Skip to the content
1234567891011121314151617181920

STM32F030F4P6

STMicroelectronicsExtended

-40℃~+85℃ 12bit 15 16KB 2.4V~3.6V 32 Bit 48MHz 4KB ARM Cortex-M0 Built-in FLASH TSSOP-20 Microcontrollers (MCU/MPU/SOC) ROHS

Part id
st/STM32F030F4P6
Category
Microcontrollers (MCU, MPU, SOC)
Package
TSSOP-20
Pins
20
In stock
59,987 at JLCPCB (C89040)
Used on
41 open-source boards

Overview

The STM32F030F4P6 is a microcontroller made by STMicroelectronics in a TSSOP-20 package with 20 pins. -40℃~+85℃ 12bit 15 16KB 2.4V~3.6V 32 Bit 48MHz 4KB ARM Cortex-M0 Built-in FLASH TSSOP-20 Microcontrollers (MCU/MPU/SOC) ROHS.

PCBKit's library has its KiCad symbol (MCU_ST_STM32F0:STM32F030F4Px, from KiCad's library) and its footprint (Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm, from KiCad's library), ready for a KiCad board. 59,987 are in stock at JLCPCB (part C89040). 41 open-source boards in 30 repositories on GitHub use it.

Symbol

1BOOT02PF03PF14NRST5VDDA6PA07PA18PA29PA310PA411PA512PA613PA714PB115VSS16VDD17PA918PA1019PA1320PA14
MCU_ST_STM32F0:STM32F030F4PxFrom KiCad's library

Footprint

1234567891011121314151617181920
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mmFrom KiCad's library

From the datasheet

13
Supply, least
2.4 V · VDD, recommended operating minimum · p. 40
Supply, most
3.6 V · VDD, recommended operating maximum · p. 40
Supply, absolute maximum
4 V · VDD and VDDA, absolute maximum · p. 38
Works from
-40 °C · minimum ambient, suffix 6, maximum power dissipation · p. 40
Works up to
85 °C · maximum ambient, suffix 6, maximum power dissipation · p. 40
Works up to
105 °C · maximum ambient at low power dissipation, subject to TJ maximum · p. 40
Junction, hottest
105 °C · maximum operating junction temperature, suffix 6 · p. 40
Junction, hottest
150 °C · absolute maximum junction temperature · p. 39
Takes working
23.46 mA · sum of VDD and VDDA typical run currents, 48 MHz, Flash, peripherals enabled, 3.3 V · p. 45
Takes asleep
5.3 µA · sum of VDD and VDDA typical standby currents, LSI and IWDG on, VDDA monitoring on, 3.6 V · p. 44
A pin gives at most
25 mA · absolute maximum current sunk by any I/O and control pin · p. 39
Junction to air (TSSOP20)
110 K/W · junction-to-ambient thermal resistance · p. 83
A pin gives at most
20 mA · GPIO source or sink max, relaxed VOL/VOH · p. 60

What it is and has

13
Core
ARM 32-bit Cortex-M0 CPU · p. 1
Maximum CPU frequency
48 MHz · p. 1
CRC
CRC calculation unit · p. 1
DMA
5-channel controller · p. 1
Low power modes
Sleep, Stop, Standby · p. 1
Reset
Power-on/Power down reset (POR/PDR) · p. 1
Debug
Serial wire debug (SWD) · p. 1
CPU frequency
up to 48 MHz · p. 1
Basic timer
One 16-bit basic timer · p. 1
Watchdog timers
Independent and system watchdog timers · p. 1
SysTick
24-bit downcounter · p. 1
Crystal oscillator
4 to 32 MHz · p. 1
ADC
12-bit · p. 64

Around it

1
diode Schottky
between standard analog input pin and ground; Recommended for standard analog pins which may inject negative current. · p. 65

