

LEOS efm
This repository is the starting-point PCB template for VIP Lightning From the Edge of Space (LEOS). All LEOS modules should be spun off from this template so that every module begins with the standard Raspberry Pi Pico…
- Size
- 100 × 100 mm
- Copper layers
- 2
- Thickness
- 1.6 mm
- Parts
- 58
- Nets
- 83
- Pads
- 256
- Tracks, vias
- 334, 83
- Pours
- 14
- Routed
- Yes
- KiCad
- KiCad 10.0 (file 20260206)
- Created
- 11 Feb 2026
- Updated
- 29 Oct 2026
Overview
LEOS efm is an open-source printed circuit board by VIP-LES, from the VIP-LES/leos-efm-pcb repository on GitHub. It is a 2-layer board of 100 × 100 mm with 58 parts on 83 nets, routed with 334 tracks and 83 vias.
It is built around the MCP2562FD-E/P, ADS1220IPW and OPA2333AID, with the MCP2518FDT-E/SL-HX, CL21B104KBCNNNC and S3B-XH-A-1 among its other parts. Its parts include 19 resistors, 18 capacitors, 10 connectors, 5 ICs and 1 crystal. It belongs with the RP2040 boards of this library.
Main components
11MCP2562FD-E/P
PDIP-8-40℃~+125℃ 15uA 4.5V~5.5V 45mA 8Mbps CAN FD Transceiver PDIP-8 CAN Transceivers ROHSMicrochip TechnologyCAN TransceiversADS1220IPW
TSSOP-16-40℃~+125℃ 100nA 2.3V~5.5V 24 2kHz 2、4 500kHz~4.5MHz、4.096MHz 6LSB Built-in Built-in Built-in temperature sensor、Multiplexers、Integrated modulator SPI Sigma-Delta Support Yes TSSOP-16 Analog to Digital Converters (ADC) ROHSTexas InstrumentsAnalog To Digital Converters (ADC)OPA2333AID
SOIC-8-2.75V~-900mV、900mV~2.75V -40℃~+125℃ 0.16V/us 1.8V~5.5V 10uV 130dB 150pA 17uA 2 350kHz 50nV/℃ 5mA 70pA Rail-to-Rail Input, Rail-to-Rail Output Zero drift / auto-zero、Built-in compensation、Overvoltage protection、Reverse-phase input protection SOP-8 Precision Op Amps ROHSTexas InstrumentsPrecision OpAmpsMCP2518FDT-E/SL-HX
SOIC-14SOIC-14 CAN Controllers ROHSZHHXDZCAN ControllersCL21B104KBCNNNC
0805100nF 50V X7R ±10% 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMTS3B-XH-A-1
弯插,P=2.5mmWire To Board ConnectorJSTCL31B475KBHNFNE
12064.7uF 50V X7R ±10% 1206 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMTCL21C100CBANNNC
080510pF 50V C0G 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMTCL31B226MPHNNNE
120610V 22uF X7R ±20% 1206 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMTB3B-XH-A
UncategorisedJST Automotive ConnectorsECS-400-10-37B2-CKY-TR
SMD2016-4P-30℃~+85℃ 10pF 40MHz 40Ω Crystal Oscillator ±10ppm ±10ppm SMD2016-4P Crystals ROHSECSCrystals
README
README.mdLEOS Stack PCB Template

This repository is the starting-point PCB template for VIP Lightning From the Edge of Space (LEOS). All LEOS modules should be spun off from this template so that every module begins with the standard Raspberry Pi Pico, CAN-FD network, stack connectors, board shape, and mechanical layout.
Create a module repository from this template
Do not fork or clone this repository as the permanent home of a new module. Create a fresh repository from the public GitHub template instead:
- Open this template repository on GitHub.
- Select Use this template, then Create a new repository.
- Choose the LEOS organization as the owner and enter the new module's repository name and description.
- Leave Include all branches unchecked unless the module specifically needs work from non-default template branches.
- Choose public visibility, then select Create repository.
- Clone the newly created repository and open
LEOS-stack-template.kicad_proin KiCad.
GitHub also allows this template to be selected from the Repository template menu while creating a new repository. See GitHub's repository template instructions for the current interface.
Before designing
- Rename the root KiCad project, schematic, and PCB files for the module.
