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DRV8833PWPR

Texas InstrumentsExtended

-40℃~+85℃ 1.5A 2 2.7V~10.8V 360mΩ Bipolar Driver Yes TSSOP-16-EP Stepper Motor Driver ROHS

Part id
ti/DRV8833PWPR
Category
Stepper Motor Driver
Package
TSSOP-16-EP
Pins
16
In stock
28,665 at JLCPCB (C50506)
Used on
27 open-source boards

Overview

The DRV8833PWPR is a stepper Motor Driver made by Texas Instruments in a TSSOP-16-EP package with 17 pins. -40℃~+85℃ 1.5A 2 2.7V~10.8V 360mΩ Bipolar Driver Yes TSSOP-16-EP Stepper Motor Driver ROHS.

PCBKit's library has its KiCad symbol (Driver_Motor:DRV8833PWP, from KiCad's library) and its footprint (Package_SO:HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm, from KiCad's library), ready for a KiCad board. 28,665 are in stock at JLCPCB (part C50506). 27 open-source boards in 21 repositories on GitHub use it.

Symbol

SLEEP1AOUT12AISEN3AOUT24BOUT25BISEN6BOUT17FAULT8BIN19BIN210VCP11VM12GND13VINT14AIN215AIN116
Driver_Motor:DRV8833PWPFrom KiCad's library

Footprint

1234567891011121314151617
Package_SO:HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mmFrom KiCad's library

From the datasheet

13
Supply, least
2.7 V · VM, recommended operating min · p. 5
Supply, most
10.8 V · VM, recommended operating max · p. 5
Supply, absolute maximum
11.8 V · VM, absolute maximum · p. 5
Junction, hottest
150 °C · Operating junction temperature max · p. 5
Takes working
1.7 mA · VM operating supply current typical, VM = 5 V, inputs low · p. 6
Takes at most
3 mA · VM operating supply current max, VM = 5 V, inputs low · p. 6
Takes asleep
1.6 µA · VM sleep mode supply current typical, VM = 5 V · p. 6
Gives
1.5 A · PWP RMS output per H-bridge, VM = 5 V, 25°C · p. 1
Current limit
3.3 A · Overcurrent protection trip level typical · p. 6
Junction to air (PWP (HTSSOP))
40.5 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to case (PWP (HTSSOP))
32.9 K/W · Junction-to-case (top) thermal resistance · p. 5
Junction to board (PWP (HTSSOP))
28.8 K/W · Junction-to-board thermal resistance · p. 5
Edge
160 ns · Fall time typical, VM = 5 V, 16 Ω to GND, 10% to 90% VM · p. 6

What it is and has

6
Motor driver
Dual H-bridge with current control · p. 1
PWM current control
Winding current regulation and current limiting · p. 1
Protection
Undervoltage, overcurrent and overtemperature · p. 11
Package
PWP, 16-pin HTSSOP · p. 3
Motor driver
Dual-H-Bridge Current-Control Motor Driver · p. 1
Motor support
Two DC motors or one stepper motor · p. 1

Around it

4
cap 2.2-μF
between VINT and GND; Internal supply bypass; 6.3-V rating. · p. 3
cap 10-µF
between VM and GND; Minimum capacitance; ceramic supply bypass. · p. 3
cap 0.01-μF
between VCP and VM; X7R ceramic; 16-V minimum rating. · p. 3
res 1-Ω
between AISEN and GND; Sense resistor example giving a 200-mA chopping current; applies to either bridge. · p. 10