Specifications

233
ParameterConditionsAs printedPage
External main supply voltage (including VDDA and VDD) VDD–VSSAbsolute maximum ratingsmin -0.3 · max 4 V38
Allowed voltage difference for VDD > VDDA VDD–VDDAVDD > VDDAmax 0.4 V38
Input voltage on TTa pins VINMinimum VSS  0.3max 4 V38
Input voltage on any other pin VINMinimum VSS 0.3max 4 V38
Variations between different VDD power pins |VDDx|max 50 mV38
Variations between all the different ground pins |VSSX VSS|max 50 mV38
Total current into sum of all VDD_x and VDDSDx power lines (source) IVDDAbsolute maximum ratingsmax 120 mA39
Total current out of sum of all VSS_x and VSSSD ground lines (sink) IVSSAbsolute maximum ratingsmax -120 mA39
Maximum current into each VDD_x or VDDSDx power pin (source) IVDD(PIN)Absolute maximum ratingsmax 100 mA39
Maximum current out of each VSS_x or VSSSD ground pin (sink) IVSS(PIN)Absolute maximum ratingsmax -100 mA39
Output current sunk by any I/O and control pin IIO(PIN)Absolute maximum ratingsmax 25 mA39
Output current source by any I/O and control pin IIO(PIN)Absolute maximum ratingsmax -25 mA39
Total output current sunk by sum of all IOs and control pins IIO(PIN)Absolute maximum ratingsmax 80 mA39
Total output current sourced by sum of all IOs and control pins IIO(PIN)Absolute maximum ratingsmax -80 mA39
Injected current on FT, FTf and B pins IINJ(PIN)Absolute maximum limits printed as -5/+0min -5 · max 0 mA39
Injected current on TC and RST pin IINJ(PIN)Absolute maximum magnitude ±5max 5 mA39
Injected current on TTa pins IINJ(PIN)Absolute maximum magnitude ±5max 5 mA39
Total injected current (sum of all I/O and control pins) IINJ(PIN)Absolute maximum magnitude ±25; absolute sum of positive and negative injected currentsmax 25 mA39
Storage temperature range TSTGmin -65 · max 150 °C39
Maximum junction temperature TJAbsolute maximum ratingsmax 150 °C39
Internal AHB clock frequency fHCLKmin 0 · max 48 MHz40
Internal APB clock frequency fPCLKmin 0 · max 48 MHz40
Standard operating voltage VDDmin 2.4 · max 3.6 V40
Analog operating voltage VDDAMust have a potential equal to or higher than VDDmin 2.4 · max 3.6 V40
Input voltage on TTa pins VINMinimum VSS –0.3max 4 V40
Input voltage on any other pin VINMinimum VSS –0.3max 4 V40
Power dissipation at TA = 85 °C for suffix 6 PDTSSOP20max 182 mW40
Ambient temperature for 6 suffix version TAMaximum power dissipationmin -40 · max 85 °C40
Ambient temperature for 6 suffix version TALow power dissipation; TJ must not exceed TJmaxmin -40 · max 105 °C40
Junction temperature range TJ6 suffix versionmin -40 · max 105 °C40
Supply current in Run mode, code executing from Flash IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 22 · max 22.8 mA43
Supply current in Run mode, code executing from Flash IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL on; 24 MHz; maximum at TA = 85 °Ctyp 12.2 · max 13.2 mA43
Supply current in Run mode, code executing from Flash IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 4.4 · max 5.2 mA43
Supply current in Run mode, code executing from RAM IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 22.2 · max 23.2 mA43
Supply current in Run mode, code executing from RAM IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL on; 24 MHz; maximum at TA = 85 °Ctyp 11.2 · max 12.2 mA43
Supply current in Run mode, code executing from RAM IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 4 · max 4.5 mA43
Supply current in Sleep mode, code executing from Flash or RAM IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 14 · max 15.3 mA43
Supply current in Sleep mode, code executing from Flash or RAM IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL on; 24 MHz; maximum at TA = 85 °Ctyp 7.3 · max 7.8 mA43
