Skip to the content
4 layers34 × 28 mmDevice, the printed circuit board in 3D

Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

Size
34 × 28 mm
Copper layers
4
Thickness
1.6 mm
Parts
30
Nets
39
Pads
0
Tracks, vias
0, 5
Routed
Not yet
KiCad
KiCad 6 (file 20211014)
Created
12 Jun 2026
Updated
6 Nov 2026

Overview

Device is an open-source printed circuit board by jayis1, from the jayis1/hardware-design-lab repository on GitHub. It is a 4-layer board of 34 × 28 mm with 30 parts on 39 nets.

It is built around the STM32G474CEU6, BMD-300-A-R and AD8429ARZ, with the ADS8866IDRCR, THS3091D and TPS63020DSJR among its other parts. Its parts include 12 ICs, 7 resistors, 4 capacitors, 4 inductors and 2 connectors. It belongs with the STM32 boards of this library.

Main components

11

README

README.md

Hardware Design Lab

Author: jayis1

Full-cycle, open-source hardware device designs — from concept to KiCad schematics to production firmware to companion mobile apps. Every device is fully open: schematics, board layouts, C/Python firmware, and React Native apps. Each device lives in its own subfolder with complete deliverables.

What's Inside Every Device

Every device folder contains the full stack — not just docs, but real buildable artifacts:

CategoryFilesDescription
Engineering Docsphase1_conceptual_architecture.md → phase4_software_stack.md4-phase design process: requirements, BOM & netlists, PCB layout rules, software stack
KiCad Schematicskicad/*.kicad_pro, *.kicad_sch, *.kicad_pcbFull schematic with real component symbols, net labels, power flags, and board outline with placed footprints
C/Python Firmwarefirmware/main.c, registers.h, board.h, drivers/, MakefileProduction-quality MCU firmware — init code, drivers with DMA, USB descriptors, wire protocol
React Native Appapp/App.js, screens/, components/, utils/protocol.js, package.jsonCompanion mobile app for device control, configuration, and status display

Design Methodology

Every device follows the same rigorous 4-phase process:

PhaseDocumentContents
Phase 1phase1_conceptual_architecture.mdPurpose, performance targets, constraints, block diagram, bus topology, power domains
Phase 2phase2_component_selection_schematics.mdBOM with real part numbers, pinouts/MUX tables, decoupling networks, netlists, impedance matching
Phase 3phase3_pcb_blueprints_layout.mdPCB stackup, routing rules, length matching, via strategy, thermal management, DFM notes
Phase 4phase4_software_stack.mdMMIO/register defs, clock & GPIO init (production C), critical device driver, device tree, bootloader

