2 layers100 × 100 mm
LEOS dualpower
MatthewIsHere/leos-dualpower-pcb
A backup 5V stackable power supply for the LEOS High Altitude Balloon Stack
39 parts
4 layers100 × 100 mm
LEOS F26-power
VIP-LES/leos-F26-power-pcbpower board made in fall 2026
- Size
- 100 × 100 mm
- Copper layers
- 4
- Thickness
- 1.6 mm
- Parts
- 64
- Nets
- 95
- Pads
- 273
- Tracks, vias
- 207, 127
- Pours
- 38
- Routed
- Yes
- KiCad
- KiCad 10.0 (file 20260206)
- Created
- 8 Aug 2026
- Updated
- 22 Oct 2026
Overview
LEOS F26-power is an open-source printed circuit board by VIP-LES, from the VIP-LES/leos-F26-power-pcb repository on GitHub. It is a 4-layer board of 100 × 100 mm with 64 parts on 95 nets, routed with 207 tracks and 127 vias.
It is built around the MCP2562FD-E/P, TPS54540BDDA and MCP2518FDT-E/SL-HX, with the CL21B104KBCNNNC, CL21A475KBQNNNE and S2B-XH-A among its other parts. Its parts include 15 capacitors, 9 connectors, 6 ICs, 2 diodes and 2 inductors. It belongs with the RP2040 boards of this library.
Main components
12
MCP2562FD-E/P
PDIP-8-40℃~+125℃ 15uA 4.5V~5.5V 45mA 8Mbps CAN FD Transceiver PDIP-8 CAN Transceivers ROHSMicrochip TechnologyCAN Transceivers
TPS54540BDDA
ESOP-8-40℃~+150℃@(TJ) 146uA 4.5V~42V 5A 800mV~41.1V Adjustable Buck Buck Built-in ESOP-8 DC-DC Converters ROHSTexas InstrumentsDC-DC Converters
MCP2518FDT-E/SL-HX
SOIC-14SOIC-14 CAN Controllers ROHSZHHXDZCAN Controllers
CL21B104KBCNNNC
0805100nF 50V X7R ±10% 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMTCL21A475KBQNNNE
08054.7uF 50V X5R ±10% 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMT
S2B-XH-A
弯插,P=2.5mm-25℃~+85℃ 1 11.5mm 1x2P 2 2.5mm 250V 2P 3A 6.1mm 7.4mm Brass K Pin PA66 Right Angle Tin UL94V-0 White XH 弯插,P=2.5mm Wire To Board Connector ROHSJSTWire To Board ConnectorGRM21BR61E106MA73L
080510uF 25V X5R ±20% 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSMurataMultilayer Ceramic Capacitors MLCC - SMD/SMTCL21C100CBANNNC
080510pF 50V C0G 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMT
CL31A226MOCLNNC
120616V 22uF X5R ±20% 1206 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMTC0805C472J3GEC7210
080525V 4.7nF C0G ±5% 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSKEMETMultilayer Ceramic Capacitors MLCC - SMD/SMT
A768EB476M1VLAE042
SMD,D6.3xL6mm-55℃~+125℃ 2000hrs@125℃ 35V 42mΩ 47uF 58.75mA@120Hz 6.3mm 6mm Polarized Polymer ±20% SMD,D6.3xL6mm Polymer Aluminum Capacitors ROHSKEMETPolymer Aluminum CapacitorsSB2060
TO-277TO-277 Schottky Diodes ROHShongjiachengSchottky Diodes
README
README.mdLEOS F26 Power PCB
This repository contains the KiCad design files for the LEOS power board made fall 2026. The board is designed to accept power from a 6S LiPo battery, provide input protection, and generate adjustable DC output for other LEOS components. This board also includes the base elements from the template board.
The design uses a Texas Instruments TPS16630 eFuse for input protection and two TPS54540B buck converters for voltage regulation. A Raspberry Pi Pico controls the output voltage through the MCP41100 SPI digital potentiometer in one of the buck converter's feedback network.
The target output ranges are 5V at up to 5A and 1-18V at up to 5A.
Board Overview
The power board has three main functions: Input protection: A TPS16630 eFuse provides adjustable undervoltage lockout, overvoltage protection, current limiting, and controlled startup. DC-DC conversion: Two TPS54540B switching buck converters step down the battery voltage to both a fixed and adjustable output voltage. Digital control: A Raspberry Pi Pico communicates with an MCP41100 digital potentiometer over SPI to adjust one of the buck converters' feedback resistance.