- Change the root sheet/page title in both the schematic and PCB. Rename or add schematic sheets so their names clearly describe each circuit domain.
- Update the date and revision in both the schematic and PCB Page Settings. These fields are used in the PCB silkscreen, so stale metadata will be manufactured onto the board.
- Replace the template title and delete the instructional text box on the root schematic once it is no longer needed.
- Use separate schematic sheets to isolate circuit domains, and document the design well enough for the schematic to explain itself.
Design expectations
- Use pinout.xyz with the Pico 2 view when selecting configurable pins. Avoid using SPI0 for other devices because it is reserved for the high-throughput CAN bus; SPI1, I2C0, and UART0 are exposed as starting interfaces.
- Keep the standard CAN-FD and stack-connector circuitry intact unless a reviewed module requirement calls for a change.
- Verify that every schematic symbol, PCB footprint, and selected BOM item agree. Record the manufacturer, manufacturer part number (MPN), and DigiKey information for each part.
- Prefer practical, hand-placeable packages such as SOIC, 0805, 1206, SOT, and TSSOP. Do not choose extremely small packages when a larger suitable option exists.
- Commit coherent, incremental changes with descriptive messages. Do not commit generated outputs, junk files, or Gerbers when they can be regenerated from the KiCad sources.
- Review the schematic, layout, footprints, sourcing, and manufacturer recommendations before ordering hardware.
Parts
58| Qty | Value | Footprint | References |
|---|---|---|---|
| 8 | 10k | Resistor_SMD:R_1206_3216Metric | R2, R3, R4, R5, R12, R13, R20, R21 |
| 6 | 0.1u | Capacitor_SMD:C_0805_2012Metric | C1, C2, C3, C8, C10, C12 |
| 6 | S3B-XH-A-1 | Connector_JST:JST_XH_S3B-XH-A-1_1x03_P2.50mm_Horizontal | J9, J10, J11, J14, J15, J16 |
| 4 | 1M | Resistor_SMD:R_1206_3216Metric | R6, R7, R14, R15 |
| 4 | 3.3u | Capacitor_SMD:C_1206_3216Metric | C11, C16, C17, C18 |
| 4 | 33 | Resistor_SMD:R_1206_3216Metric | R8, R9, R16, R17 |
| 4 | 4.7u | Capacitor_SMD:C_1206_3216Metric | C9, C13, C14, C15 |
| 2 | 10p | Capacitor_SMD:C_0805_2012Metric | C4, C5 |
| 2 | 1k | Resistor_SMD:R_1206_3216Metric | R10, R11 |
| 2 | 22u | Capacitor_SMD:C_1206_3216Metric | C6, C7 |
| 2 | B3B-XH-A | Connector_JST:JST_XH_B3B-XH-A_1x03_P2.50mm_Vertical | J12, J13 |
| 2 | MicroFit_1x4 | LEOS:Molex_MicroFit3.0_43650-0410_1x04_Horizontal | J1, J2 |
| 2 | OPA2333AID | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U3, U5 |
| 1 | 120 | Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P7.62mm_Horizontal | R1 |
| 1 | 40 MHz | Crystal:Crystal_SMD_2016-4Pin_2.0x1.6mm | Y1 |
| 1 | 5V Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP3 |
| 1 | ADS1220IPW | Package_SO:TSSOP-16_4.4x5mm_P0.65mm | U4 |
| 1 | CAN-H Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP1 |
| 1 | CAN-L Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP2 |
| 1 | GND Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP4 |
| 1 | MCP2518FD | Package_SO:SOIC-14_3.9x8.7mm_P1.27mm | U1 |
| 1 | MCP2562FD | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U2 |
| 1 | RaspberryPi Pico | Module:RaspberryPi_Pico_Common_Unspecified | A1 |
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Questions
How big is the LEOS efm PCB?
It measures 100 × 100 mm and has 2 copper layers, 1.6 mm thick.
What parts does the LEOS efm use?
58 parts, built around the MCP2562FD-E/P, ADS1220IPW, OPA2333AID and MCP2518FDT-E/SL-HX. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the LEOS efm KiCad files?
From the VIP-LES/leos-efm-pcb repository on GitHub, at the commit this page was made from: the board is LEOS-efm.kicad_pcb and its schematic GAIN100stage.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the LEOS efm design in my own project?
Its repository states no licence, so its author keeps all rights: ask VIP-LES before reusing the design.