Devices

#DeviceStatusDescription
1eag-7000/ — Edge AI Gateway✅ Docs complete, KiCad/firmware/app pendingi.MX8MP + Hailo-8 NPU, 30 TOPS, fanless industrial, 2×2.5GbE, CAN-FD
2chronos-rtk/ — Dual-Frequency RTK GNSS Receiver✅ CompleteZED-F9P + STM32L4 + LoRa mesh, cm-level positioning, 868/915 MHz ISM
3vortex-sdr/ — Portable SDR Spectrum Analyzer✅ CompleteSTM32H743 + iCE40UP5K FPGA + ADF4351 PLL, 100kHz–6GHz, dual-FFT waterfall
4web-slack-ledger/ — WebSlack LedgerBuild-tested prototype; physical validation pendingTwo-encoder differential travel and reversal ledger for slow hand-fed strip fixtures
5slip-window/ — Slip WindowBuild-tested prototype; physical validation pendingSlip-casting cradle residence, interrupted draining, longest drain segment, and mold-opening notebook
6stencil-orbit/ — Stencil OrbitBuild-tested prototype; physical validation pendingManual screen-printing carousel station index, registration continuity and per-station tool-use notebook
7crossover-track/ — Crossover TrackBuild-tested prototype; physical validation pendingFour-contact cart trial recorder and guided ABBA lane-swap comparison separating cart and lane time contrasts
8takeup-atlas/ — Takeup AtlasBuild-tested prototype; physical validation pendingTwo-shaft reversal trials recording first output response, three-edge confirmation and rejected attempts in hand-operated mechanisms
9chord-window/ — Chord WindowBuild-tested prototype; physical validation pendingFour-switch chord press spread, shared hold and release timing before keyboard filtering, with local policy comparison
10detent-loop/ — Detent LoopBuild-tested prototype; physical calibration pendingHand-operated sliding-catch force–travel loops with explicit zero, turnaround, signed work and local evidence export
11tilt-break/ — Tilt BreakBuild-tested prototype; physical calibration pendingManual incline home-departure resistance brackets and independently qualified downstream puck arrival
12pipette-path/ — Pipette PathBuild-tested prototype; physical training validation pendingTwo-stop manual pipette plunger sequence recorder with operator-declared source immersion; not a volume calibrator
13flow-pause/ — Flow PauseBuild-tested prototype; physical validation pendingDeclared-supply hopper discharge silence, intervention precedence and recovery notebook; not a blockage detector
14sieve-shuttle/ — Sieve ShuttleBuild-tested prototype; physical validation pendingFour-zone manual sieving motion matrix, opposite-axis traversals, same-zone returns and longest directional runs; not separation efficiency
15bellows-phase/ — Bellows PhaseBuild-tested prototype; physical validation pendingDirection-conditioned inlet/outlet flap-position intervals across manual bellows strokes; not airflow or efficiency
16shutter-quartet/ — Shutter QuartetBuild-tested prototype; optical validation pendingFour-point fragmented exposure, missing-point and reopening notebook for slow hand-operated teaching shutters; not camera calibration
17coupon-transit/ — Coupon TransitBuild-tested prototype; physical validation pendingTwo-holder rack-to-rack transfer durations, same-rack returns and interrupted-observation notebook; not specimen identity or treatment verification
18pattern-sled/ — Pattern SledBuild-tested prototype; physical validation pendingThree-track mechanical program-strip repeat comparator with a learned sixteen-word reference, per-position mismatches and terminal alignment-loss diagnostics
19kit-multiset/ — Kit MultisetBuild-tested prototype; physical validation pendingTray-delimited unordered 2:1:1 bin-paddle recipe declarations, conservative abandonment and local evidence export; not inspected part quantities
20shim-bracket/ — Shim BracketBuild-tested prototype; physical validation pendingIndexed feeler-gauge fit/refusal declarations with persistent monotonicity contradictions; not calibrated gap measurement
21catch-witness/ — Catch WitnessBuild-tested prototype; physical validation pendingSettled-latch reopening notebook with expiring handle/tug associations and separate unseated, unexplained and aborted outcomes; not a retention-force gauge
22beat-aperture/ — Beat ApertureBuild-tested prototype; physical validation pendingTwo-pendulum return apertures retaining zero, single and multiple comparison returns within each reference cycle; not continuous phase measurement
23grip-lattice/ — Grip LatticeBuild-tested prototype; physical validation pendingFootswitch-delimited three-zone dummy-handle contact combinations, segment lengths and explicit unknown intervals; not a force or ergonomic assessment instrument

EAG-7000 — Edge AI Gateway

A high-performance, fanless industrial Edge AI Gateway for real-time ML inference at the network edge.

System Specifications

ParameterValue
AI Throughput≥30 TOPS INT8 (2.3 TOPS SoC + 26 TOPS Hailo-8)
CPUNXP i.MX8M Plus — 2× Cortex-A72 @ 2.0 GHz + 1× Cortex-M4F @ 800 MHz
Memory2× Micron MT53D512M32D4DS — 8GB LPDDR4X @ 4267 MT/s
Storage32GB eMMC 5.1 (boot) + 128GB NVMe M.2 2242 (data)
Networking2× 2.5GbE (AQR111C) + 1× 5GbE USB-C
Industrial IO2× CAN-FD, 3× SPI, 4× I2C, 5× UART, 1× MIPI-CSI2
Power12V DC / PoE+ (802.3at), ≤15W typical, 25W peak
Form Factor100mm × 72mm × 25mm, DIN-rail mountable
Operating Temp-40°C to +85°C (industrial)