Supply current in Sleep mode, code executing from Flash or RAM IDDVDD = 3.6 V; all peripherals enabled; HSI clock, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 2.6 · max 2.9 mA43
Supply current in Run mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSE bypass, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 175 · max 215 uA43
Supply current in Run mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSE bypass, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 3.9 · max 4.9 uA43
Supply current in Run mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSE bypass, PLL off; 1 MHz; maximum at TA = 85 °Ctyp 3.9 · max 4.1 uA43
Supply current in Run mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSI clock, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 244 · max 275 uA43
Supply current in Run mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSI clock, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 85 · max 105 uA43
Supply current in Sleep mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSE bypass, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 174 · max 215 uA43
Supply current in Sleep mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSE bypass, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 3.9 · max 4.9 uA43
Supply current in Sleep mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSE bypass, PLL off; 1 MHz; maximum at TA = 85 °Ctyp 3.9 · max 4.9 uA43
Supply current in Sleep mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSI clock, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 244 · max 299 uA43
Supply current in Sleep mode, code executing from Flash or RAM IDDAVDDA = 3.6 V; HSI clock, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 85 · max 105 uA43
Supply current in Stop mode IDDVDD = VDDA = 3.6 V; regulator in run mode, all oscillators OFF; maximum at TA = 85 °Ctyp 19 · max 48 uA44
Supply current in Stop mode IDDVDD = VDDA = 3.6 V; regulator in low-power mode, all oscillators OFF; maximum at TA = 85 °Ctyp 5 · max 32 uA44
Supply current in Standby mode IDDVDD = VDDA = 3.6 V; LSI ON and IWDG ONtyp 2 uA44
Supply current in Stop mode IDDAVDD = VDDA = 3.6 V; VDDA monitoring ON; regulator in run or low power mode, all oscillators OFF; maximum at TA = 85 °Ctyp 2.9 · max 3.5 uA44
Supply current in Standby mode IDDAVDD = VDDA = 3.6 V; VDDA monitoring ON; LSI ON and IWDG ONtyp 3.3 uA44
Supply current in Standby mode IDDAVDD = VDDA = 3.6 V; VDDA monitoring ON; LSI OFF and IWDG OFF; maximum at TA = 85 °Ctyp 2.8 · max 3.5 uA44
Supply current in Stop mode IDDAVDD = VDDA = 3.6 V; VDDA monitoring OFF; regulator in run mode or low power, all oscillators OFFtyp 1.7 uA44
Supply current in Standby mode IDDAVDD = VDDA = 3.6 V; VDDA monitoring OFF; LSI ON and IWDG ONtyp 2.3 uA44
Supply current in Standby mode IDDAVDD = VDDA = 3.6 V; VDDA monitoring OFF; LSI OFF and IWDG OFFtyp 1.4 uA44
Supply current in Run mode from VDD supply IDDVDD = VDDA = 3.3 V; HSE crystal clock 8 MHz; fHCLK = 48 MHz; peripherals enabledtyp 23.3 mA45
Supply current in Run mode from VDD supply IDDVDD = VDDA = 3.3 V; HSE crystal clock 8 MHz; fHCLK = 48 MHz; peripherals disabledtyp 11.5 mA45
Supply current in Run mode from VDD supply IDDVDD = VDDA = 3.3 V; HSE crystal clock 8 MHz; fHCLK = 8 MHz; peripherals enabledtyp 4.5 mA45
Supply current in Run mode from VDD supply IDDVDD = VDDA = 3.3 V; HSE crystal clock 8 MHz; fHCLK = 8 MHz; peripherals disabledtyp 3 mA45
Supply current in Run mode from VDDA supply IDDAVDD = VDDA = 3.3 V; HSE crystal clock 8 MHz; fHCLK = 48 MHz; peripherals enabledtyp 158 uA45
Supply current in Run mode from VDDA supply IDDAVDD = VDDA = 3.3 V; HSE crystal clock 8 MHz; fHCLK = 48 MHz; peripherals disabledtyp 158 uA45
