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Boards by wasa-rockoon

41 boards

Open-source boards designed in KiCad by wasa-rockoon on GitHub, from 2 repositories. A board’s address here is its repository’s there.

  • 2 layers133 × 123 mmMissionOrderFile, the printed circuit board in 3D

    MissionOrderFile

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    534 parts1MIT
  • 2 layers18 × 27 mmTinyESP32Cam, the printed circuit board in 3D

    TinyESP32Cam

    wasa-rockoon/TinyESP32Cam

    58 parts
  • 2 layers120 × 72 mmController, the printed circuit board in 3D

    Controller

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    89 parts1MIT
  • 2 layers21 × 31.5 mmESP32Camera, the printed circuit board in 3D

    ESP32Camera

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    40 parts1MIT
  • 2 layersESP32Core, the printed circuit board in 3D

    ESP32Core

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    23 parts1MIT
  • 2 layersGPS, the printed circuit board in 3D

    GPS

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    12 parts1MIT
  • 2 layersGPSActive, the printed circuit board in 3D

    GPSActive

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    15 parts1MIT
  • 2 layersGPSActiveMAX M10S, the printed circuit board in 3D

    GPSActiveMAX M10S

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    9 parts1MIT
  • 2 layersGPSPassive, the printed circuit board in 3D

    GPSPassive

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    15 parts1MIT
  • 2 layersGPSSAM M10Q, the printed circuit board in 3D

    GPSSAM M10Q

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    5 parts1MIT
  • 2 layers60 × 60 mmMissionOrderFile, the printed circuit board in 3D

    MissionOrderFile

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    90 parts1MIT
  • 2 layersHX711, the printed circuit board in 3D

    HX711

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    12 parts1MIT
  • 2 layers60 × 60 mmIGN, the printed circuit board in 3D

    IGN

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    80 parts1MIT
  • 2 layers60 × 60 mmIgnite, the printed circuit board in 3D

    Ignite

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    22 parts1MIT
  • 2 layers170 × 73 mmIGNRocketOrderFile, the printed circuit board in 3D

    IGNRocketOrderFile

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    240 parts1MIT
  • 2 layers17 × 14 mmIMU, the printed circuit board in 3D

    IMU

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    8 parts1MIT
  • 2 layersIMU, the printed circuit board in 3D

    IMU

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    11 parts1MIT
  • 2 layersIMU2, the printed circuit board in 3D

    IMU2

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    10 parts1MIT
  • 2 layersLCD, the printed circuit board in 3D

    LCD

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    40 parts1MIT
  • 2 layersLiPoPower, the printed circuit board in 3D

    LiPoPower

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    61 parts1MIT
  • 2 layersLiPoPowerSimple, the printed circuit board in 3D

    LiPoPowerSimple

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    46 parts1MIT
  • 2 layersLogger, the printed circuit board in 3D

    Logger

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    5 parts1MIT
  • 2 layersLoRa, the printed circuit board in 3D

    LoRa

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    13 parts1MIT
  • 2 layers60 × 60 mmLoRa, the printed circuit board in 3D

    LoRa

    wasa-rockoon/WOBC

    WASAロケットプロジェクト 共通電装基盤

    79 parts1MIT