4 layers257 × 117.5 mm

Teacup carrier
thingino/teacup-neo
Universal Ingenic SoC development platform: one carrier + per-SoC interposer modules (T10 through A1, any package) on a DDR4 card edge, with an ESP32-S3 BMC for autonomous LLM-driven development.
157 parts1GPL-3.0