Supply current in Run mode from VDDA supply IDDAVDD = VDDA = 3.3 V; HSE crystal clock 8 MHz; fHCLK = 8 MHz; peripherals enabledtyp 2.43 uA45
Supply current in Run mode from VDDA supply IDDAVDD = VDDA = 3.3 V; HSE crystal clock 8 MHz; fHCLK = 8 MHz; peripherals disabledtyp 2.43 uA45
Electrostatic discharge voltage (human body model) VESD(HBM)TA = +25 °C, conforming to JESD22-A114; class 2max 2000 V56
Electrostatic discharge voltage (charge device model) VESD(CDM)TA = +25 °C, conforming to JESD22-C101; class IImax 500 V56
Thermal resistance junction-ambient JATSSOP20; value columntyp 110 °C/W83
External main supply voltage (including VDDA and VDD) VDD–VSSmin -0.3 · max 4 V38
Input voltage on TTa pins VINmax 4 V38
Input voltage on any other pin VINmax 4 V38
Total current into sum of all VDD_x and VDDSDx power lines (source) IVDDmax 120 mA39
Total current out of sum of all VSS_x and VSSSD ground lines (sink) IVSSmax -120 mA39
Maximum current into each VDD_x or VDDSDx power pin (source) IVDD(PIN)max 100 mA39
Maximum current out of each VSS_x or VSSSD ground pin (sink) IVSS(PIN)max -100 mA39
Output current sunk by any I/O and control pin IIO(PIN)max 25 mA39
Output current source by any I/O and control pin IIO(PIN)max -25 mA39
Total output current sunk by sum of all IOs and control pins IIO(PIN)max 80 mA39
Total output current sourced by sum of all IOs and control pins IIO(PIN)max -80 mA39
Maximum junction temperature TJmax 150 °C39
Input voltage on TTa pins VINmax 4 V40
Input voltage on any other pin VINmax 4 V40
VDD rise time rate tVDDmin 0 us/V41
VDD fall time rate tVDDmin 20 us/V41
VDDA rise time rate tVDDAmin 0 us/V41
VDDA fall time rate tVDDAmin 20 us/V41
Power on/power down reset threshold VPOR/PDRFalling edgemin 1.8 · typ 1.88 · max 2.06 V41
Power on/power down reset threshold VPOR/PDRRising edgemin 1.84 · typ 1.92 · max 2.1 V41
PDR hysteresis VPDRhysttyp 40 mV41
Reset temporization tRSTTEMPOmin 1.5 · typ 2.5 · max 4.5 ms41
Internal reference voltage VREFINT–40 °C < TA < +85 °Cmin 1.16 · typ 1.2 · max 1.24 V41
ADC sampling time when reading the internal reference voltage TS_vrefinttyp 5.1 · max 17.1 us41
Internal reference voltage spread over the temperature range VREFINTVDDA = 3 V ±10 mVmax 10 mV42
Temperature coefficient TCoeffmax 100 ppm/°C42
Supply current in Run mode, code executing from Flash IDDAll peripherals enabled; HSI clock, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 22 · max 22.8 mA43
Supply current in Run mode, code executing from Flash IDDAll peripherals enabled; HSI clock, PLL on; 24 MHz; maximum at TA = 85 °Ctyp 12.2 · max 13.2 mA43
Supply current in Run mode, code executing from Flash IDDAll peripherals enabled; HSI clock, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 4.4 · max 5.2 mA43
Supply current in Run mode, code executing from RAM IDDAll peripherals enabled; HSI clock, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 22.2 · max 23.2 mA43
Supply current in Run mode, code executing from RAM IDDAll peripherals enabled; HSI clock, PLL on; 24 MHz; maximum at TA = 85 °Ctyp 11.2 · max 12.2 mA43
Supply current in Run mode, code executing from RAM IDDAll peripherals enabled; HSI clock, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 4 · max 4.5 mA43
Supply current in Sleep mode, code executing from Flash or RAM IDDAll peripherals enabled; HSI clock, PLL on; 48 MHz; maximum at TA = 85 °Ctyp 14 · max 15.3 mA43
Supply current in Sleep mode, code executing from Flash or RAM IDDAll peripherals enabled; HSI clock, PLL on; 24 MHz; maximum at TA = 85 °Ctyp 7.3 · max 7.8 mA43
Supply current in Sleep mode, code executing from Flash or RAM IDDAll peripherals enabled; HSI clock, PLL off; 8 MHz; maximum at TA = 85 °Ctyp 2.6 · max 2.9 mA43
Supply current in Run mode from VDD supply IDDVDD=VDDA=3.3 V; HSE crystal clock 8 MHz; fHCLK = 48 MHz; peripherals enabledtyp 23.3 mA45