Key Design Decisions

  1. i.MX8M Plus over Rockchip RK3588 — 15-year industrial availability, verified -40°C to 85°C
  2. LPDDR4X over DDR4 — 1.1V IO for passive cooling at 15W TDP
  3. eMMC boot over SD card — vibration reliability in industrial environments
  4. Hailo-8 M.2 accelerator — 26 TOPS at 2.5W, best TOPS/W in form factor
  5. Dual CAN-FD via SPI (MCP2518FD) — M4F handles real-time fieldbus with <1ms response

Vortex-SDR — Portable SDR Spectrum Analyzer

A portable, handheld spectrum analyzer covering 100 kHz to 6 GHz with dual-channel FFT, real-time waterfall display, capacitive touchscreen, and BLE companion app. Designed for RF engineers, ham radio operators, and EMC compliance testing.

System Specifications

ParameterValue
Frequency Range100 kHz – 6 GHz (dual-conversion superheterodyne)
MCUSTM32H743ZIT6 — Cortex-M7 @ 480 MHz, 1MB Flash, 1MB RAM
FPGALattice iCE40UP5K — FFT/waterfall acceleration
PLL SynthesizerADF4351 — 35 MHz to 4.4 GHz (6 GHz with ADF5002 prescaler)
ADCAD9645 — 14-bit, 61.44 MSPS dual-channel
DisplayILI9341 — 2.8" 320×240 TFT with capacitive touch
BLEnRF52840 — 2 Mbps BLE 5.0 companion link
Power3.7V LiPo (TPS62A02 buck + AMS1117 LDO), USB-C charging
Form Factor120mm × 75mm × 18mm, handheld
Operating Temp-20°C to +55°C (commercial)

Key Design Decisions

  1. STM32H743 over STM32F4 — Cortex-M7 @ 480 MHz for real-time FFT processing, dual-issue FPU
  2. iCE40UP5K FPGA for FFT offload — 5280 LUTs, on-chip RAM for windowing and averaging
  3. Dual-conversion architecture — 1st LO (ADF4351) + 10.7 MHz IF for image rejection
  4. AD9645 dual ADC — simultaneous I/Q sampling, 14-bit resolution for dynamic range
  5. Battery-powered with USB-C — TPS62A02 2A buck for efficiency, MCP73871 charger

License

ComponentLicense
Hardware design (KiCad)CERN-OHL-S v2
C firmware & driversGPL-2.0
Python tools & scriptsMIT
React Native companion appsMIT

Parts

30
QtyValueFootprintReferences
2100kResistor_SMD:R_0805_2012MetricR5, R6
2100nFCapacitor_SMD:C_0402_1005MetricC1, C2
210kResistor_SMD:R_0402_1005MetricR1, R2
24k7Resistor_SMD:R_0402_1005MetricR3, R4
110uFCapacitor_SMD:C_0805_2012MetricC3
110uHInductor_SMD:L_0603_1608MetricL1
11uFCapacitor_SMD:C_0603_1608MetricC4
1220Resistor_SMD:R_0603_1608MetricR7
122uHInductor_SMD:L_0805_2012MetricL2
1AD8429ARZPackage_SO:SOIC-8_3.9x4.9mm_P1.27mmU3
1ADS8866IDRCRPackage_DFN_QFN:DFN-8-1EP_3x3mm_P0.5mm_EP1.7x2.4mmU4
1AP2112K-3.3Package_TO_SOT_SMD:SOT-23-3U11
1BMD-300RF_Module:BMD-300U6
1Excitation_CoilConnector_Coil:Probe_CoilL3
1LM7660INPackage_SO:SOIC-8_3.9x4.9mm_P1.27mmU10
1MAX7403CPAPackage_SO:SOIC-8_3.9x4.9mm_P1.27mmU5
1SH1106_1.3_OLEDDisplay:OLED_128x64_1.3in_SH1106DISP1
1STM32G474CEU6Package_DFN_QFN:QFN-68-1EP_7x7mm_P0.35mmU1
1SWDConnector_PinHeader_2.54mm:PinHeader_1x04J2
1Sense_CoilConnector_Coil:Probe_CoilL4
1THS3091DPackage_SO:SOIC-8_3.9x4.9mm_P1.27mmU2
1TP4056Package_DFN:TP4056U12
1TPS63020DSJRPackage_TO_SOT_SMD:SOT-23-6U9
1USB-CConnector_USB:USB-C_Receptacle_HROJ1
1VL53L0XSensor_VL53L0X:VL53L0XU8
1W25Q128JVSIQPackage_SO:SOIC-16_3.9x9.9mm_P1.27mmU7

