Boards using the TPS2557DRB

15 boards

Boards in 4 GitHub repositories, designed in KiCad, that use the TPS2557DRB by Texas Instruments (-40℃~+125℃ 1 2.5V~6.5V 22mΩ 5A Active High High Side Switch Overcurrent Protection(OCP)、Overtemperature protection (OTP) SON-8(3x3) Power Distribution Switches ROHS). See how each wires it, with its parts, size, README and files; the TPS2557DRB’s symbol, footprint and pinout are on its own page.

4 layers65 × 56 mm
EWS
eiten/EWS
Universal 3D-Printer HAT for SBC with CAN-Interface and USB Hub
124 parts1
2 layers99.1 × 78.7 mm
Prototype 1
22Limac/prototype_1

41 parts
4 layers150 × 120 mm
Pi usb port switch
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
197 parts3MIT
4 layers130 × 90 mm
Route
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
83 parts3MIT
4 layers130 × 90 mm
Usb controlled debug hub
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
146 parts3MIT
4 layers130 × 100 mm
Usb controlled debug hub
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
172 parts3MIT
4 layers150 × 115 mm
Usb controlled debug hub 2a
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
190 parts3MIT
4 layers130 × 100 mm
Usb controlled debug hub
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
175 parts3MIT
4 layers110 × 90 mm
Usb hub 3s
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
116 parts3MIT
4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
116 parts3MIT
4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
104 parts3MIT
4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
119 parts3MIT
4 layers130 × 92 mm
Usb hub 3s v2
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
114 parts3MIT
4 layers100 × 60 mm
Usb power 3s
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
100 parts3MIT
4 layers80 × 50 mm
USB POWER
ssmo-oss/UMI-Power-distribution
Three separate boards distribute a 12 V supply to the UMI system. D6 is the current prototype revision. It has not been physically qualified or approved for production.
38 parts