4 layers20.1 × 31.8 mm
Interfaces and adapters
7,328 boards- 4 layers20 × 31.8 mm
- 2 layers45.7 × 32 mm
- 2 layers45.7 × 32 mm
- 4 layers29.8 × 24.3 mm
- 2 layers35.6 × 22.9 mm
- 2 layers31.8 × 69.9 mm
- 2 layers63 × 85.3 mm
- 2 layers111.8 × 33 mm
- 2 layers71 × 47 mm
- 2 layers20.3 × 128.5 mm
- 2 layers15.7 × 10.7 mm
- 2 layers59.4 × 16.3 mm
- 2 layers26.4 × 17.5 mm
SHT30 breakout
Yadnik1/Low-Cost-Telematics-Device
Developed a cost-effective telematics device for automobiles, capable of enabling user-based insurance models to save up to 30% on premiums.
6 parts - 2 layers23 × 20 mm
IMU breakout PCB
Yadnik1/Low-Cost-Telematics-Device
Developed a cost-effective telematics device for automobiles, capable of enabling user-based insurance models to save up to 30% on premiums.
6 parts - 2 layers
- 2 layers45 × 18 mm
- 2 layers9.6 × 27 mm
IIS3DWB breakout beta
Yexall/CPE-450.Capstone
Fall 24 - Winter 25 Cal Poly Capstone project by Haas Hooligans. This projects aims to build a machine monitoring system for the Cal Poly IME department.
9 parts - 2 layers55 × 57.5 mm
- 4 layers34 × 38.6 mm
- 2 layers22.1 × 30.7 mm
- 2 layers199.1 × 117.9 mm
- 2 layers72.6 × 35.6 mm
- 2 layers55.4 × 30.7 mm
