ATTINY1616-MN

Q: Is there a KiCad symbol and footprint for the ATTINY1616-MN?

Yes. The symbol is MCU_Microchip_ATtiny:ATtiny1616-M and the footprint Package_DFN_QFN:VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

Q: What package is the ATTINY1616-MN?

QFN-20-EP(3x3), with 21 pins. Its footprint is drawn on this page.

Q: Where is the ATTINY1616-MN datasheet?

Microchip Technology publishes it: the Datasheet link on this page opens it.

Q: Where can I order the ATTINY1616-MN?

JLCPCB lists it as part C507118, with 3 in stock; the sellers' links on this page open their listings.

Q: What can replace the ATTINY1616-MN?

Parts like it in the library: the ATTINY816-MN by Microchip Technology, the ATTINY416-MN by Microchip Technology, the ATTINY1616-MF by Microchip Technology and the ATTINY1606-MN by Microchip Technology. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Q: Which open-source boards use the ATTINY1616-MN?

103 boards in 71 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Microchip TechnologyExtended

-40℃~+105℃ 1.8V~5.5V 10bit 16KB 18 20MHz 256Byte 2KB 8 Bit 8bit AVR Built-in FLASH QFN-20-EP(3x3) Microcontrollers (MCU/MPU/SOC) ROHS

Datasheet JLCPCB LCSC

Part id: microchip/ATTINY1616-MN
Category: Microcontrollers (MCU, MPU, SOC)
Package: QFN-20-EP(3x3)
Pins: 21
In stock: 3 at JLCPCB (C507118)
Used on: 103 open-source boards

Overview

The ATTINY1616-MN is a microcontroller made by Microchip Technology in a QFN-20-EP(3x3) package with 21 pins. -40℃~+105℃ 1.8V~5.5V 10bit 16KB 18 20MHz 256Byte 2KB 8 Bit 8bit AVR Built-in FLASH QFN-20-EP(3x3) Microcontrollers (MCU/MPU/SOC) ROHS.

PCBKit's library has its KiCad symbol (MCU_Microchip_ATtiny:ATtiny1616-M, from KiCad's library) and its footprint (Package_DFN_QFN:VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm, from KiCad's library), ready for a KiCad board. 3 are in stock at JLCPCB (part C507118). 103 open-source boards in 71 repositories on GitHub use it.

Symbol

MCU_Microchip_ATtiny:ATtiny1616-MFrom KiCad's library

Footprint

Package_DFN_QFN:VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mmFrom KiCad's library

From the datasheet

Supply, least: 1.8 V · VDD, recommended operating minimum · p. 553
Supply, most: 5.5 V · VDD, recommended operating maximum · p. 553
Supply, absolute maximum: 6 V · VDD, absolute maximum · p. 552
Works from: -40 °C · Standard operating temperature minimum · p. 553
Works up to: 105 °C · Standard operating temperature maximum · p. 553
Takes working: 10.2 mA · Active, 20 MHz, VDD=5V, peripherals disabled, typical · p. 554
Takes at most: 10.2 mA · Active, 20 MHz, VDD=5V, largest stated typical operating current · p. 554
Takes asleep: 100 nA · Power-down/Standby, all peripherals stopped, VDD=3V, 25°C, typical · p. 555
A pin gives at most: 40 mA · I/O pin sink/source absolute maximum · p. 552
Junction to air (20-pin VQFN (ZCL)): 79.7 K/W · Junction-to-ambient thermal resistance · p. 624
Junction to case (20-pin VQFN (ZCL)): 36 K/W · Junction-to-case thermal resistance · p. 624
Edge: 2.7 ns · SPI master SCK rise time, typical · p. 564

