4 layers122.1 × 95.5 mm
Boat PCB V3
ka1e27/dreams
Autonomous survey catamaran: CV-based obstacle avoidance, environmental sensing, and cellular telemetry to a web dashboard.
140 parts
THVD2410D
Texas InstrumentsExtended
-40℃~+125℃ 1 1 1uA 256 3V~5.5V 500Kbps Half-Duplex Transceiver ±16kV SOIC-8 RS-485 / RS-422 ICs ROHS
- Part id
- ti/THVD2410D
- Category
- RS 485, RS 422 ICs
- Package
- SOIC-8
- Pins
- 8
- In stock
- 1,204 at JLCPCB (C1849398)
- Used on
- 3 open-source boards
Overview
The THVD2410D is a RS 485, RS 422 IC made by Texas Instruments in a SOIC-8 package with 8 pins. -40℃~+125℃ 1 1 1uA 256 3V~5.5V 500Kbps Half-Duplex Transceiver ±16kV SOIC-8 RS-485 / RS-422 ICs ROHS.
PCBKit's library has its KiCad symbol (EasyEDA_Cloud:MS2111, from EasyEDA) and its footprint (Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, from KiCad's library), ready for a KiCad board. 1,204 are in stock at JLCPCB (part C1849398). 3 open-source boards in 1 repository on GitHub use it.
Symbol
Footprint
From the datasheet
14- Supply, least
- 3 V · VCC, recommended operating min · p. 5
- Supply, most
- 5.5 V · VCC, recommended operating max · p. 5
- Supply, absolute maximum
- 7 V · VCC, absolute maximum · p. 4
- Works from
- -40 °C · Operating ambient temperature min · p. 5
- Works up to
- 125 °C · Operating ambient temperature max · p. 5
- Junction, hottest
- 150 °C · Junction temperature max · p. 5
- Takes working
- 3.5 mA · VCC, driver and receiver enabled, no load, typical · p. 6
- Takes asleep
- 100 nA · VCC, driver and receiver disabled, no load, typical · p. 6
- A pin gives at most
- 24 mA · Receiver output current, absolute max magnitude · p. 4
- Junction to air (D (SOIC))
- 115.9 K/W · Junction-to-ambient thermal resistance · p. 5
- Junction to case (D (SOIC))
- 53.1 K/W · Junction-to-case (top) thermal resistance · p. 5
- Junction to board (D (SOIC))
- 60.1 K/W · Junction-to-board thermal resistance · p. 5
- Data rate, most
- 500 kbit/s · THVD2410 signaling rate max · p. 5
- Edge
- 13 ns · Receiver output rise/fall time, typical · p. 7
What it is and has
11- Supply voltage
- 3 V to 5.5 V · p. 1
- Data rate
- 500 kbps · p. 1
- DC bus fault protection
- ±70 V · p. 1
- HBM ESD protection
- ±16 kV · p. 1
- IEC 61000-4-2 contact discharge protection
- ±12 kV · p. 1
- IEC 61000-4-2 air-gap discharge protection
- ±12 kV · p. 1
- IEC 61000-4-4 fast transient burst protection
- ±4 kV · p. 1
- Hot plug-in capability
- Glitch-free power-up/down · p. 1
- Failsafe
- Open, short, and idle bus · p. 1
- Protection
- Thermal shutdown · p. 1
- Bus loading
- 1/8 unit load, up to 256 bus nodes · p. 1
Specifications
71| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply voltage VCC | Over operating free-air temperature range | min -0.5 · max 7 V | 4 |
| Bus voltage | Range at any bus pin (A or B) as differential or common-mode with respect to GND | min -70 · max 70 V | 4 |
| Input voltage | Range at any logic pin (D, DE, or RE) | min -0.3 · max 5.7 V | 4 |
