit board in 3D

    TMP117 section 5cm

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    38 parts1
  • 2 layers228.9 × 5.5 mmTMP117-ADXL345 section 5cm, the printed circuit board in 3D

    TMP117-ADXL345 section 5cm

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    38 parts1
  • 2 layers228.9 × 5.5 mmTMP117 section 10cm, the printed circuit board in 3D

    TMP117 section 10cm

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    38 parts1
  • 4 layers46.5 × 67.8 mmLoggerhw v5.0, the printed circuit board in 3D

    Loggerhw v5.0

    BerkeleyLab/DxP-data-logger

    Hardware design for the DxP (Distributed sensor Profiling) data logger that connects to a DxP sensor probe.

    62 parts
  • 8 layers110 × 181.8 mmZest, the printed circuit board in 3D

    Zest

    BerkeleyLab/Zest

    Zest is a FMC mezzanine board with 8 ADC channels and 2 DACs

    441 parts12
  • 12 layers180 × 150 mmMarble, the printed circuit board in 3D

    Marble

    BerkeleyLab/Marble

    Dual FMC FPGA carrier board developed for general purpose use in particle accelerator electronics instrumentation.

    1,006 parts35
  • 8 layers180.6 × 148.5 mmAMC FMC Carrier PcbDoc, the printed circuit board in 3D

    AMC FMC Carrier PcbDoc

    BerkeleyLab/Marble-Mini

    "Marble-Mini" Simple FMC carrier board with SFP, 2x FMC, PoE

    931 parts24