4 layers49.8 × 44.2 mm
STM32F4 HexGauge V3
s-grundner/CTN-HexGauge
Customizable Automotive Gauge with CAN Bus interface and Integrated Inertial Measurement Unit
73 parts1
4 layers50 × 50 mm
STM32-DevBoard
s-grundner/STM32-DevBoard1STM32 Breakout Board with various Sensors
- Size
- 50 × 50 mm
- Copper layers
- 4
- Thickness
- 1.6 mm
- Parts
- 106
- Nets
- 103
- Pads
- 342
- Tracks, vias
- 457, 170
- Pours
- 15
- Routed
- Yes
- KiCad
- KiCad 7 (file 20221018)
- Created
- 20 Aug 2023
- Updated
- 5 Sep 2023
Overview
STM32-DevBoard is an open-source printed circuit board by s-grundner, from the s-grundner/STM32-DevBoard repository on GitHub. It is a 4-layer board of 50 × 50 mm with 106 parts on 103 nets, routed with 457 tracks and 170 vias.
It is built around the STM32F405RGT6, SN65HVD230D and SHTC3, with the AMS1117-3.3, AT24C256N and MPU-6050 among its other parts. Its parts include 30 capacitors, 28 resistors, 19 diodes, 9 connectors and 6 ICs. It belongs with the microcontroller boards and sensors and measurement boards and the STM32 boards of this library.
Main components
7
STM32F405RGT6
LQFP-64(10x10)-40℃~+85℃ 1.8V~3.6V 12bit 12bit 168MHz 192KB 1MB 32 Bit 51 ARM Cortex-M4 Built-in FLASH LQFP-64(10x10) Microcontrollers (MCU/MPU/SOC) ROHSSTMicroelectronicsMicrocontrollers (MCU/MPU/SOC)
SN65HVD230D
SOIC-8-40℃~+85℃ 1 17mA 1Mbps 370uA 3V~3.6V CAN Transceiver Low-power mode、Wake-up function、ESD protection、Thermal shutdown protection、Bus fault protection、Hot-swap protection SOIC-8 CAN Transceivers ROHSTexas InstrumentsCAN Transceivers
SHTC3
Digital I²C temperature / humidity sensor. Input voltage: 1.62 - 3.6 V Typical accuracy: ±2 %RH and ±0.2 °C Datasheet: https://www.sensirion.com/shtc3/SensirionUncategorised
AMS1117-3.3
SOT-223-40℃~+125℃ 0.003%Vout 1 1.1V@(800mA) 15V 1A 3.3V 5mA 72dB@(120Hz) Fixed Over Current Protection、Short Circuit Protection、Thermal shutdown Positive SOT-223 Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHSAdvanced Monolithic SystemsVoltage Regulators - Linear, Low Drop Out (LDO) Regulators
AT24C256N
DIP-8-40℃~+85℃ 1,000,000 cycles 1.8V~5.5V 100 Years 1MHz 256Kbit 5ms Hardware write protection function、Noise suppression function、Built-in power-on reset (POR) I2C DIP-8 EEPROM ROHSHGSEMIEEPROM
MPU-6050
QFN-24-EP(4x4)-40℃~+85℃ 16bit 1KB 2.375V~3.46V 5uA Accelerometer Gyroscope I2C X,Y,Z X,Y,Z ±16g ±2000dps QFN-24-EP(4x4) Accelerometers ROHSTDK InvenSenseAccelerometers
B5819W
SOD-123-55℃~+125℃ 1.5A 1mA@40V 25A 40V 600mV@1A Standalone SOD-123 Schottky Diodes ROHSMDDSchottky Diodes
README
README.mdSTM32 Devboard
With onboard Temp/Humidity Sensor and IMU
Primary goal is to use components I have stock
Repository Structure
Documentation
Manufacturing
Simulations
Source Code
Parts
106| Qty | Value | Footprint | References |
|---|---|---|---|
| 16 | 3V3 | Diode_SMD:D_SOD-923 | D3, D4, D5, D6, D7, D8, D9, D10, D11, D12, D13, D15, D17, D18, D20, D22 |
| 15 | 100n | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C1, C2, C3, C4, C5, C7, C15, C17, C18, C20, C27, C28, C29, C30, C31 |
| 10 | 1k5 | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R4, R5, R6, R11, R23, R24, R25, R26, R27, R28 |
| 7 | 10R | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R7, R17, R18, R19, R20, R21, R22 |
| 6 | 2u2 | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C8, C9, C10, C22, C26, C33 |
| 3 | 10k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R2, R3, R8 |
| 3 | ~ | JLC:JLC_Tooling | H4, H4, H4 |
| 2 | 100R @ 100MHz | Inductor_SMD:L_0805_2012Metric_Pad1.05x1.20mm_HandSolder | FB1, FB2 |
| 2 | 12p | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C11, C12 |
| 2 | 150R | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R10, R12 |
| 2 | 47R | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R9, R14 |
| 2 | 560n | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C23, C25 |
