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Boards using the REF3312AIDBZR

3 boards

Boards in 2 GitHub repositories, designed in KiCad, that use the REF3312AIDBZR by Texas Instruments (-40℃~+125℃@(Ta) 1.25V 1.8V~5.5V 30mA 30ppm/℃ 35uVp-p 8.5uA Fixed Series ±0.15% SOT-23 Voltage Reference ROHS). See how each wires it, with its parts, size, README and files; the REF3312AIDBZR’s symbol, footprint and pinout are on its own page.

  • 4 layers65 × 75 mmMicroduck Power Regen R22, the printed circuit board in 3D

    Microduck Power Regen R22

    ldcyes/OpenDuck

    已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

    84 parts
  • 2 layers50 × 70 mmNeuromorphic ir event sensor, the printed circuit board in 3D

    Neuromorphic ir event sensor

    RyanHailey21/neuromorphic-ir-event-sensor

    Neuromorphic Infrared Event Sensor (Rev A) - 4-Quadrant Temporal Contrast Analog Front-End in KiCad 10

    123 parts
  • 2 layers32 × 30 mmMicroduck Brake Control R8, the printed circuit board in 3D

    Microduck Brake Control R8

    ldcyes/OpenDuck

    已完成可编辑原理图、真实四层 PCB 和本地库。阶梯板面积 4510 mm²,比原 65×60 + 32×30 mm 两板总面积 4860 mm² 少 350 mm²(7.20%)。原 TDK 模块本体、四个安装孔和原 TDK 器件位置保留,回生电容采用原料号卧装,J1 因实际拔插通道冲突改为同系列 BM08 顶插。当前为工程候选,未制造,未完成热、回生瞬态、低电量或行走验收。

    43 parts