What it is and has

CPU: AVR · p. 1
Maximum clock: 20 MHz · p. 1
Hardware multiplier: Two-cycle · p. 1
Interrupt controller: Two-level · p. 1
Flash memory: 16 KB · p. 12
SRAM: 2 KB · p. 12
EEPROM: 256 bytes · p. 1
Flash endurance: 10,000 cycles · p. 1
EEPROM endurance: 100,000 cycles · p. 1
Data retention: 40 years at 55°C · p. 1
Protection: Power-on Reset · p. 1
Protection: Brown-out Detector · p. 1
Internal oscillator: 16/20 MHz low-power RC · p. 1
Internal oscillator: 32.768 kHz Ultra Low-Power RC · p. 1
External crystal oscillator: 32.768 kHz · p. 2
Programming and debug: Single-pin UPDI · p. 2
Sleep modes: Idle, Standby, Power-Down · p. 94
Timer/Counter type B: 2, 16-bit, with input capture · p. 2
Timer/Counter type D: 1, 12-bit · p. 2
Watchdog: Window mode, separate on-chip oscillator · p. 2
USART: 1, fractional baud rate generator, auto-baud, start-of-frame detection · p. 2
SPI: 1, master/slave · p. 2
TWI: 1, dual address match · p. 2
TWI compatibility: Philips I2C · p. 2
TWI modes: Fast mode plus, 1 MHz · p. 2
Analog comparators: 3 · p. 2
ADC: 2, 10-bit, 115 ksps · p. 2
DAC: 3, 8-bit, one external channel · p. 2
Event System: CPU independent inter-peripheral signaling · p. 2
Configurable Custom Logic: 2 programmable look-up tables · p. 2
CRC: Automated memory scan · p. 2
Touch controller: Peripheral Touch Controller · p. 2
Touch inputs: Up to 12 self capacitance channels · p. 2
Touch inputs: Up to 36 mutual capacitance channels · p. 2
Touch shield: Driven shield · p. 2
External interrupt: All general purpose pins · p. 2
Programmable I/O: 18 lines · p. 3
Package option: 20-pin VQFN, 3x3 mm · p. 3
Package option: 20-pin SOIC300 · p. 3
Maximum CPU clock: 20 MHz · p. 1
I/O access: Single-cycle · p. 1
Flash endurance: 10,000 write/erase cycles · p. 1
EEPROM endurance: 100,000 write/erase cycles · p. 1
Reset: Power-on Reset (POR) · p. 1
Brown-out detection: Brown-out Detector (BOD) · p. 1
Internal RC oscillator: 16/20 MHz, low-power · p. 1
Internal ULP RC oscillator: 32.768 kHz · p. 1
Programming interface: UPDI 1-wire interface · p. 508
Hardware breakpoints: 2 · p. 508
User program breakpoints: Unlimited · p. 508
Power-on reset: POR · p. 1
Brown-out detector: BOD · p. 1
Internal RC oscillator: 16/20 MHz · p. 1
Internal ultra-low-power RC oscillator: 32.768 kHz · p. 1