More from jayis1/hardware-design-lab

12
  • 6 layers120 × 80 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    41 parts
  • 4 layers42 × 85 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    26 parts
  • 2 layers120 × 18 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    25 parts
  • 4 layers85 × 52 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    24 parts
  • 160 × 120 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    24 parts
  • 5 layers62 × 52 mmTideband, the printed circuit board in 3D

    Tideband

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    24 parts
  • 2 layers95 × 65 mmCryo sentinel, the printed circuit board in 3D

    Cryo sentinel

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    23 parts
  • 4 layers120 × 80 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    23 parts
  • 2 layers80 × 50 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    22 parts
  • 4 layers95 × 62 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    21 parts
  • 4 layers19 × 38 mmGrainguard, the printed circuit board in 3D

    Grainguard

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    21 parts
  • 4 layers72 × 44 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    21 parts

Similar boards

  • 2 layers45 × 25 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hacker-devices

    Full-cycle hardware designs for security research devices — each device is a subfolder with its own README, schematics, PCB layout, and software stack

    15 parts2
  • 4 layers40.1 × 60.5 mmHIVES360, the printed circuit board in 3D

    HIVES360

    GhanmiIyed/Beehive-Monitoring

    96 parts
  • 4 layers90 × 80 mmLaser Driver v3, the printed circuit board in 3D

    Laser Driver v3

    Laser4DIY/Laser-Driver-v2

    MCU-based multipurpose Laser Diode driver

    102 parts23
  • 4 layers83 × 19 mmFEA BaselineRestore, the printed circuit board in 3D

    FEA BaselineRestore

    anvargasl/CosmicWatch-gamma-spectroscopy-PCB

    Handling versions of CosmicWatch pcb design, reusing V2 DC to DC booster and implementing new peak detection designa.

    83 parts2
  • 2 layers108 × 95.3 mmBlue Wizard, the printed circuit board in 3D

    Blue Wizard

    wizarddata/Blue-Wizard-Mod

    Bluetooth Controller for the Kinesis Advantage line of keyboards using the BlueMicro firmware

    47 parts38
  • 2 layers126 × 100.4 mmDragon joke, the printed circuit board in 3D

    Dragon joke

    DC801/DC26PartyBadge

    Design and software for the DC26 DC801 badge

    91 parts8
  • 2 layers35 × 47 mmRythm badge tudelft, the printed circuit board in 3D

    Rythm badge tudelft

    TUDelft-SPC-Lab/spcl_midge_hardware

    Hardware design files for the SPC lab MIDGE wearable devices for in-the-wild social data collection.

    42 parts1MIT

Questions

How big is the Device PCB?

It measures 34 × 28 mm and has 4 copper layers, 1.6 mm thick.

What parts does the Device use?

30 parts, built around the STM32G474CEU6, BMD-300-A-R, AD8429ARZ and ADS8866IDRCR. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Device KiCad files?

From the jayis1/hardware-design-lab repository on GitHub, at the commit this page was made from: the board is alloyscan/kicad/device.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.

Can I use the Device design in my own project?

Its repository states no licence, so its author keeps all rights: ask jayis1 before reusing the design.