Specifications

53
ParameterConditionsAs printedPage
Power supply voltage VMover operating free-air temperature rangemin -0.3 · max 11.8 V5
Digital input pin voltageover operating free-air temperature rangemin -0.5 · max 7 V5
xISEN pin voltageover operating free-air temperature rangemin -0.3 · max 0.5 V5
Operating junction temperature TJmin -40 · max 150 °C5
Storage temperature Tstgmin -60 · max 150 °C5
Electrostatic discharge V(ESD)Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pinsmin -4000 · max 4000 V5
Electrostatic discharge V(ESD)Charged device model (CDM), per JEDEC specification JESD22-C101, all pinsmin -1500 · max 1500 V5
Motor power supply voltage range VMTA = 25°C; RDS(ON) increases and maximum output current is reduced below 5 Vmin 2.7 · max 10.8 V5
Digital input pin voltage range VDIGINTA = 25°Cmin -0.3 · max 5.75 V5
Junction-to-ambient thermal resistance RθJAPWP (HTSSOP), 16 pinstyp 40.5 °C/W5
Junction-to-case (top) thermal resistance RθJC(top)PWP (HTSSOP), 16 pinstyp 32.9 °C/W5
Junction-to-board thermal resistance RθJBPWP (HTSSOP), 16 pinstyp 28.8 °C/W5
Junction-to-top characterization parameter ψJTPWP (HTSSOP), 16 pinstyp 0.6 °C/W5
Junction-to-board characterization parameter ψJBPWP (HTSSOP), 16 pinstyp 11.5 °C/W5
Junction-to-case (bottom) thermal resistance RθJC(bot)PWP (HTSSOP), 16 pinstyp 4.8 °C/W5
VM operating supply current IVMTA = 25°C; VM = 5 V, xIN1 = 0 V, xIN2 = 0 Vtyp 1.7 · max 3 mA6
VM sleep mode supply current IVMQTA = 25°C; VM = 5 Vtyp 1.6 · max 2.5 uA6
VM undervoltage lockout voltage VUVLOTA = 25°C; VM fallingmax 2.6 V6
VM undervoltage lockout hysteresis VHYSTA = 25°Ctyp 90 mV6
Input low voltage VILTA = 25°C; nSLEEPmax 0.5 V6
Input low voltage VILTA = 25°C; All other pinsmax 0.7 V6
Input high voltage VIHTA = 25°C; nSLEEPmin 2.5 V6
Input high voltage VIHTA = 25°C; All other pinsmin 2 V6
Input hysteresis VHYSTA = 25°Ctyp 0.4 V6
Input pulldown resistance RPDTA = 25°C; nSLEEPtyp 500 kΩ6
Input pulldown resistance RPDTA = 25°C; All except nSLEEPtyp 150 kΩ6
Input low current IILTA = 25°C; VIN = 0max 1 uA6
Input high current IIHTA = 25°C; VIN = 3.3 V, nSLEEPtyp 6.6 · max 13 uA6
Input high current IIHTA = 25°C; VIN = 3.3 V, all except nSLEEPtyp 16.5 · max 33 uA6
Input deglitch time tDEGTA = 25°Ctyp 450 ns6
Output low voltage VOLTA = 25°C; nFAULT; IO = 5 mAmax 0.5 V6
Output high leakage current IOHTA = 25°C; nFAULT; VO = 3.3 Vmax 1 uA6
HS FET on resistance RDS(ON)VM = 5 V, I O = 500 mA, TJ = 25°Ctyp 200 mΩ6
HS FET on resistance RDS(ON)VM = 5 V, IO = 500 mA, TJ = 85°Cmax 325 mΩ6
HS FET on resistance RDS(ON)VM = 2.7 V, I O = 500 mA, TJ = 25°Ctyp 250 mΩ6
HS FET on resistance RDS(ON)VM = 2.7 V, IO = 500 mA, TJ = 85°Cmax 350 mΩ6
LS FET on resistance RDS(ON)VM = 5 V, I O = 500 mA, TJ = 25°Ctyp 160 mΩ6
LS FET on resistance RDS(ON)VM = 5 V, IO = 500 mA, TJ = 85°Cmax 275 mΩ6
LS FET on resistance RDS(ON)VM = 2.7 V, I O = 500 mA, TJ = 25°Ctyp 200 mΩ6
LS FET on resistance RDS(ON)VM = 2.7 V, IO = 500 mA, TJ = 85°Cmax 300 mΩ6
Off-state leakage current IOFFVM = 5 V, TJ = 25°C, VOUT = 0 Vmin -1 · max 1 uA6
Current control PWM frequency ƒPWMTA = 25°C; Internal PWM frequencytyp 50 kHz6
Rise time tRTA = 25°C; VM = 5 V, 16 Ω to GND, 10% to 90% VMtyp 180 ns6
Fall time tFTA = 25°C; VM = 5 V, 16 Ω to GND, 10% to 90% VMtyp 160 ns6
Propagation delay INx to OUTx tPROPTA = 25°C; VM = 5 Vtyp 1.1 us6
Dead time tDEADTA = 25°C; VM = 5 V; internal dead timetyp 450 ns6
Overcurrent protection trip level IOCPTA = 25°Cmin 2 · typ 3.3 A6
OCP Deglitch time tDEGTA = 25°Cmin 4 us6
Overcurrent protection period tOCPTA = 25°Ctyp 1.35 ms6
Thermal shutdown temperature tTSDDie temperaturemin 150 · typ 160 · max 180 °C6
xISEN trip voltage VTRIPTA = 25°Cmin 160 · typ 200 · max 240 mV7
Current sense blanking time tBLANKTA = 25°Ctyp 3.75 us7
Start-up time tWAKETA = 25°C; nSLEEP inactive high to H-bridge onmax 1 ms7