Specifications

212

Parameter	Conditions	As printed	Page
Power Supply Voltage VDD		min -0.5 · max 6 V	552
Current into a VDD pin IVDD	T=[-40, 85]°C	max 200 mA	552
Current into a VDD pin IVDD	T=[85, 125]°C	max 100 mA	552
Current out of a GND pin IGND	T=[-40, 85]°C	max 200 mA	552
Current out of a GND pin IGND	T=[85, 125]°C	max 100 mA	552
RESET pin voltage with respect to GND VRST		min -0.5 · max 13 V	552
Pin voltage with respect to GND VPIN		min -0.5 V	552
I/O pin sink/source current IPIN		min -40 · max 40 mA	552
I/O pin injection current except RESET pin Ic1(1)	Vpin<GND-0.6V or 5.5V<Vpin≤6.1V; 4.9V<VDD≤5.5V	min -1 · max 1 mA	552
I/O pin injection current except RESET pin Ic2(1)	Vpin<GND-0.6V or Vpin≤5.5V; VDD≤4.9V	min -15 · max 15 mA	552
Sum of I/O pin injection current except RESET pin Ictot		min -45 · max 45 mA	552
Storage temperature Tstorage		min -65 · max 150 °C	552
Operating Supply Voltage VDD		min 1.8 · max 5.5 V	553
Operating temperature range(1) T	Standard temperature range	min -40 · max 105 °C	553
Operating system clock frequency CLK_CPU	VDD=[1.8, 5.5]V; T=[-40, 105]°C(1)	min 0 · max 5 MHz	553
Operating system clock frequency CLK_CPU	VDD=[2.7, 5.5]V; T=[-40, 105]°C(2)	min 0 · max 10 MHz	553
Operating system clock frequency CLK_CPU	VDD=[4.5, 5.5]V; T=[-40, 105]°C(3)	min 0 · max 20 MHz	553
Active power consumption	ATtiny1616; CLK_CPU=20 MHz (OSC20M); VDD=5V; T=25°C; peripherals disabled, without I/O drive	typ 10.2 mA	554
Active power consumption	ATtiny1616; CLK_CPU=10 MHz (OSC20M div2); VDD=5V; T=25°C; peripherals disabled, without I/O drive	typ 5.5 mA	554
Active power consumption	ATtiny1616; CLK_CPU=10 MHz (OSC20M div2); VDD=3V; T=25°C; peripherals disabled, without I/O drive	typ 3.1 mA	554
Active power consumption	ATtiny1616; CLK_CPU=5 MHz (OSC20M div4); VDD=5V; T=25°C; peripherals disabled, without I/O drive	typ 3.2 mA	554
Active power consumption	ATtiny1616; CLK_CPU=5 MHz (OSC20M div4); VDD=3V; T=25°C; peripherals disabled, without I/O drive	typ 1.8 mA	554
Active power consumption	ATtiny1616; CLK_CPU=5 MHz (OSC20M div4); VDD=2V; T=25°C; peripherals disabled, without I/O drive	typ 1.2 mA	554
Active power consumption	ATtiny1616; CLK_CPU=32 KHz (OSCULP32K); VDD=5V; T=25°C; peripherals disabled, without I/O drive	typ 13.5 uA	554
Active power consumption	ATtiny1616; CLK_CPU=32 KHz (OSCULP32K); VDD=3V; T=25°C; peripherals disabled, without I/O drive	typ 7.5 uA	554
Active power consumption	ATtiny1616; CLK_CPU=32 KHz (OSCULP32K); VDD=2V; T=25°C; peripherals disabled, without I/O drive	typ 5 uA	554
Idle power consumption	ATtiny1616; CLK_CPU=20 MHz (OSC20M); VDD=5V; T=25°C; peripherals disabled, without I/O drive	typ 4.3 mA	555
Idle power consumption	ATtiny1616; CLK_CPU=10 MHz (OSC20M div2); VDD=5V; T=25°C; peripherals disabled, without I/O drive	typ 2.5 mA	555
Idle power consumption	ATtiny1616; CLK_CPU=10 MHz (OSC20M div2); VDD=3V; T=25°C; peripherals disabled, without I/O drive	typ 1.4 mA	555
Idle power consumption	ATtiny1616; CLK_CPU=5 MHz (OSC20M div4); VDD=5V; T=25°C; peripherals disabled, without I/O drive	typ 1.6 mA	555
Idle power consumption	ATtiny1616; CLK_CPU=5 MHz (OSC20M div4); VDD=3V; T=25°C; peripherals disabled, without I/O drive	typ 0.9 mA	555
Idle power consumption	ATtiny1616; CLK_CPU=5 MHz (OSC20M div4); VDD=2V; T=25°C; peripherals disabled, without I/O drive	typ 0.6 mA	555
Idle power consumption	ATtiny1616; CLK_CPU=32 KHz (OSCULP32K); VDD=5V; T=25°C; peripherals disabled, without I/O drive	typ 8.2 uA	555
Idle power consumption	ATtiny1616; CLK_CPU=32 KHz (OSCULP32K); VDD=3V; T=25°C; peripherals disabled, without I/O drive	typ 4.2 uA	555
Idle power consumption	ATtiny1616; CLK_CPU=32 KHz (OSCULP32K); VDD=2V; T=25°C; peripherals disabled, without I/O drive	typ 2.6 uA	555
Standby power consumption	ATtiny1616; RTC running at 1.024 kHz from external XOSC32K (CL=7.5 pF); VDD=3V; typical at 25°C	typ 0.69 uA	555
Standby power consumption	ATtiny1616; RTC running at 1.024 kHz from internal OSCULP32K; VDD=3V; typical at 25°C, maximum at 85°C	typ 0.71 · max 6 uA	555
Standby power consumption	ATtiny1616; RTC running at 1.024 kHz from internal OSCULP32K; VDD=3V; maximum at 125°C	max 8 uA	555
Power-down/Standby power consumption are the same when all peripherals are stopped	ATtiny1616; all peripherals stopped; VDD=3V; typical at 25°C, maximum at 85°C	typ 0.1 · max 5 uA	555
Power-down/Standby power consumption are the same when all peripherals are stopped	ATtiny1616; all peripherals stopped; VDD=3V; maximum at 125°C	max 7 uA	555
