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Boards by MichalVarsanyi

11 boards

Open-source boards designed in KiCad by MichalVarsanyi on GitHub, from 2 repositories. A board’s address here is its repository’s there.

  • 6 layers85 × 85 mmController Board, the printed circuit board in 3D

    Controller Board

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    298 parts1MIT
  • 4 layers44.2 × 71.1 mmSFP-32 Clampshell, the printed circuit board in 3D

    SFP-32 Clampshell

    MichalVarsanyi/TQFP-32-Clampshell

    Clampshell is a device used for programming SMD packaged integrated circuits. It makes a connection to all the pins without the need for soldering.

    20 partsMIT
  • 6 layers13 × 13 mmCore Module, the printed circuit board in 3D

    Core Module

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    56 parts1MIT
  • 6 layers13 × 13 mmCore Module Intel, the printed circuit board in 3D

    Core Module Intel

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    27 parts1MIT
  • 4 layers49.1 × 15.5 mmProgrammer Board, the printed circuit board in 3D

    Programmer Board

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    58 parts1MIT
  • 2 layers85 × 38.2 mmProgrammer Sensor Stencil, the printed circuit board in 3D

    Programmer Sensor Stencil

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    152 parts1MIT
  • 4 layers70 × 70 mmProgrammer Shell Module, the printed circuit board in 3D

    Programmer Shell Module

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    11 parts1MIT
  • 4 layers13 × 13 mmSensor Module, the printed circuit board in 3D

    Sensor Module

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    34 parts1MIT
  • 4 layers54 × 29.5 mmShell Module BUS, the printed circuit board in 3D

    Shell Module BUS

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    11 parts1MIT
  • 4 layers54 × 29.5 mmShell Module DAISY, the printed circuit board in 3D

    Shell Module DAISY

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    11 parts1MIT
  • 4 layers85 × 15.7 mmVoxSense, the printed circuit board in 3D

    VoxSense

    MichalVarsanyi/VoxLink

    VoxLink is a high-speed solution that allows interfacing of up to 100 sensors using a single high-speed host device.

    94 parts1MIT