Electrical design targets
Input source: 6S LiPo battery Nominal input voltage: 22.2V Fully charged battery voltage: 25.2V Input undervoltage cutoff: Approximately 19-19.5V Output voltage: 5V and approximately 1-18V adjustable Maximum output current: 5A Buck converter: TPS54540B eFuse: TPS16630 Digital potentiometer: MCP41100T-I/SN Control interface: SPI from Raspberry Pi Pico
Parts
64| Qty | Value | Footprint | References |
|---|---|---|---|
| 7 | 0.1u | Capacitor_SMD:C_0805_2012Metric | C1, C2, C3, C12, Cboot1, Cboot2, Cin2 |
| 4 | 4.7uF | Capacitor_SMD:C_0805_2012Metric | C8, C9, C10, C11 |
| 3 | 1-18V | Connector_JST:JST_XH_S2B-XH-A_1x02_P2.50mm_Horizontal | J7, J8, J9 |
| 3 | 10uF | Capacitor_SMD:C_0805_2012Metric | Cin1, Cout1, Cout2 |
| 3 | 5V | Connector_JST:JST_XH_S2B-XH-A_1x02_P2.50mm_Horizontal | J4, J5, J6 |
| 2 | 10p | Capacitor_SMD:C_0805_2012Metric | C4, C5 |
| 2 | 22u | Capacitor_SMD:C_1206_3216Metric | C6, C7 |
| 2 | 4.7n | Capacitor_SMD:C_0805_2012Metric | Ccomp1, Cslew1 |
| 2 | 47u | LEOS:CAPAE660X600N | Cout3, Cout4 |
| 2 | 6.8p | Capacitor_SMD:C_0805_2012Metric | Ccomp2, Ccomp4 |
| 2 | 60V 20A | Diode_THT:D_DO-201AD_P15.24mm_Horizontal | D1, D2 |
| 2 | MicroFit_1x4 | LEOS:Molex_MicroFit3.0_43650-0410_1x04_Horizontal | J1, J2 |
| 2 | TPS54540BDDA | LEOS:SO-POWERPAD8_DDA_TEX | U3, U5 |
| 1 | 1.1k | Resistor_SMD:R_0805_2012Metric | Rfb4 |
| 1 | 10k | Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal | Ruvlo2 |
| 1 | 10uH | LEOS:IND_BOURNS_SRR1280 | L2 |
| 1 | 11.5k | Resistor_SMD:R_0805_2012Metric | Rfb2 |
| 1 | 120 | Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P7.62mm_Horizontal | R1 |
| 1 | 147k | Resistor_SMD:R_0805_2012Metric | Rclk1 |
| 1 | 160k | Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal | Ruvlo1 |
| 1 | 23.7k | Resistor_SMD:R_0805_2012Metric | Rcomp1 |
| 1 | 26.1k | Resistor_SMD:R_0805_2012Metric | Rfb3 |
| 1 | 3.0k | Resistor_SMD:R_0805_2012Metric | Rlim1 |
| 1 | 390k | Resistor_SMD:R_0805_2012Metric | Rclk2 |
| 1 | 4.7uH | LEOS:IND_SRP7028A-4R7M_BRN | L1 |
| 1 | 40 MHz | Crystal:Crystal_SMD_2016-4Pin_2.0x1.6mm | Y1 |
| 1 | 56.2k | Resistor_SMD:R_0805_2012Metric | Rcomp2 |
| 1 | 5V Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP3 |
| 1 | 60.4k | Resistor_SMD:R_0805_2012Metric | Rfb1 |
| 1 | 620p | Capacitor_SMD:C_0805_2012Metric | Ccomp3 |
| 1 | CAN-H Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP1 |
| 1 | CAN-L Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP2 |
| 1 | GND Test Point | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TP4 |
| 1 | LOGO | LOGO | G*** |
| 1 | MCP2518FD | Package_SO:SOIC-14_3.9x8.7mm_P1.27mm | U1 |
| 1 | MCP2562FD | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U2 |
| 1 | MCP41100T-I/SN | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U6 |
| 1 | RaspberryPi Pico | Module:RaspberryPi_Pico_Common_Unspecified | A1 |
| 1 | TPS16630PWPR | LEOS:HTSSOP20_PWP_TEX | U4 |
| 1 | TestPoint | TestPoint:TestPoint_Loop_D2.60mm_Drill0.9mm_Beaded | TPUVLO1 |
| 1 | XT60IPW-M | LEOS:AMASS_XT60IPW-M_1x03_P7.20mm_Horizontal | J3 |
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Questions
How big is the LEOS F26-power PCB?
It measures 100 × 100 mm and has 4 copper layers, 1.6 mm thick.
What parts does the LEOS F26-power use?
64 parts, built around the MCP2562FD-E/P, TPS54540BDDA, MCP2518FDT-E/SL-HX and CL21B104KBCNNNC. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the LEOS F26-power KiCad files?
From the VIP-LES/leos-F26-power-pcb repository on GitHub, at the commit this page was made from: the board is LEOS-F26-power.kicad_pcb and its schematic 5v_buck.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the LEOS F26-power design in my own project?
Its repository states no licence, so its author keeps all rights: ask VIP-LES before reusing the design.