2 layers100 × 100 mm
2 layers100 × 100 mm
LEOS power
VIP-LES/leos-power-pcb- Size
- 100 × 100 mm
- Copper layers
- 2
- Thickness
- 1.6 mm
- Parts
- 62
- Nets
- 69
- Pads
- 233
- Tracks, vias
- 225, 149
- Pours
- 29
- Routed
- Yes
- KiCad
- KiCad 9.0 (file 20241229)
- Created
- 4 Feb 2026
- Updated
- 23 Apr 2026
Overview
LEOS power is an open-source printed circuit board by VIP-LES, from the VIP-LES/leos-power-pcb repository on GitHub. It is a 2-layer board of 100 × 100 mm with 62 parts on 69 nets, routed with 225 tracks and 149 vias.
It is built around the MCP2562FD-E/P, MPM3620AGQV-Z and TPS55287QWRYQRQ1, with the MCP2518FDT-E/SL-HX, CL21A226MAYNNNE and CL31B106KBHNNNE among its other parts. Its parts include 9 connectors, 6 capacitors, 5 resistors, 4 ICs and 2 switches. It belongs with the RP2040 boards of this library.
Main components
12
MCP2562FD-E/P
PDIP-8-40℃~+125℃ 15uA 4.5V~5.5V 45mA 8Mbps CAN FD Transceiver PDIP-8 CAN Transceivers ROHSMicrochip TechnologyCAN Transceivers
MPM3620AGQV-Z
QFN-20(3x5)-40℃~+125℃@(TJ) 1 2A 2MHz 300uA 4.5V~24V 800mV~5.5V Adjustable Buck Buck Built-in Yes QFN-20(3x5) DC-DC Converters ROHSMonolithic Power SystemsDC-DC Converters
TPS55287QWRYQRQ1
VQFN-21(5x3)-40℃~+125℃@(TJ) 1 200kHz~2.2MHz 3V~36V 4A 800mV~22V 860uA Adjustable Buck-Boost Buck-Boost Built-in Yes VQFN-21(5x3) DC-DC Converters ROHSTexas InstrumentsDC-DC Converters
MCP2518FDT-E/SL-HX
SOIC-14SOIC-14 CAN Controllers ROHSZHHXDZCAN Controllers
CL21A226MAYNNNE
080522uF 25V X5R ±20% 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMT
CL31B106KBHNNNE
120610uF 50V X7R ±10% 1206 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMT
CRCW0805100KFKEAC
0805-55℃~+155℃ 100kΩ 125mW Thick Film Resistor ±1% ±100ppm/℃ 0805 Chip Resistor - Surface Mount ROHSVishay IntertechnologyChip Resistor - Surface Mount
S2B-XH-A
弯插,P=2.5mm-25℃~+85℃ 1 11.5mm 1x2P 2 2.5mm 250V 2P 3A 6.1mm 7.4mm Brass K Pin PA66 Right Angle Tin UL94V-0 White XH 弯插,P=2.5mm Wire To Board Connector ROHSJSTWire To Board ConnectorCL21B106KOQNNNE
080510uF 16V X7R ±10% 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMT
NRS8030T100MJGJ
SMD,8x8mm10uH 2.4A 2.4A 33mΩ ±20% SMD,8x8mm Power Inductors ROHSTaiyo YudenPower InductorsCRCW080511K0FKEAC
0805-55℃~+155℃ 11kΩ 125mW Thick Film Resistor ±1% ±100ppm/℃ 0805 Chip Resistor - Surface Mount ROHSVishay IntertechnologyChip Resistor - Surface MountWSLP0805R0160FEA
0805-65℃~+170℃ 16mΩ 500mW ±1% ±75ppm/℃ 0805 Chip Resistor - Surface Mount ROHSVishay IntertechnologyChip Resistor - Surface Mount
Parts
62| Qty | Value | Footprint | References |
|---|---|---|---|
| 6 | 0.1u | Capacitor_SMD:C_0603_1608Metric | C_BOOT1, C_BOOT2, C3, C5, C7, C10 |
| 5 | 22u | Capacitor_SMD:C_0805_2012Metric | C_out1, C_out2, C_out3, C8, C9 |
| 4 | 10u | Capacitor_SMD:C_1206_3216Metric | C_in1, C_in2, C_in3, C_in4 |
| 3 | 100k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R5, R6, RUP1 |
| 3 | 12V | Connector_JST:JST_XH_S2B-XH-A_1x02_P2.50mm_Horizontal | J7, J8, J9 |
| 3 | 5V | Connector_JST:JST_XH_S2B-XH-A_1x02_P2.50mm_Horizontal | J4, J5, J6 |
| 2 | 10p | Capacitor_SMD:C_0603_1608Metric | C1, C2 |
| 2 | 10u | Capacitor_SMD:C_0805_2012Metric | C11, Cin1 |