Supply current in Run mode from VDD supply IDDVDD=VDDA=3.3 V; HSE crystal clock 8 MHz; fHCLK = 48 MHz; peripherals disabledtyp 11.5 mA45
Supply current in Run mode from VDD supply IDDVDD=VDDA=3.3 V; HSE crystal clock 8 MHz; fHCLK = 8 MHz; peripherals enabledtyp 4.5 mA45
Supply current in Run mode from VDD supply IDDVDD=VDDA=3.3 V; HSE crystal clock 8 MHz; fHCLK = 8 MHz; peripherals disabledtyp 3 mA45
Supply current in Run mode from VDDA supply IDDAVDD=VDDA=3.3 V; HSE crystal clock 8 MHz; fHCLK = 48 MHz; peripherals enabledtyp 158 uA45
Supply current in Run mode from VDDA supply IDDAVDD=VDDA=3.3 V; HSE crystal clock 8 MHz; fHCLK = 48 MHz; peripherals disabledtyp 158 uA45
Supply current in Run mode from VDDA supply IDDAVDD=VDDA=3.3 V; HSE crystal clock 8 MHz; fHCLK = 8 MHz; peripherals enabledtyp 2.43 uA45
Supply current in Run mode from VDDA supply IDDAVDD=VDDA=3.3 V; HSE crystal clock 8 MHz; fHCLK = 8 MHz; peripherals disabledtyp 2.43 uA45
I/O current consumption ISWVDD = 3.3 V; CEXT = 0 pF; C = CINT + CEXT + CS; fSW = 4 MHztyp 0.18 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 0 pF; C = CINT + CEXT + CS; fSW = 8 MHztyp 0.37 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 0 pF; C = CINT + CEXT + CS; fSW = 16 MHztyp 0.76 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 0 pF; C = CINT + CEXT + CS; fSW = 24 MHztyp 1.39 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 0 pF; C = CINT + CEXT + CS; fSW = 48 MHztyp 2.188 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 22 pF; C = CINT + CEXT + CS; fSW = 4 MHztyp 0.49 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 22 pF; C = CINT + CEXT + CS; fSW = 8 MHztyp 0.94 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 22 pF; C = CINT + CEXT + CS; fSW = 16 MHztyp 2.38 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 22 pF; C = CINT + CEXT + CS; fSW = 24 MHztyp 3.99 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 47 pF; C = CINT + CEXT + CS; fSW = 4 MHztyp 0.81 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 47 pF; C = CINT + CEXT + CS; fSW = 8 MHztyp 1.7 mA47
I/O current consumption ISWVDD = 3.3 V; CEXT = 47 pF; fSW = 16 MHztyp 3.67 mA47
Wakeup from Stop mode tWUSTOPVDD = 3.3 V; regulator in run mode; 8-MHz HSI RC oscillatortyp 4.2 · max 5 us47
Wakeup from Standby mode tWUSTANDBYVDD = 3.3 V; 8-MHz HSI RC oscillatortyp 50.96 us47
Wakeup from Sleep mode tWUSLEEPVDD = 3.3 V; 8-MHz HSI RC oscillatortyp 1.1 us47
Oscillator frequency fOSC_INmin 4 · typ 8 · max 32 MHz50
Feedback resistor RFtyp 200 k50
HSE current consumption IDDDuring startupmax 8.5 mA50
HSE current consumption IDDVDD=3.3 V, Rm= 45, CL=10 pF@8 MHztyp 0.5 mA50
HSE current consumption IDDVDD=3.3 V, Rm= 30, CL=20 pF@32 MHztyp 1.5 mA50
Oscillator transconductance gmStartupmin 10 mA/V50
Startup time tSU(HSE)VDD is stabilizedtyp 2 ms50
LSE current consumption IDDLSEDRV[1:0]=00, lower driving capabilitytyp 0.5 uA51
LSE current consumption IDDLSEDRV[1:0]=01, medium low driving capabilitytyp 0.8 uA51
LSE current consumption IDDLSEDRV[1:0]=10, medium high driving capabilitytyp 1.1 uA51
LSE current consumption IDDLSEDRV[1:0]=11, higher driving capabilitytyp 1.4 uA51
Oscillator transconductance gmLSEDRV[1:0]=00, lower driving capabilitymin 5 uA/V51
Oscillator transconductance gmLSEDRV[1:0]=01, medium low driving capabilitymin 8 uA/V51
Oscillator transconductance gmLSEDRV[1:0]=10, medium high driving capabilitymin 15 uA/V51
Oscillator transconductance gmLSEDRV[1:0]=11, higher driving capabilitymin 25 uA/V51
Startup time tSU(LSE)VDD is stabilizedtyp 2 s51
Frequency fHSIVDDA = 3.3 V, TA = –40 to 85 °Ctyp 8 MHz52
HSI user trimming step TRIMVDDA = 3.3 V, TA = –40 to 85 °Cmax 1 %52