| Receiver output current IO | Over operating free-air temperature range | min -24 · max 24 mA | 4 |
| Storage temperature Tstg | min -65 · max 170 °C | 4 | |
| Electrostatic discharge V(ESD) | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; Bus terminals and GND; value ±16,000 V | min -16000 · max 16000 V | 4 |
| Electrostatic discharge V(ESD) | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; All pins except bus terminals and GND; value ±8,000 V | min -8000 · max 8000 V | 4 |
| Electrostatic discharge V(ESD) | Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002; value ±1,500 V | min -1500 · max 1500 V | 4 |
| Electrostatic discharge V(ESD) | Contact discharge, per IEC 61000-4-2; Bus terminals and GND; value ±12,000 V | min -12000 · max 12000 V | 4 |
| Electrostatic discharge V(ESD) | Air-gap discharge, per IEC 61000-4-2; Bus terminals and GND; value ±12,000 V | min -12000 · max 12000 V | 4 |
| Electrical fast transient V(EFT) | Per IEC 61000-4-4; Bus terminals; value ±4,000 V | min -4000 · max 4000 V | 4 |
| Supply voltage VCC | Over operating free-air temperature range | min 3 · max 5.5 V | 5 |
| Input voltage at any bus terminal (separately or common mode) VI | Over operating free-air temperature range | min -25 · max 25 V | 5 |
| High-level input voltage (driver, driver enable, and receiver enable inputs) VIH | min 2 V | 5 | |
| Low-level input voltage (driver, driver enable, and receiver enable inputs) VIL | max 0.8 V | 5 | |
| Differential input voltage VID | min -25 · max 25 V | 5 | |
| Output current, driver IO | min -60 · max 60 mA | 5 | |
| Output current, receiver IOR | min -8 · max 8 mA | 5 | |
| Differential load resistance RL | 60 Ω nominal | min 54 · typ 60 Ω | 5 |
| Signaling rate 1/tUI | THVD2410 | max 500 kbps | 5 |
| Operating ambient temperature TA | min -40 · max 125 °C | 5 | |
| Junction temperature TJ | min -40 · max 150 °C | 5 | |
| Junction-to-ambient thermal resistance RθJA | THVD2410, D (SOIC), 8 PINS | typ 115.9 °C/W | 5 |
| Junction-to-case (top) thermal resistance RθJC(top) | THVD2410, D (SOIC), 8 PINS | typ 53.1 °C/W | 5 |
| Junction-to-board thermal resistance RθJB | THVD2410, D (SOIC), 8 PINS | typ 60.1 °C/W | 5 |
| Junction-to-top characterization parameter ψJT | THVD2410, D (SOIC), 8 PINS | typ 10.1 °C/W | 5 |
| Junction-to-board characterization parameter ψJB | THVD2410, D (SOIC), 8 PINS | typ 59.2 °C/W | 5 |
| Driver and receiver enabled, VCC = 5.5 V, TA = 125 °C, random data (PRBS7) at signaling rate PD | THVD2410, 500 kbps; Unterminated; RL = 300 Ω, CL = 50 pF (driver); table VALUE | typ 130 mW | 5 |
| Driver and receiver enabled, VCC = 5.5 V, TA = 125 °C, random data (PRBS7) at signaling rate PD | THVD2410, 500 kbps; RS-422 load; RL = 100 Ω, CL = 50 pF (driver); table VALUE | typ 170 mW | 5 |
| Driver and receiver enabled, VCC = 5.5 V, TA = 125 °C, random data (PRBS7) at signaling rate PD | THVD2410, 500 kbps; RS-485 load; RL = 54 Ω, CL = 50 pF (driver); table VALUE | typ 240 mW | 5 |