| 2 | 1u | Capacitor_SMD:C_0603_1608Metric | C4, C6 |
| 2 | GND Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP4, TP6 |
| 2 | MicroFit_1x4 | LEOS:Molex_MicroFit3.0_43650-0410_1x04_Horizontal | J1, J2 |
| 1 | 100k | Resistor_SMD:R_0805_2012Metric | RP2 |
| 1 | 10u | LEOS:IND_TAIYO_NRS8030_TAY | L1 |
| 1 | 11k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | RBT1 |
| 1 | 120 | Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P7.62mm_Horizontal | R1 |
| 1 | 12V Test | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP5 |
| 1 | 15n | Capacitor_SMD:C_0603_1608Metric | C_COMP2 |
| 1 | 16m | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R_SNS1 |
| 1 | 19.1k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R7 |
| 1 | 20k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R_CDC1 |
| 1 | 33n | Capacitor_SMD:C_0603_1608Metric | C_COMP1 |
| 1 | 4.7u | Capacitor_SMD:C_0805_2012Metric | C_VCC1 |
| 1 | 40 MHz | Crystal:Crystal_SMD_2016-4Pin_2.0x1.6mm | Y1 |
| 1 | 47n | Capacitor_SMD:C_0603_1608Metric | C_SYNC1 |
| 1 | 5V Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP3 |
| 1 | 7.5k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R_COMP1 |
| 1 | 750k | Resistor_SMD:R_0805_2012Metric | RP1 |
| 1 | 9.1k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R_FSW1 |
| 1 | CAN-H Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP1 |
| 1 | CAN-L Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP2 |
| 1 | MCP2518FD | Package_SO:SOIC-14_3.9x8.7mm_P1.27mm | U2 |
| 1 | MCP2562FD | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U1 |
| 1 | MPM3620A | LEOS:IC18_MPM3620AGQV-Z_MNP | U4 |
| 1 | NetTie_2 | NetTie:NetTie-2_SMD_Pad0.5mm | NT1 |
| 1 | Power Input | LEOS:AMASS_XT60IPW-M_1x03_P7.20mm_Horizontal | J3 |
| 1 | Power Switch | Button_Switch_THT:SW_Slide_SPDT_Angled_CK_OS102011MA1Q | SW2 |
| 1 | Pull Tag | LEOS:D2F-FL-A1 | SW1 |
| 1 | RaspberryPi Pico | Module:RaspberryPi_Pico_Common_THT | A1 |
| 1 | TPS55287 | LEOS:VQFN21_RYQ_TEX | U3 |
Similar boards
- 4 layers100 × 100 mm
- 2 layers100 × 100 mm
- 2 layers100 × 100 mm
LEOS flight computer
VIP-LES/flight-computer-pcb
The flight computer PCB stack design. Started Fall '25
38 parts - 2 layers100 × 100 mm
LEOS efm
VIP-LES/leos-efm-pcb
This repository is the starting-point PCB template for VIP Lightning From the Edge of Space (LEOS). All LEOS modules should be spun off from this template so that every module begins with the standard Raspberry Pi Pico…
58 parts - 2 layers100 × 100 mm
- 2 layers100.1 × 100 mm
- 2 layers100 × 100 mm
Questions
How big is the LEOS power PCB?
It measures 100 × 100 mm and has 2 copper layers, 1.6 mm thick.
What parts does the LEOS power use?
62 parts, built around the MCP2562FD-E/P, MPM3620AGQV-Z, TPS55287QWRYQRQ1 and MCP2518FDT-E/SL-HX. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the LEOS power KiCad files?
From the VIP-LES/leos-power-pcb repository on GitHub, at the commit this page was made from: the board is LEOS-power.kicad_pcb and its schematic LEOS-power.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the LEOS power design in my own project?
Its repository states no licence, so its author keeps all rights: ask VIP-LES before reusing the design.