Reset power consumption	ATtiny1616; Reset line pulled down; VDD=3V; typical at 25°C	typ 100 uA	555
Start-up time from any Reset release twakeup	VDD=3V; T=25°C; OSC20M	typ 200 us	557
Wake-up from Idle mode twakeup	OSC20M @ 20 MHz; VDD=5V; T=25°C	typ 1 us	557
Wake-up from Idle mode twakeup	OSC20M @ 10 MHz; VDD=3V; T=25°C	typ 2 us	557
Wake-up from Idle mode twakeup	OSC20M @ 5 MHz; VDD=2V; T=25°C	typ 4 us	557
Wake-up from Standby and Power-down mode twakeup	VDD=3V; T=25°C; OSC20M	typ 10 us	557
BOD	Continuous; VDD=3V; T=25°C; Idle Sleep mode; OSC20M at 1 MHz; module current only	typ 19 uA	558
BOD	Sampling @ 1 kHz; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 1.2 uA	558
TCA	16-bit count @ 1 MHz; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 12.6 uA	558
TCB	16-bit count @ 1 MHz; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 7.4 uA	558
RTC	16-bit count; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 1.2 uA	558
WDT	VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 0.7 uA	558
OSC20M	VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 125 uA	558
AC	Fast mode(2); CPU in Standby mode; VDD=3V; T=25°C; module current only	typ 92 uA	558
AC	Low-power mode(2); CPU in Standby mode; VDD=3V; T=25°C; module current only	typ 45 uA	558
ADC	50 ksps; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 325 uA	558
ADC	100 ksps; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 340 uA	558
XOSC32K	CL=7.5 pF; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 0.5 uA	558
USART	Enable @ 9600 Baud; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 13 uA	558
SPI (Master)	Enable @ 100 kHz; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 2.1 uA	558
TWI (Master)	Enable @ 100 kHz; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 23.9 uA	558
TWI (Slave)	Enable @ 100 kHz; VDD=3V; T=25°C; Idle Sleep mode; module current only	typ 17.1 uA	558
Flash programming	Erase Operation; VDD=3V; T=25°C; module current only	typ 1.5 mA	558
Flash programming	Write Operation; VDD=3V; T=25°C; module current only	typ 3 mA	558
Power-on Slope SRON		max 100 V/ms	558
POR threshold voltage on VDD falling VPOR	VDD falls/rises at 0.5 V/ms or slower	min 0.8 · max 1.6 V	559
POR threshold voltage on VDD rising VPOR	VDD falls/rises at 0.5 V/ms or slower	min 1.4 · max 1.8 V	559
BOD triggering level (falling/rising) VBOD	BODLEVEL7	min 3.9 · typ 4.2 · max 4.5 V	559
BOD triggering level (falling/rising) VBOD	BODLEVEL2	min 2.4 · typ 2.6 · max 2.9 V	559
BOD triggering level (falling/rising) VBOD	BODLEVEL0	min 1.7 · typ 1.8 · max 2 V	559
Interrupt level 0 VINT	Percentage above the selected BOD level	typ 4 %	559
Interrupt level 1 VINT	Percentage above the selected BOD level	typ 13 %	559
Interrupt level 2 VINT	Percentage above the selected BOD level	typ 25 %	559
Hysteresis VHYS	BODLEVEL7	typ 80 mV	559
Hysteresis VHYS	BODLEVEL2	typ 40 mV	559
Hysteresis VHYS	BODLEVEL0	typ 25 mV	559
Detection time TBOD	Continuous	typ 7 us	559
Detection time TBOD	Sampled, 1 kHz	typ 1 ms	559
Detection time TBOD	Sampled, 125 Hz	typ 8 ms	559
Start-up time Tstart	Time from enable to ready	typ 40 us	559
RESET pin threshold for high-voltage Reset VHVRST		min 11.5 · max 12.5 V	559
Input low-voltage for RESET VRST_VIL		min -0.2 V	559
Minimum pulse-width on RESET pin tRST		max 2.5 us	559
RESET pull-up resistor RRST	VReset=0V	min 20 · max 60 kΩ	559
Accuracy with 16 MHz and 20 MHz frequency selection relative to the factory-stored frequency value fOSC20M	Factory calibrated VDD=3V(1); T=[0, 70]°C; VDD=[1.8, 4.5]V(3)	min -2 · max 2 %	560
Accuracy with 16 MHz and 20 MHz frequency selection relative to the factory-stored frequency value fOSC20M	Factory calibrated VDD=5V(1); T=[0, 70]°C; VDD=[4.5, 5.5]V(3)	min -2 · max 2 %	560
Accuracy with 16 MHz and 20 MHz frequency selection fOSC20M	Factory calibrated; T=25°C, 3.0V	min -3 · max 3 %	560
Accuracy with 16 MHz and 20 MHz frequency selection fOSC20M	Factory calibrated; T=[0, 70]°C; VDD=[1.8, 3.6]V(3)	min -4 · max 4 %	560
Accuracy with 16 MHz and 20 MHz frequency selection fOSC20M	Factory calibrated; Full operation range(3)	min -5 · max 5 %	560
User calibration range fCAL	OSC20M(2) = 16 MHz	min 14.5 · max 17.5 MHz	560
User calibration range fCAL	OSC20M(2) = 20 MHz	min 18.5 · max 21.5 MHz	560
Calibration step size %CAL		typ 1.5 %	560
Duty cycle DC		typ 50 %	560
Start-up time Tstart	Within 2% accuracy	typ 8 us	560
Accuracy fOSCULP32K	Factory calibrated; T=25°C, 3.0V	min -3 · max 3 %	560