Pins, by the datasheet

17
1 nSLEEP
High enables the device; low enters sleep and resets internal logic. Internal pulldown. · p. 3
2 AOUT1
Bridge A output 1; connect to motor winding A. · p. 4
3 AISEN
Bridge A ground / ISENSE; connect to a current sense resistor or GND if current control is not needed. · p. 4
4 AOUT2
Bridge A output 2; connect to motor winding A. · p. 4
5 BOUT2
Bridge B output 2; connect to motor winding B. · p. 4
6 BISEN
Bridge B ground / ISENSE; connect to a current sense resistor or GND if current control is not needed. · p. 4
7 BOUT1
Bridge B output 1; connect to motor winding B. · p. 4
8 nFAULT
Low during overtemperature or overcurrent fault. · p. 4
9 BIN1
Controls BOUT1; internal pulldown. · p. 3
10 BIN2
Controls BOUT2; internal pulldown. · p. 3
11 VCP
High-side gate drive voltage; connect a 0.01-uF, 16-V minimum X7R ceramic capacitor to VM. · p. 3
12 VM
Motor power supply; bypass to GND with a minimum 10-uF ceramic capacitor. · p. 3
13 GND
Device ground; connect to ground. · p. 3
14 VINT
Internal supply bypass; bypass to GND with a 2.2-uF, 6.3-V capacitor. · p. 3
15 AIN2
Controls AOUT2; internal pulldown. · p. 3
16 AIN1
Controls AOUT1; internal pulldown. · p. 3
PPAD GND
Device PowerPAD must be connected to ground. · p. 3

Ordering codes, by the datasheet

13
DRV8833PW
TSSOP (PW) | 16 · Obsolete; -40 to 85 °C · p. 18
DRV8833PWPR
HTSSOP (PWP) | 16 · Active; 2000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833PWPR.B
HTSSOP (PWP) | 16 · Active; 2000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833PWPRG4
HTSSOP (PWP) | 16 · Active; 2000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833PWPRG4.B
HTSSOP (PWP) | 16 · Active; 2000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833PWR
TSSOP (PW) | 16 · Active; 2000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833PWR.B
TSSOP (PW) | 16 · Active; 2000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833RTYR
QFN (RTY) | 16 · Active; 3000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833RTYR.B
QFN (RTY) | 16 · Active; 3000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833RTYRG4
QFN (RTY) | 16 · Active; 3000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833RTYRG4.B
QFN (RTY) | 16 · Active; 3000 per large tape-and-reel; -40 to 85 °C · p. 18
DRV8833RTYT
QFN (RTY) | 16 · Obsolete; -40 to 85 °C · p. 18
DRV8833RTYT.B
QFN (RTY) | 16 · Obsolete; -40 to 85 °C · p. 18

Open-source boards using it

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  • 2 layers80 × 79 mmMM Power Subsystem, the printed circuit board in 3D

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Parts like it

1

Questions

Is there a KiCad symbol and footprint for the DRV8833PWPR?

Yes. The symbol is Driver_Motor:DRV8833PWP and the footprint Package_SO:HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the DRV8833PWPR?

TSSOP-16-EP, with 17 pins. Its footprint is drawn on this page.

Where is the DRV8833PWPR datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the DRV8833PWPR?

JLCPCB lists it as part C50506, with 28,665 in stock; the sellers' links on this page open their listings.

What can replace the DRV8833PWPR?

Parts like it in the library: the DRV8833PWP by Texas Instruments. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the DRV8833PWPR?

27 boards in 21 repositories on GitHub; the most starred are listed on this page, with their KiCad files.