Duty cycle DuCy(HSI)VDDA = 3.3 V, TA = –40 to 85 °Cmin 45 · max 55 %52
Accuracy of the HSI oscillator (factory calibrated) ACCHSITA = –40 to 85 °C; VDDA = 3.3 V; with user calibrationtyp 5 %52
Accuracy of the HSI oscillator (factory calibrated) ACCHSITA = 25 °C; VDDA = 3.3 V; with user calibrationtyp 1 %52
HSI oscillator startup time tsu(HSI)VDDA = 3.3 V, TA = –40 to 85 °Cmin 1 · max 2 us52
HSI oscillator power consumption IDDA(HSI)VDDA = 3.3 V, TA = –40 to 85 °Ctyp 80 uA52
Frequency fHSI14VDDA = 3.3 V, TA = –40 to 85 °Ctyp 14 MHz53
HSI14 user-trimming step TRIMVDDA = 3.3 V, TA = –40 to 85 °Cmax 1 %53
Duty cycle DuCy(HSI14)VDDA = 3.3 V, TA = –40 to 85 °Cmin 45 · max 55 %53
Accuracy of the HSI14 oscillator (factory calibrated) ACCHSI14VDDA = 3.3 V, TA = –40 to 85 °Ctyp 5 %53
HSI14 oscillator startup time tsu(HSI14)VDDA = 3.3 V, TA = –40 to 85 °Cmin 1 · max 2 us53
HSI14 oscillator power consumption IDDA(HSI14)VDDA = 3.3 V, TA = –40 to 85 °Ctyp 100 uA53
Frequency fLSIVDDA = 3.3 V, TA = –40 to 85 °Cmin 30 · typ 40 · max 50 kHz53
LSI oscillator startup time tsu(LSI)VDDA = 3.3 V, TA = –40 to 85 °Cmax 85 us53
LSI oscillator power consumption IDDA(LSI)VDDA = 3.3 V, TA = –40 to 85 °Ctyp 0.75 uA53
PLL input clock fPLL_INmin 1 · max 24 MHz54
PLL input clock duty cycle fPLL_INmin 40 · max 60 %54
PLL multiplier output clock fPLL_OUTmin 16 · max 48 MHz54
PLL lock time tLOCKmax 200 us54
Cycle-to-cycle jitter JitterPLLmax 300 ps54
16-bit programming time tprogTA = –40 to +85 °Ctyp 53.5 us54
Page (1 KB) erase time tERASETA = –40 to +85 °Ctyp 30 ms54
Mass erase time tMETA = –40 to +85 °Ctyp 30 ms54
Supply current IDDWrite mode; TA = –40 to +85 °Cmax 10 mA54
Supply current IDDErase mode; TA = –40 to +85 °Cmax 12 mA54
Programming voltage VprogTA = –40 to +85 °Cmin 2.4 · max 3.6 V54
Endurance NENDTA = –40 to +85 °C (6 suffix versions)min 1 kcycles54
Data retention tRET1 kcycle at TA = 85 °Cmin 20 Years54
Electrostatic discharge voltage (human body model) VESD(HBM)TA = +25 °C, conforming to JESD22-A114; Class 2max 2000 V56
Electrostatic discharge voltage (charge device model) VESD(CDM)TA = +25 °C, conforming to JESD22-C101; Class IImax 500 V56
Injected current on BOOT0 IINJNegative injection; positive injection NAmin 0 mA57
Injected current on all FT and FTf pins with induced leakage current on adjacent pins less than –5 uA IINJNegative injection; positive injection NAmin -5 mA57
Injected current on all TTa pins with induced leakage current on adjacent pins less than –5 uA IINJNegative and positive injectionmin -5 · max 5 mA57
Injected current on all TC and RESET pins with induced leakage current on adjacent pins less than –5 uA IINJNegative and positive injectionmin -5 · max 5 mA57
Output low level voltage for an I/O pin when 8 pins are sunk at the same time VOLIIO = +8 mA; 2.7 V < VDD < 3.6 Vmax 0.4 V60
Output low level voltage for an I/O pin when 5 pins are sunk at the same time VOLIIO = +20 mA; 2.7 V < VDD < 3.6 Vmax 1.3 V60
Output low level voltage for an I/O pin when 8 pins are sunk at the same time VOLIIO = +6 mA; 2.4 V < VDD < 2.7 Vmax 0.4 V60
Output low level voltage for an FTf I/O pin in FM+ mode VOLFM+IIO = +20 mAmax 0.4 V60
Maximum frequency fmax(IO)outOSPEEDRy[1:0] = x0; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 2 MHz61
Output high to low level fall time tf(IO)outOSPEEDRy[1:0] = x0; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 125 ns61
Output low to high level rise time tr(IO)outOSPEEDRy[1:0] = x0; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 125 ns61
Maximum frequency fmax(IO)outOSPEEDRy[1:0] = 01; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 10 MHz61
Output high to low level fall time tf(IO)outOSPEEDRy[1:0] = 01; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 25 ns61
