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Boards using the LA55-P

6 boards

Boards in 2 GitHub repositories, designed in KiCad, that use the LA55-P by LEM (-12V~15V -40℃~+85℃ 2.5kVrms 200kHz 50A Support 插件 Current Sensors ROHS). See how each wires it, with its parts, size, README and files; the LA55-P’s symbol, footprint and pinout are on its own page.

  • 2 layers99.1 × 78.7 mmDCAC, the printed circuit board in 3D

    DCAC

    danieltyukov/tue-wireless-energy-transfer

    TUE / Wireless Energy Transfer

    36 parts1
  • 4 layers100 × 100 mmInverterLem, the printed circuit board in 3D

    InverterLem

    horychen/ProjectEureka

    12 phase motor drive including inverter, microcontroller-mother-board, sensing, communication, DAC, etc.

    104 parts17GPL-3.0
  • 2 layers70.4 × 164.8 mmSensorLEM portable, the printed circuit board in 3D

    SensorLEM portable

    horychen/ProjectEureka

    12 phase motor drive including inverter, microcontroller-mother-board, sensing, communication, DAC, etc.

    76 parts17GPL-3.0
  • 2 layers67.7 × 153.2 mmSensorLEM portable(Guan to kicad), the printed circuit board in 3D

    SensorLEM portable(Guan to kicad)

    horychen/ProjectEureka

    12 phase motor drive including inverter, microcontroller-mother-board, sensing, communication, DAC, etc.

    98 parts17GPL-3.0
  • 4 layers111.7 × 25.8 mmSensorLEM1, the printed circuit board in 3D

    SensorLEM1

    horychen/ProjectEureka

    12 phase motor drive including inverter, microcontroller-mother-board, sensing, communication, DAC, etc.

    79 parts17GPL-3.0
  • 2 layers100 × 80 mmDc to dc buck converter, the printed circuit board in 3D

    Dc to dc buck converter

    danieltyukov/tue-wireless-energy-transfer

    TUE / Wireless Energy Transfer

    34 parts1