4 layers67.9 × 25.9 mm
2 layers40.1 × 30 mm
BLE02
mlab-modules/BLE02Bluetooth 4.1 controller for UART HCI-based BLE and BR/EDR communication with external host MCU.
- Size
- 40.1 × 30 mm
- Copper layers
- 2
- Thickness
- 0.19 mm
- Parts
- 41
- Nets
- 68
- Pads
- 198
- Tracks, vias
- 390, 97
- Pours
- 1
- Routed
- Yes
- KiCad
- KiCad 9.0 (file 20241229)
- Created
- 22 Jan 2026
- Updated
- 22 Feb 2026
Overview
BLE02 is an open-source printed circuit board by mlab-modules, from the mlab-modules/BLE02 repository on GitHub, published under the GPL-3.0 licence. It is a 2-layer board of 40.1 × 30 mm with 41 parts on 68 nets, routed with 390 tracks and 97 vias.
It is built around the CC2564CRVMR, LFB212G45CG1C187 and TXS0104EPW, with the BZX585-B5V6,115-JSM, ECS-260-8-36CKM-TR and KPTR-3216SURCK among its other parts. Its parts include 17 capacitors, 4 resistors, 4 ICs, 4 connectors and 2 diodes. It belongs with the radio and wireless and interfaces and adapters boards of this library.
Main components
6
CC2564CRVMR
VQFN-76-EP(8x8)-40℃~+85℃ -95dBm 1.7V~4.8V 112.5mA 12dBm 13.7mA 2.402GHz 2.402GHz~2.48GHz 4Mbps Bluetooth Power-on Reset UART、I2S、PCM transceiver VQFN-76-EP(8x8) RF Transceiver ICs ROHSTexas InstrumentsRF Transceiver ICs
LFB212G45CG1C187
-- RF Filters ROHSMurataRF Filters
TXS0104EPW
TSSOP-14-40℃~+85℃ 1 1.65V~3.6V 2.3V~5.5V 24Mbps 4 Automatic direction detection、Output enable high-impedance、Integrated pull-up resistor Bidirectional Level translator Push-Pull、Open-drain TSSOP-14 Translators, Level Shifters ROHSTexas InstrumentsTranslators, Level Shifters
BZX585-B5V6,115-JSM
SOD-523SOD-523 Zener Diodes ROHSJSMSEMIZener Diodes
ECS-260-8-36CKM-TR
SMD2520-4P-20℃~+70℃ 26MHz 60Ω 8pF ±10ppm ±10ppm SMD2520-4P Crystals ROHSECSCrystals
KPTR-3216SURCK
1206-40℃~+85℃ 140° 2.5V 20mA 630nm 645nm 75mW Discrete Diode Red Water Clear 1206 LED Indication - Discrete ROHSKingbrightLED Indication - Discrete
README
README.mdBLE02 - Dual-Mode Bluetooth HCI Controller
BLE02 is a dual-mode Bluetooth Low Energy controller module based on the CC2564C HCI compatible chipset.
The module provides UART (HCI) and PCM/I²S digital audio interface and is designed as a compact MLAB building block for integration with external MCU/MPU systems.
The RF section, clocks and power conditioning are implemented on-board. The host processor should handle the Bluetooth stack via HCI transport.
Key Features
- Dual-mode Bluetooth controller (BR/EDR + LE, Bluetooth 5.1 compliant)
- HCI transport over UART (up to 4 Mbit/s)
- PCM / I²S digital audio interface
- Class 1 transmitter capability (up to +12 dBm)
- Integrated LDO regulator from 3.3V power source
- 26 MHz main crystal oscillator
- 32.768 kHz low-power clock oscillator
- 1.8 V I/O domain (level shifted to 3.3 V on module connectors)
- Single-ended 50 Ω RF interface on MCX connector
The module uses the chip in HCI mode. All higher Bluetooth layers must run on the host MCU.
Electrical Parameters
Supply
- VCC (module input): 3.3 V nominal
- On-board regulation:
- CC2564C powered directly from power input
- I/O domain: 1.8 V (generated internally, exposed as VDD_1V8)
- Typical consumption:
- TX (GFSK, max power): ~100 mA
- LE advertising: 200 µA average
- Shutdown: less than 10 µA
UART Interface (HCI)
- Transport: H4 (UART)
- Baud rate: 38.4 kbit/s to 4 Mbit/s
- Hardware flow control required (RTS/CTS)
The controller signals boot completion by asserting RTS low after reset.
Audio Interface (PCM / I²S)
- PCM master or slave mode
- Up to 4.096 MHz bit clock
- Suitable for HFP, A2DP and other audio profiles
Note: Assisted modes (WBS, A2DP assist) cannot be used simultaneously with LE mode.
Parts
41| Qty | Value | Footprint | References |
|---|---|---|---|
| 11 | 0.1uF | Capacitor_SMD:C_0603_1608Metric | C1, C2, C3, C4, C5, C6, C7, C21, C22, C23, C24 |
| 4 | HOLE | Mlab_Mechanical:MountingHole_3mm | M1, M2, M3, M4 |
| 3 | 10k | Resistor_SMD:R_0603_1608Metric | R1, R2, R3 |
| 3 | Fiducial | Fiducial:Fiducial_1mm_Mask2mm | FID1, FID2, FID3 |
| 2 | 10 pF | Capacitor_SMD:C_0603_1608Metric | C25, C26 |
| 2 | JUMP_5X2 | Mlab_Pin_Headers:Straight_2x04 | J3, J4 |
| 2 | TXS0104EPW | Package_SO:TSSOP-14_4.4x5mm_P0.65mm | U1, U3 |
| 1 | 100nF | Capacitor_SMD:C_0603_1608Metric | C16 |
| 1 | 100nF/50V | Capacitor_SMD:C_0603_1608Metric | C8 |
| 1 | 10uF | Capacitor_SMD:C_0805_2012Metric | C17 |
| 1 | 22pF | Capacitor_SMD:C_0603_1608Metric | C20 |
| 1 | 2k2 | Resistor_SMD:R_0603_1608Metric | R4 |
| 1 | 3.3V | Mlab_Pin_Headers:Straight_2x03 | J2 |
| 1 | BZX585-B5V6.115 | Diode_SMD:D_SOD-523 | D3 |
| 1 | CC2564CRVMR | Mlab_IO:RVM0076A | U2 |
| 1 | Conn_Coaxial | Mlab_CON:MCX | J1 |
| 1 | ECS-260-8-36CKM-TR | Crystal:Crystal_SMD_2520-4Pin_2.5x2.0mm | Y3 |
| 1 | LED | Mlab_D:LED_1206_mill | D1 |
| 1 | LFB212G45CG1C187 | MLAB_SAW:Murata_C187 | U4 |
| 1 | LFSPXO009682 | Oscillator:Oscillator_SMD_SeikoEpson_SG210-4Pin_2.5x2.0mm | Y1 |
| 1 | TestPoint | TestPoint:TestPoint_Pad_D1.0mm | TP1 |
Questions
How big is the BLE02 PCB?
It measures 40.1 × 30 mm and has 2 copper layers, 0.19 mm thick.
What parts does the BLE02 use?
41 parts, built around the CC2564CRVMR, LFB212G45CG1C187, TXS0104EPW and BZX585-B5V6,115-JSM. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the BLE02 KiCad files?
From the mlab-modules/BLE02 repository on GitHub, at the commit this page was made from: the board is hw/sch_pcb/BLE02.kicad_pcb and its schematic hw/sch_pcb/BLE02.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the BLE02 design in my own project?
Its repository publishes it under the GPL-3.0 licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).
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