| Driver differential output voltage magnitude |VOD| | RL = 60 Ω, –25 V ≤ Vtest ≤ 25 V (See Figure 7-1) | min 1.5 · typ 3.3 V | 6 |
| Driver differential output voltage magnitude |VOD| | RL = 60 Ω, –25 V ≤ Vtest ≤ 25 V, 4.5 V ≤ VCC ≤ 5.5 V (See Figure 7-1) | min 2.1 · typ 3.3 V | 6 |
| Change in differential output voltage Δ|VOD| | RL = 54 Ω or 100 Ω (See Figure 7-2) | min -50 · max 50 mV | 6 |
| Common-mode output voltage VOC | RL = 54 Ω or 100 Ω (See Figure 7-2); typical VCC/2 | min 1 · max 3 V | 6 |
| Change in steady-state common-mode output voltage ΔVOC(SS) | RL = 54 Ω or 100 Ω (See Figure 7-2) | min -50 · max 50 mV | 6 |
| Short-circuit output current IOS | DE = VCC, -70 V ≤ (VA or VB) ≤ 70 V | min -250 · max 250 mA | 6 |
| Bus input current II | DE = 0 V, VCC = 0 V or 5.5 V; VI = 12 V | typ 75 · max 125 uA | 6 |
| Bus input current II | DE = 0 V, VCC = 0 V or 5.5 V; VI = 25 V | typ 150 · max 250 uA | 6 |
| Bus input current II | DE = 0 V, VCC = 0 V or 5.5 V; VI = –7 V | min -100 · typ -40 uA | 6 |
| Bus input current II | DE = 0 V, VCC = 0 V or 5.5 V; VI = –25 V | min -250 · typ -150 uA | 6 |
| Positive-going input threshold voltage VTH+ | Over common-mode range of ± 25 V | min 40 · typ 125 · max 200 mV | 6 |
| Negative-going input threshold voltage VTH- | Over common-mode range of ± 25 V | min -200 · typ -125 · max -40 mV | 6 |
| Input hysteresis VHYS | Over common-mode range of ± 25 V | typ 250 mV | 6 |
| Input fail-safe threshold VTH_FSH | Over common-mode range of ± 25 V | min -40 · max 40 mV | 6 |
| Input differential capacitance CA,B | Measured between A and B, f = 1 MHz | typ 50 pF | 6 |
| Output low voltage VOL | IOL = 8 mA | typ 0.2 · max 0.4 V | 6 |
| Output high-impedance current IOZ | VO = 0 V or VCC, RE = VCC | min -1 · max 1 uA | 6 |
| Input current (DE) IIN | 3 V ≤ VCC ≤ 5.5 V, 0 V ≤ VIN ≤ VCC | max 5 uA | 6 |
| Input current (D, RE) IIN | 3 V ≤ VCC ≤ 5.5 V, 0 V ≤ VIN ≤ VCC | min -5 uA | 6 |
| Thermal shutdown threshold TSHDN | Temperature rising | min 150 · typ 170 °C | 6 |
| Thermal shutdown hysteresis THYS | typ 10 °C | 6 | |
| Supply current (quiescent) ICC | Driver and receiver enabled; RE = 0 V, DE = VCC, No load | typ 3.5 · max 5.6 mA | 6 |
| Supply current (quiescent) ICC | Driver enabled, receiver disabled; RE = VCC, DE = VCC, No load | typ 2.5 · max 4.4 mA | 6 |
| Supply current (quiescent) ICC | Driver disabled, receiver enabled; RE = 0 V, DE = 0 V, No load | typ 1.8 · max 2.4 mA | 6 |
| Supply current (quiescent) ICC | Driver and receiver disabled; RE = VCC, DE = 0 V, D = open, No load | typ 0.1 · max 1 uA | 6 |
| Differential output rise/fall time tr, tf | Driver; RL = 54 Ω, CL = 50 pF; See Figure 7-3 | min 240 · typ 280 · max 600 ns | 7 |
| Propagation delay tPHL, tPLH | Driver; RL = 54 Ω, CL = 50 pF; See Figure 7-3 | typ 275 · max 350 ns | 7 |
| Pulse skew, |tPHL – tPLH| tSK(P) | Driver; RL = 54 Ω, CL = 50 pF; See Figure 7-3 | max 10 ns | 7 |
| Disable time tPHZ, tPLZ | Driver; See Figure 7-4 and Figure 7-5 | typ 45 · max 95 ns | 7 |