Output low to high level rise time tr(IO)outOSPEEDRy[1:0] = 01; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 25 ns61
Maximum frequency fmax(IO)outOSPEEDRy[1:0] = 11; CL = 30 pF, VDD = 2.7 V to 3.6 Vmax 50 MHz61
Maximum frequency fmax(IO)outOSPEEDRy[1:0] = 11; CL = 50 pF, VDD = 2.7 V to 3.6 Vmax 30 MHz61
Maximum frequency fmax(IO)outOSPEEDRy[1:0] = 11; CL = 50 pF, VDD = 2.4 V to 2.7 Vmax 20 MHz61
Output high to low level fall time tf(IO)outOSPEEDRy[1:0] = 11; CL = 30 pF, VDD = 2.7 V to 3.6 Vmax 5 ns61
Output high to low level fall time tf(IO)outOSPEEDRy[1:0] = 11; CL = 50 pF, VDD = 2.7 V to 3.6 Vmax 8 ns61
Output low to high level rise time tr(IO)outOSPEEDRy[1:0] = 11; CL = 30 pF, VDD = 2.7 V to 3.6 Vmax 5 ns61
Output low to high level rise time tr(IO)outOSPEEDRy[1:0] = 11; CL = 50 pF, VDD = 2.7 V to 3.6 Vmax 8 ns61
Maximum frequency fmax(IO)outFM+ configuration; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 2 MHz61
Output high to low level fall time tf(IO)outFM+ configuration; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 12 ns61
Output low to high level rise time tr(IO)outFM+ configuration; CL = 50 pF, VDD = 2.4 V to 3.6 Vmax 34 ns61
Pulse width of external signals detected by the EXTI controller tEXTIpwmin 10 ns61
Analog supply voltage for ADC ON VDDAmin 2.4 · max 3.6 V64
ADC clock frequency fADCmin 0.6 · max 14 MHz64
Sampling rate fSmin 0.05 · max 1 MHz64
External trigger frequency fTRIGfADC = 14 MHzmax 823 kHz64
External trigger frequency fTRIGmax 17 1/fADC64
Conversion voltage range VAINMaximum VDDAmin 0 V64
External input impedance RAINSee Equation 1 and Table 49 for detailsmax 50 k64
Sampling switch resistance RADCmax 1 k64
Internal sample and hold capacitor CADCmax 8 pF64
Calibration time tCALfADC = 14 MHztyp 5.9 us64
Calibration time tCALtyp 83 1/fADC64
Trigger conversion latency tlatrfADC = fPCLK/2 = 14 MHztyp 0.196 us64
Trigger conversion latency tlatrfADC = fPCLK/2typ 5.5 1/fPCLK64
Trigger conversion latency tlatrfADC = fPCLK/4 = 12 MHztyp 0.219 us64
Trigger conversion latency tlatrfADC = fPCLK/4typ 10.5 1/fPCLK64
Trigger conversion latency tlatrfADC = fHSI14 = 14 MHzmin 0.188 · max 0.259 us64
ADC jitter on trigger conversion JitterADCfADC = fHSI14typ 1 1/fHSI1464
Sampling time tSfADC = 14 MHzmin 0.107 · max 17.1 us64
Sampling time tSmin 1.5 · max 239.5 1/fADC64
Power-up time tSTABmin 0 · typ 0 · max 1 us64
Total conversion time (including sampling time) tCONVfADC = 14 MHzmin 1 · max 18 us64
Total conversion time (including sampling time) tCONVtS for sampling +12.5 for successive approximationmin 14 · max 252 1/fADC64
RAIN max RAINTs = 1.5 cycles; tS = 0.11 usmax 0.4 k65
RAIN max RAINTs = 7.5 cycles; tS = 0.54 usmax 5.9 k65
RAIN max RAINTs = 13.5 cycles; tS = 0.96 usmax 11.4 k65
RAIN max RAINTs = 28.5 cycles; tS = 2.04 usmax 25.2 k65
RAIN max RAINTs = 41.5 cycles; tS = 2.96 usmax 37.2 k65
RAIN max RAINTs = 55.5 cycles; tS = 3.96 usmax 50 k65
Total unadjusted error ETfPCLK = 48 MHz, fADC = 14 MHz, RAIN < 10 k, VDDA = 2.7 V to 3.6 V, TA = −40 to 85 °C; after internal calibrationtyp 3.3 · max 4 LSB65
Offset error EOfPCLK = 48 MHz, fADC = 14 MHz, RAIN < 10 k, VDDA = 2.7 V to 3.6 V, TA = −40 to 85 °C; after internal calibrationtyp 1.9 · max 2.8 LSB65
Gain error EGfPCLK = 48 MHz, fADC = 14 MHz, RAIN < 10 k, VDDA = 2.7 V to 3.6 V, TA = −40 to 85 °C; after internal calibrationtyp 2.8 · max 3 LSB65
Differential linearity error EDfPCLK = 48 MHz, fADC = 14 MHz, RAIN < 10 k, VDDA = 2.7 V to 3.6 V, TA = −40 to 85 °C; after internal calibrationtyp 0.7 · max 1.3 LSB65
Integral linearity error ELfPCLK = 48 MHz, fADC = 14 MHz, RAIN < 10 k, VDDA = 2.7 V to 3.6 V, TA = −40 to 85 °C; after internal calibrationtyp 1.2 · max 1.7 LSB65
Thermal resistance junction-ambient JATSSOP20typ 110 °C/W83