Accuracy fOSCULP32K	Factory calibrated; T=[0, 70]°C; VDD=[1.8, 3.6]V(1)	min -10 · max 10 %	560
Accuracy fOSCULP32K	Factory calibrated; Full operation range(1)	min -30 · max 30 %	560
Start-up time Tstart		typ 250 us	560
Frequency Fout		typ 32.768 kHz	560
Start-up time Tstart	CL=7.5 pF	typ 300 ms	560
Crystal load capacitance CL		min 7.5 · max 12.5 pF	560
Parasitic capacitor load CTOSC1		typ 5.5 pF	561
Parasitic capacitor load CTOSC2		typ 5.5 pF	561
Equivalent Series Resistance - Safety Factor=3 ESR	CL=7.5 pF	max 80 kΩ	561
Equivalent Series Resistance - Safety Factor=3 ESR	CL=12.5 pF	max 40 kΩ	561
Frequency fCLCL	VDD=[1.8, 5.5]V	min 0 · max 5 MHz	561
Frequency fCLCL	VDD=[2.7, 5.5]V	min 0 · max 10 MHz	561
Frequency fCLCL	VDD=[4.5, 5.5]V	min 0 · max 20 MHz	561
Clock Period tCLCL	VDD=[1.8, 5.5]V	min 200 ns	561
Clock Period tCLCL	VDD=[2.7, 5.5]V	min 100 ns	561
Clock Period tCLCL	VDD=[4.5, 5.5]V	min 50 ns	561
High Time tCHCX	VDD=[1.8, 5.5]V	min 80 ns	561
High Time tCHCX	VDD=[2.7, 5.5]V	min 40 ns	561
High Time tCHCX	VDD=[4.5, 5.5]V	min 20 ns	561
Low Time tCLCX	VDD=[1.8, 5.5]V	min 80 ns	561
Low Time tCLCX	VDD=[2.7, 5.5]V	min 40 ns	561
Low Time tCLCX	VDD=[4.5, 5.5]V	min 20 ns	561
Input low-voltage, except RESET pin as I/O VIL		min -0.2 V	561
I/O pin drive strength VOL	VDD=1.8V, IOL=1.5 mA	max 0.36 V	561
I/O pin drive strength VOL	VDD=3.0V, IOL=7.5 mA	max 0.6 V	561
I/O pin drive strength VOL	VDD=5.0V, IOL=15 mA	max 1 V	561
I/O pin drive strength VOH	VDD=1.8V, IOH=1.5 mA	min 1.44 V	561
I/O pin drive strength VOH	VDD=3.0V, IOH=7.5 mA	min 2.4 V	561
I/O pin drive strength VOH	VDD=5.0V, IOH=15 mA	min 4 V	561
Maximum combined I/O sink current per pin group(1) Itotal		max 100 mA	561
Maximum combined I/O source current per pin group(1) Itotal		max 100 mA	561
θJA [°C/W] θJA	20-pin VQFN (ZCL)	typ 79.7 °C/W	624
θJC [°C/W] θJC	20-pin VQFN (ZCL)	typ 36 °C/W	624
I/O pin injection current except RESET pin Ic1	Vpin<GND-0.6V or 5.5V<Vpin≤6.1V; 4.9V<VDD≤5.5V; note 1	min -1 · max 1 mA	552
I/O pin injection current except RESET pin Ic2	Vpin<GND-0.6V or Vpin≤5.5V; VDD≤4.9V; note 1	min -15 · max 15 mA	552
Operating Supply Voltage VDD	Operation ensured down to 1.8V or BOD triggering level, VBOD; extended temperature range only ensured down to 2.7V	min 1.8 · max 5.5 V	553
Operating temperature range T	Standard temperature range; refer to device ordering codes	min -40 · max 105 °C	553
Operating temperature range T	Extended temperature range; only ensured down to 2.7V; refer to device ordering codes	min -40 · max 125 °C	553
Operating system clock frequency CLK_CPU	VDD=[1.8, 5.5]V; T=[-40, 105]°C; operation ensured down to BOD triggering level with BODLEVEL0	min 0 · max 5 MHz	553
Operating system clock frequency CLK_CPU	VDD=[2.7, 5.5]V; T=[-40, 105]°C; operation ensured down to BOD triggering level with BODLEVEL2	min 0 · max 10 MHz	553
Operating system clock frequency CLK_CPU	VDD=[4.5, 5.5]V; T=[-40, 105]°C; operation ensured down to BOD triggering level with BODLEVEL7	min 0 · max 20 MHz	553
Operating system clock frequency CLK_CPU	VDD=[2.7, 5.5]V; T=[-40, 125]°C; operation ensured down to BOD triggering level with BODLEVEL2	min 0 · max 8 MHz	553
Operating system clock frequency CLK_CPU	VDD=[4.5, 5.5]V; T=[-40, 125]°C; operation ensured down to BOD triggering level with BODLEVEL7	min 0 · max 16 MHz	553
Standby power consumption	ATtiny1616; RTC running at 1.024 kHz from external XOSC32K (CL=7.5 pF); VDD=3V; T=25°C	typ 0.69 uA	555
Standby power consumption	ATtiny1616; RTC running at 1.024 kHz from internal OSCULP32K; VDD=3V; T=25°C	typ 0.71 uA	555
Standby power consumption	ATtiny1616; RTC running at 1.024 kHz from internal OSCULP32K; VDD=3V; T=85°C	max 6 uA	555
Standby power consumption	ATtiny1616; RTC running at 1.024 kHz from internal OSCULP32K; VDD=3V; T=125°C	max 8 uA	555
Power-down/Standby power consumption are the same when all peripherals are stopped	ATtiny1616; all peripherals stopped; VDD=3V; T=25°C	typ 0.1 uA	555
Power-down/Standby power consumption are the same when all peripherals are stopped	ATtiny1616; all peripherals stopped; VDD=3V; T=85°C	max 5 uA	555
Power-down/Standby power consumption are the same when all peripherals are stopped	ATtiny1616; all peripherals stopped; VDD=3V; T=125°C	max 7 uA	555
Reset power consumption	ATtiny1616; reset line pulled down; VDD=3V; T=25°C	typ 100 uA	555
Start-up time from any Reset release twakeup	VDD=3V; T=25°C; OSC20M system clock	typ 200 us	557
Wake-up from Standby and Power-down mode twakeup	VDD=3V; T=25°C; OSC20M system clock	typ 10 us	557