| 2 | 56R | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R13, R15 |
| 2 | AGPIO | Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical | J3, J12 |
| 1 | 0R | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R1 |
| 1 | 10n | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C19 |
| 1 | 22u | Capacitor_THT:C_Radial_D5.0mm_H7.0mm_P2.00mm | C14 |
| 1 | 25MHz 12pF | Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm | Y1 |
| 1 | 2n2 | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C16 |
| 1 | 4u7 | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C6 |
| 1 | 5k6 | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R16 |
| 1 | 820n | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C13 |
| 1 | AMS1117-3.3 | Package_TO_SOT_SMD:SOT-223-3_TabPin2 | U8 |
| 1 | AT24C256 | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U4 |
| 1 | B5819W | Diode_SMD:D_SOD-123 | D24 |
| 1 | CAN | Connector_Molex:Molex_Micro-Latch_53254-0470_1x04_P2.00mm_Horizontal | J1 |
| 1 | EEPROM_WP | Button_Switch_THT:SW_E-Switch_EG1271_SPDT | SW3 |
| 1 | GN | LED_THT:LED_D3.0mm | D2 |
| 1 | I2C | Connector_Molex:Molex_Micro-Latch_53254-0470_1x04_P2.00mm_Horizontal | J10 |
| 1 | LED_RGBA | LED_SMD:LED_SK6812MINI_PLCC4_3.5x3.5mm_P1.75mm | D1 |
| 1 | LOGO | Symbol:Lock_S | G*** |
| 1 | LOGO | Symbol:Temp | G*** |
| 1 | LOGO | Symbol:Gyro_Logo | G*** |
| 1 | LOGO | Symbol:Unlock_S | G*** |
| 1 | LOGO | Symbol:Storage_S | G*** |
| 1 | MPU-6050 | Sensor_Motion:InvenSense_QFN-24_4x4mm_P0.5mm | U1 |
| 1 | PWM0 | Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical | J11 |
| 1 | SHTC3 | Sensor_Humidity:Sensirion_DFN-4-1EP_2x2mm_P1mm_EP0.7x1.6mm | U2 |
| 1 | SN65HVD230 | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U6 |
| 1 | SPI/UART | Connector_Molex:Molex_Micro-Latch_53254-0570_1x05_P2.00mm_Horizontal | J8 |
| 1 | SPI_NSS/GPIO | Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical | J9 |
| 1 | STM32F405RGT6 | Package_QFP:LQFP-64_10x10mm_P0.5mm | U3 |
| 1 | SWD | Connector_PinHeader_2.54mm:PinHeader_2x05_P2.54mm_Vertical | J6 |
| 1 | SW_Omron_B3FS | Button_Switch_THT:SW_PUSH_6mm | SW2 |
| 1 | SW_SPDT | Button_Switch_THT:SW_E-Switch_EG1271_SPDT | SW1 |
| 1 | USB_A | Connector_USB:USB_A_CONNFLY_DS1095-WNR0 | J5 |
Questions
How big is the STM32-DevBoard PCB?
It measures 50 × 50 mm and has 4 copper layers, 1.6 mm thick.
What parts does the STM32-DevBoard use?
106 parts, built around the STM32F405RGT6, SN65HVD230D, SHTC3 and AMS1117-3.3. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the STM32-DevBoard KiCad files?
From the s-grundner/STM32-DevBoard repository on GitHub, at the commit this page was made from: the board is manufacturing/STM32_DevBoard/STM32_DevBoard.kicad_pcb and its schematic manufacturing/STM32_DevBoard/BSB.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the STM32-DevBoard design in my own project?
Its repository states no licence, so its author keeps all rights: ask s-grundner before reusing the design.
Similar boards
- 4 layers90 × 100 mm
- 4 layers50 × 50 mm
STM32F4 Breakout
PhilCarPi/STM32F4_Breakout_Board
4 layer PCB that serves as a breakout board to an STM32F405 chip with an additional IMU chip just for fun. The breakout is for serial ports SPI, USART, I2C, and SWD.
56 parts2 - 4 layers40 × 36 mm
- 2 layers50 × 66 mm
- 4 layers51 × 60.1 mm
Flight computer pcb
aminjahanpour/flight_computer_pcb
This repo contains KiCad files for an open source flight computer PCB.
87 parts - 2 layers150 × 100 mm
SmartCube
kokhaie/Smart-Refrigerator-Demo
The KiCad-generated BOM is mirrored into the documentation site under docs/ so it can be published through GitHub Pages.
91 parts - 4 layers132.5 × 105 mm
HEXCORE PCB Design v0
JoshCrouch/HEXCORE
HEXCORE is a Hexapod-type robot that includes both a custom remote as well as vision system making use of 2.4GHz RF and WiFi respectively.
160 parts3