Pins, by the datasheet

16
4 NRST
Device reset input and internal reset output, active low. · p. 26
5 VDDA
Analog power supply. · p. 26
6 PA0
GPIO with ADC_IN0, RTC_TAMP2 and WKUP1 functions. · p. 26
7 PA1
GPIO with ADC_IN1 and EVENTOUT functions. · p. 26
8 PA2
GPIO with ADC_IN2 function. · p. 26
9 PA3
GPIO with ADC_IN3 function. · p. 26
10 PA4
GPIO with SPI1_NSS, TIM14_CH1 and ADC_IN4 functions. · p. 27
11 PA5
GPIO with SPI1_SCK and ADC_IN5 functions. · p. 27
12 PA6
GPIO with SPI1_MISO, TIM3_CH1, TIM1_BKIN, TIM16_CH1, EVENTOUT and ADC_IN6 functions. · p. 27
13 PA7
GPIO with SPI1_MOSI, TIM3_CH2, TIM14_CH1, TIM1_CH1N, TIM17_CH1, EVENTOUT and ADC_IN7 functions. · p. 27
14 PB1
GPIO with TIM3_CH4, TIM14_CH1, TIM1_CH3N and ADC_IN9 functions. · p. 27
16 VDD
Digital power supply. · p. 27
17 PA9
GPIO with USART1_TX and TIM1_CH2 functions. · p. 28
18 PA10
GPIO with USART1_RX, TIM1_CH3 and TIM17_BKIN functions. · p. 28
1 BOOT0
Boot memory selection. · p. 29
15 VSS
Ground. · p. 30

Open-source boards using it

41See all 41
  • 4 layers406 × 27.5 mmHexdump, the printed circuit board in 3D

    Hexdump

    brainsmoke/hexboard

    quite a big hexdump display

    70 parts90
  • 2 layers50 × 50 mmBrew buddy hardware, the printed circuit board in 3D

    Brew buddy hardware

    marcelobarrosufu/brewbuddy

    Thermometer, stopwatch, step mash tool, boiling and hop additions controller in a compact instrument !

    45 parts20
  • 2 layers100 × 100 mmLcr 2, the printed circuit board in 3D

    Lcr 2

    yjmwxwx/stm32asm

    256 parts16GPL-3.0
  • 2 layers17 × 21.5 mmFlockOne, the printed circuit board in 3D

    FlockOne

    RavenLRS/Flock

    Flock is an inter-craft communication system intended mainly for radio controlled vehicles

    14 parts8
  • 4 layers46 × 31 mmSignalgen, the printed circuit board in 3D

    Signalgen

    brightcloudy/kicad-pcbs

    Repository for my PCB schematics and layouts.

    55 parts2
  • 2 layers20.4 × 32.3 mmStm32f0..f breakout, the printed circuit board in 3D

    Stm32f0..f breakout

    electroniceel/stm32f0..f-breakout

    STM32F0..F (TSSOP20) Breakout Module

    35 parts2CC-BY-4.0
  • 2 layers109.6 × 44.5 mmGener5351, the printed circuit board in 3D

    Gener5351

    MR-DOS/gener5351

    Simple 3-channel standalone clock generator with Si5351

    56 parts2GPL-3.0
  • 2 layers52 × 21 mmPioneerBMWInterface, the printed circuit board in 3D

    PioneerBMWInterface

    pchmura4/BMW-Pioneer_interface

    Interface between BMW E46 steering wheel to control Pioneer aftermarket headunits

    34 parts2AGPL-3.0

Parts like it

8

Questions

Is there a KiCad symbol and footprint for the STM32F030F4P6?

Yes. The symbol is MCU_ST_STM32F0:STM32F030F4Px and the footprint Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the STM32F030F4P6?

TSSOP-20, with 20 pins. Its footprint is drawn on this page.

Where is the STM32F030F4P6 datasheet?

STMicroelectronics publishes it: the Datasheet link on this page opens it.

Where can I order the STM32F030F4P6?

JLCPCB lists it as part C89040, with 59,987 in stock; the sellers' links on this page open their listings.

What can replace the STM32F030F4P6?

Parts like it in the library: the CH32V003F4P6 by WCH (Nanjing Qinheng Microelectronics), the STM32G030F6P6 by STMicroelectronics, the STM32F042F4P6 by STMicroelectronics and the STM32F042F6P6 by STMicroelectronics. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the STM32F030F4P6?

41 boards in 30 repositories on GitHub; the most starred are listed on this page, with their KiCad files.