| Enable time tPZH, tPZL | Driver; RE = 0 V; See Figure 7-4 and Figure 7-5 | typ 175 · max 270 ns | 7 |
| Enable time tPZH, tPZL | Driver; RE = VCC; See Figure 7-4 and Figure 7-5 | typ 1.5 · max 4 us | 7 |
| Time to shutdown tSHDN | Driver; RE = VCC | min 50 · max 500 ns | 7 |
| Output rise/fall time tr, tf | Receiver; CL = 15 pF; See Figure 7-6 | typ 13 · max 20 ns | 7 |
| Propagation delay tPHL, tPLH | Receiver; CL = 15 pF; See Figure 7-6 | typ 50 · max 80 ns | 7 |
| Pulse skew, |tPHL – tPLH| tSK(P) | Receiver; CL = 15 pF; See Figure 7-6 | max 7 ns | 7 |
| Disable time tPHZ, tPLZ | Receiver; See Figure 7-7 | typ 30 · max 40 ns | 7 |
| Enable time tPZH(1), tPZL(1) | Receiver; DE = VCC; See Figure 7-7 | typ 90 · max 120 ns | 7 |
| Enable time tPZH(2), tPZL(2) | Receiver; DE = 0 V; See Figure 7-8 | typ 2 · max 4 us | 7 |
| Delay to enter fail-safe operation tD(OFS) | Receiver; CL = 15 pF; See Figure 7-9 | min 7 · typ 10 · max 18 us | 7 |
| Delay to exit fail-safe operation tD(FSO) | Receiver; CL = 15 pF; See Figure 7-9 | min 35 · typ 45 · max 60 ns | 7 |
| Time to shutdown tSHDN | Receiver; DE = 0 V; See Figure 7-8 | min 50 · max 500 ns | 7 |
Pins, by the datasheet
8- 1 R
- Receive data output. · p. 3
- 2 RE
- Receiver enable, active low, with 2-MΩ internal pull-up. · p. 3
- 3 DE
- Driver enable, active high, with 2-MΩ internal pull-down. · p. 3
- 4 D
- Driver data input. · p. 3
- 5 GND
- Device ground. · p. 3
- 6 A
- Bus I/O port, A (complementary to B). · p. 3
- 7 B
- Bus I/O port, B (complementary to A). · p. 3
- 8 VCC
- 3.3-V to 5-V supply. · p. 3
Open-source boards using it
3- 2 layers98 × 67 mm
Boat PCB V3 1
ka1e27/dreams
Autonomous survey catamaran: CV-based obstacle avoidance, environmental sensing, and cellular telemetry to a web dashboard.
75 parts - 2 layers48 × 63 mm
Pod PCB V3
ka1e27/dreams
Autonomous survey catamaran: CV-based obstacle avoidance, environmental sensing, and cellular telemetry to a web dashboard.
54 parts
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Questions
Is there a KiCad symbol and footprint for the THVD2410D?
Yes. The symbol is EasyEDA_Cloud:MS2111 and the footprint Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the THVD2410D?
SOIC-8, with 8 pins. Its footprint is drawn on this page.
Where is the THVD2410D datasheet?
Texas Instruments publishes it: the Datasheet link on this page opens it.
Where can I order the THVD2410D?
JLCPCB lists it as part C1849398, with 1,204 in stock; the sellers' links on this page open their listings.
What can replace the THVD2410D?
Parts like it in the library: the SP3485EN-L/TR by MaxLinear, the SP485EEN-L/TR by MaxLinear, the SN75176BD by Texas Instruments and the MAX485ESA+T by Maxim Integrated (Analog Devices). Check their datasheets: a part that fits the footprint may still differ in its ratings.
Which open-source boards use the THVD2410D?
3 boards in 1 repository on GitHub; the most starred are listed on this page, with their KiCad files.