BOD	Continuous; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 19 uA	558
BOD	Sampling @ 1 kHz; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 1.2 uA	558
TCA	16-bit count @ 1 MHz; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 12.6 uA	558
TCB	16-bit count @ 1 MHz; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 7.4 uA	558
RTC	16-bit count; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 1.2 uA	558
WDT	VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 0.7 uA	558
OSC20M	VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 125 uA	558
AC	Fast mode; CPU in Standby mode; VDD=3V; T=25°C; module current only	typ 92 uA	558
AC	Low-power mode; CPU in Standby mode; VDD=3V; T=25°C; module current only	typ 45 uA	558
ADC	50 ksps; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 325 uA	558
ADC	100 ksps; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 340 uA	558
XOSC32K	CL=7.5 pF; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 0.5 uA	558
USART	Enable @ 9600 Baud; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 13 uA	558
SPI (Master)	Enable @ 100 kHz; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 2.1 uA	558
TWI (Master)	Enable @ 100 kHz; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 23.9 uA	558
TWI (Slave)	Enable @ 100 kHz; VDD=3V; T=25°C; OSC20M at 1 MHz; Idle Sleep; module current only	typ 17.1 uA	558
SCK clock frequency fSCK	Master	max 10 MHz	563
SCK period tSCK	Master	min 100 ns	563
SCK rise time tSCKR	Master	typ 2.7 ns	563
SCK fall time tSCKF	Master	typ 2.7 ns	563
MISO setup to SCK tMIS	Master	typ 10 ns	563
MISO hold after SCK tMIH	Master	typ 10 ns	563
MOSI hold after SCK tMOH	Master	typ 1 ns	563
Slave SCK clock frequency fSSCK	Slave	max 5 MHz	564
SCK rise time tSSCKR	Slave	max 1600 ns	564
SCK fall time tSSCKF	Slave	max 1600 ns	564
MOSI setup to SCK tSIS	Slave	min 3 ns	564
SS setup to SCK tSSS	Slave	min 21 ns	564
SS hold after SCK tSSH	Slave	min 20 ns	564
MISO setup to SCK tSOS	Slave	typ 8 ns	564
MISO hold after SCK tSOH	Slave	typ 13 ns	564
MISO setup after SS low tSOSS	Slave	typ 11 ns	565
MISO hold after SS low tSOSH	Slave	typ 8 ns	565
SCL clock frequency fSCL	Max. frequency requires system clock at 10 MHz, which, in turn, requires VDD=[2.7, 5.5]V and T=[-40, 105]°C	min 0 · max 1000 kHz	565
Output low voltage VOL	Iload=3 mA, Normal mode, VDD>2V	max 0.4 V	565
Low-level output current IOL	fSCL≤400 kHz, VOL=0.4V	min 3 mA	565
Low-level output current IOL	fSCL≤1 MHz, VOL=0.4V	min 20 mA	565
Capacitive load for each bus line CB	fSCL≤100 kHz	max 400 pF	565
Capacitive load for each bus line CB	fSCL≤400 kHz	max 400 pF	565
Capacitive load for each bus line CB	fSCL≤1 MHz	max 550 pF	565
Internal reference voltage INT11V	VDD=[1.8V, 3.6V]; T=[0 - 105]°C; based on characterization, not covered by production test limits	min -2 · max 2 %	568
Internal reference voltage INT055V, INT15V, INT25V	VDD=[1.8V, 3.6V]; T=[0 - 105]°C; based on characterization, not covered by production test limits	min -3 · max 3 %	568
Internal reference voltage INT055V, INT11V, INT15V, INT25V, INT43V	VDD=[1.8V, 5.5V]; T=[-40 - 125]°C; based on characterization, not covered by production test limits	min -5 · max 5 %	568
Internal reference voltage INT055V, INT11V, INT15V, INT25V	VDD=[1.8V, 3.6V]; T=[0 - 105]°C; based on characterization, not covered by production test limits	min -3 · max 3 %	568
Supply Voltage(1) VDD	DAC; supply voltage must meet the VDD specification for the VREF level used as DAC reference	min 1.8 · typ 3 · max 5.5 V	571
Resistive External Load RLoad	DAC	min 5 kΩ	571
Capacitive External Load CLoad	DAC	max 30 pF	571
Output Voltage Range VOUT	DAC; maximum VDD-0.2 V	min 0.2 V	571
Output sink/source IOUT	DAC	typ 1 mA	571
Maximum Conversion Rate fDAC	0.55V≤ VREF≤2.5V	typ 350 ksps	571
Maximum Conversion Rate fDAC	VREF=4.3V	typ 270 ksps	571
Resolution Res		max 8 bits	571
Integral Non-Linearity INL	0.55V≤VREF≤4.3	typ 0.3 LSB	571
Differential Non-Linearity DNL	0.55V≤VREF≤4.3	typ 0.25 LSB	571
Offset Error EOFF	VREF =1.1V, VCC = 3.0 T=25°C; typical ±0.25 LSB	typ 0.25 LSB	571
Gain Error EGAIN	VREF=1.1V, VCC = 3.0 T=25°C; typical ±1 LSB	typ 1 LSB	571
Input voltage VIN	maximum VDD	min -0.2 V	571
Input pin capacitance CIN	PA6	typ 9 pF	571
Input pin capacitance CIN	PA7, PB5, PB4	typ 5 pF	571
Input offset voltage VOFF	VIN=VDD/2; typical <5 mV	min -20 · max 20 mV	571
Input leakage current IL		typ 5 nA	571
Start-up time TSTART		typ 1.3 us	571
θJA θJA	20-pin VQFN (ZCL)	typ 79.7 °C/W	624
θJC θJC	20-pin VQFN (ZCL)	typ 36 °C/W	624

Pins, by the datasheet

1 PA2: GPIO; EVOUT0, ADC0 AIN2, alternate USART0 RxD, SPI0 MISO, alternate TWI0 SCL, CCL LUT0-IN2. · p. 17
2 PA3: GPIO; EXTCLK, ADC0 AIN3, alternate USART0 XCK, SPI0 SCK, TCA0 WO3, TCB1 WO. · p. 17
3 GND: Ground. · p. 16
4 VDD: Input supply. · p. 16
5 PA4: GPIO; ADC0 AIN4, ADC1 AIN0, PTC X0/Y0, alternate USART0 XDIR, SPI0 SS, TCA0 WO4, TCD0 WOA, CCL LUT0-OUT. · p. 17
6 PA5: GPIO; VREFA, ADC0 AIN5, ADC1 AIN1, PTC X1/Y1, AC0 OUT, AC1 AINN0, TCA0 WO5, TCB0 WO, TCD0 WOB. · p. 17
7 PA6: GPIO; ADC0 AIN6, ADC1 AIN2, PTC X2/Y2, AC0 AINN0, AC1 AINP1, AC2 AINP0, DAC0 OUT. · p. 17
8 PA7: GPIO; ADC0 AIN7, ADC1 AIN3, PTC X3/Y3, AC0 AINP0, AC1 AINP0, AC2 AINN0, CCL LUT1-OUT. · p. 17
9 PB5: GPIO; CLKOUT, ADC0 AIN8, PTC X12/Y12, AC0 AINP1, AC2 AINP2, alternate TCA0 WO2. · p. 17
10 PB4: GPIO; ADC0 AIN9, PTC X13/Y13, AC0 AINN1, AC1 AINP3, alternate TCA0 WO1, alternate CCL LUT0-OUT. · p. 17
11 PB3: GPIO; TOSC1, AC1 OUT, USART0 RxD, alternate TCA0 WO0. · p. 17
12 PB2: GPIO; TOSC2, EVOUT1, AC2 OUT, USART0 TxD, TCA0 WO2. · p. 17
13 PB1: GPIO; ADC0 AIN10, PTC X4/Y4, AC0 AINP2, USART0 XCK, TWI0 SDA, TCA0 WO1. · p. 17
14 PB0: GPIO; ADC0 AIN11, PTC X5/Y5, AC1 AINP2, AC2 AINP1, USART0 XDIR, TWI0 SCL, TCA0 WO0. · p. 17
15 PC0: GPIO; ADC1 AIN6, PTC X6/Y6, alternate SPI0 SCK, alternate TCB0 WO, TCD0 WOC. · p. 17
16 PC1: GPIO; ADC1 AIN7, PTC X7/Y7, alternate SPI0 MISO, TCD0 WOD, alternate CCL LUT1-OUT. · p. 17
17 PC2: GPIO; EVOUT2, ADC1 AIN8, PTC X8/Y8, alternate SPI0 MOSI. · p. 17
18 PC3: GPIO; ADC1 AIN9, PTC X9/Y9, alternate SPI0 SS, alternate TCA0 WO3, CCL LUT1-IN0. · p. 17
19 PA0: GPIO; RESET/UPDI, ADC0 AIN0, CCL LUT0-IN0. · p. 17
20 PA1: GPIO; ADC0 AIN1, alternate USART0 TxD, SPI0 MOSI, alternate TWI0 SDA, CCL LUT0-IN1. · p. 17

Ordering codes, by the datasheet

ATtiny1616-MNR: VQFN · 16 KB Flash, 2 KB SRAM; 20 MHz; 1.8V to 5.5V; -40°C to +105°C; Tape & Reel · p. 614
ATtiny1616-MFR: VQFN · 16 KB Flash, 2 KB SRAM; 16 MHz; 2.7V to 5.5V; -40°C to +125°C; Tape & Reel · p. 614
ATtiny1616-SNR: SOIC · 16 KB Flash, 2 KB SRAM; 20 MHz; 1.8V to 5.5V; -40°C to +105°C; Tape & Reel · p. 614
ATtiny1616-SN: SOIC · 16 KB Flash, 2 KB SRAM; 20 MHz; 1.8V to 5.5V; -40°C to +105°C; Tube or Tray · p. 614
ATtiny1616-SFR: SOIC · 16 KB Flash, 2 KB SRAM; 16 MHz; 2.7V to 5.5V; -40°C to +125°C; Tape & Reel · p. 614
ATtiny1616-SF: SOIC · 16 KB Flash, 2 KB SRAM; 16 MHz; 2.7V to 5.5V; -40°C to +125°C; Tube or Tray · p. 614

Parameters

ADC (Bit): 10bit
CPU Core: AVR
CPU Maximum Speed: 20MHz
Core Size: 8 Bit
Current - Supply: 10.2mA
Current - Supply(Max): 10.2mA
DAC (Bit): 8bit
EEPROM: 256Byte
Features: Window watchdog (WWDG)
Number of I/O: 18
Operating Temperature: -40℃~+105℃
Oscillator Type: Built-in
Output Current per Pin(Max): 40mA
Program Memory Type: FLASH
Program Storage Size: 16KB
RAM Size: 2KB
Rise Time: 2.7ns
Standby Current: 100nA
Thermal Resistance(Junction to Ambient): 79.7℃/W
Thermal Resistance(Junction to Case): 36℃/W
Voltage - Supply: 1.8V~5.5V
Voltage - Supply(Absolute Max): 6V

Order codes

ATTINY1616-MNRLCSC C507118

Pinout

The pins of the ATTINY1616-MN
Pin	Name	Type
1	PA2	Input/output
2	PA3	Input/output
3	GND	Power in
4	VCC	Power in
5	PA4	Input/output
6	PA5	Input/output
7	PA6	Input/output
8	PA7	Input/output
9	PB5	Input/output
10	PB4	Input/output
11	PB3	Input/output
12	PB2	Input/output
13	PB1	Input/output
14	PB0	Input/output
15	PC0	Input/output
16	PC1	Input/output
17	PC2	Input/output
18	PC3	Input/output
19	RESET/PA0	Input/output
20	PA1	Input/output
21	GND	Passive

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Open-source boards using it

103See all 103

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World's Smallest Nintendo Wii, using a trimmed motherboard and custom stacked PCBs
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kaminaris/GigaESC

209 parts47
2 layers56.9 × 23.6 mm
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kieraneglin/hexagon-art
A passive breakout board: two lever-terminal inputs, three JST XH outputs, all six conductors (RX bus, two spares, +12V, GND, +5V) paralleled straight across. No active components, no regulation, nothing to configure.
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Flashlight
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This repository contains design files for the development board for a flashlight boost driver. The test firmware can be found in the firmware repository.
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2 layers29 × 36 mm
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Parts like it

Questions

Is there a KiCad symbol and footprint for the ATTINY1616-MN?

Yes. The symbol is MCU_Microchip_ATtiny:ATtiny1616-M and the footprint Package_DFN_QFN:VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the ATTINY1616-MN?

QFN-20-EP(3x3), with 21 pins. Its footprint is drawn on this page.

Where is the ATTINY1616-MN datasheet?

Microchip Technology publishes it: the Datasheet link on this page opens it.

Where can I order the ATTINY1616-MN?

JLCPCB lists it as part C507118, with 3 in stock; the sellers' links on this page open their listings.

What can replace the ATTINY1616-MN?

Parts like it in the library: the ATTINY816-MN by Microchip Technology, the ATTINY416-MN by Microchip Technology, the ATTINY1616-MF by Microchip Technology and the ATTINY1606-MN by Microchip Technology. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the ATTINY1616-MN?

103 boards in 71 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

ATTINY1616-MN

Overview

Symbol

Footprint

From the datasheet

What it is and has

Specifications

Pins, by the datasheet

Ordering codes, by the datasheet

Open-source boards using it

Ss main board

SiliCa

DevKit

Hexagon

Flashlight

Flux Capacitor Micro Pin Badge

Stormbreaker

PiicoDev Radio

Parts like it

ATTINY816-MN

ATTINY416-MN

ATTINY1616-MF

ATTINY1606-MN

ATTINY826-MU

ATTINY1626-MF

ATTINY3226-MF

ATTINY426-MU