Skip to the content
2 layers165 × 64 mmRoute, the printed circuit board in 3D

The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

Size
165 × 64 mm
Copper layers
2
Thickness
1.6 mm
Parts
101
Nets
58
Pads
330
Tracks, vias
474, 105
Pours
23
Routed
Yes
KiCad
KiCad 10.0 (file 20260206)
Created
16 Jul 2026
Updated
3 Nov 2026

Overview

Route is an open-source printed circuit board by misko, from the misko/prompt2device repository on GitHub, published under the MIT licence. It is a 2-layer board of 165 × 64 mm with 101 parts on 58 nets, routed with 474 tracks and 105 vias.

It is built around the ESP32-C3-WROOM-02-N4, INA238AIDGSR and LMR16006XDDCR, with the W25Q64JVSSIQ, AMS1117-3.3 and USBLC6-2SC6 among its other parts. Its parts include 15 resistors, 14 capacitors, 11 ICs, 10 connectors and 7 diodes. It belongs with the ESP32 and RISC-V boards of this library.

Main components

7

README

README.md

prompt2device

The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

The Crow carrier + pod public design package provides native designs and fabrication exports for the 5-carrier/10-pod prototype batch. It is a subset of the local sealed release, not order authorization.

Prompt to device: give an agent a plain-language hardware brief, work through explicit design, review, and physical-test cycles, and finish with the artifacts needed to manufacture the device—not merely a plausible CAD image.

Quick start

1. Give the PCB skill a brief

text
/pcb-design 3S LiPo input → 4× USB-A outputs at 5 V / 1.5 A each + 1× USB-C output at 5 V / 5 A.

2. See fabricated examples

These two projects show the path from a plain-English request to electrical CAD, mechanical CAD, and fabricated hardware. The prompt cells preserve the compact original wording; the links retain the corresponding design-lineage records. Photographs are bench evidence, not production-qualification claims. Exact provenance and claim limits are in fabricated-examples.md.

pluto-rx2-8way-v5 is the fabricated eight-way RF switch board. Its immutable PCB design archive is v0.2.1-2026-08-14, with a sealed 3D PCB render, and its independently versioned v0.8.0-2026-08-28 enclosure has a corresponding installed-assembly render. That enclosure remains an honest INCOMPLETE candidate pending sliced and printed fit, retention, connector-service, and thermal tests. The PCB archive itself predates fabrication and still records DO-NOT-ORDER; RF first-article measurements remain open. The current human-readable engineering study is RF isolation, leakage paths, and a v6 mitigation strategy.

usb-hub-3s-v3 is the closest existing hardware to the quick-start brief: three USB-A outputs and one USB-C output rather than four USB-A outputs. Its latest sealed and fabricated archive is v1.12-2026-07-28. The bring-up journal records physical v1.12 boards and the replacement assembly's successful no-load regulation checks; full load, transient, and thermal qualification is still open.

The exact v1.12 board also has an independently versioned v0.4.0-2026-08-28 enclosure with a corresponding installed-assembly render. Its authored source and replay instructions remain mutable, while the release is an immutable INCOMPLETE candidate: structural and collision screens pass, but printed fit, connector service, retention, and thermal evidence remain open.

3. Follow the prompt-to-device loop

text
plain-language brief
  → fact locks and architecture
  → schematic, placement, routing, and enclosure development
  ↺ independent review, correction, regeneration, and measurement
  → sealed fabrication and mechanical artifacts
  → first article, physical findings, and the next development cycle

Today the governed output can include:

  • native KiCad schematics and a rendered schematic PDF;
  • the routed KiCad PCB plus Gerbers, drill files, BOM, and CPL for fabrication;
  • top, bottom, and 3D PCB renders plus a STEP assembly;
  • when mechanical work is selected, enclosure source, printable STLs, assembly renders, and clearance evidence; and
  • governed Markdown investigations under each project's 01_docs/reports/.

The pipeline already uses board-level CAD/assembly twins as verification instruments. Governed firmware releases and an integrated product-level digital twin are forward work, tracked by IMP-234 and IMP-236.

What this repository is

prompt2device is a code-first prompt-to-device engineering system. It turns a user brief into generated KiCad source, bounded routing candidates, independently graded fabrication evidence, immutable releases, printable enclosures, and measured first-article records.

The product is the workflow under skills/. Boards under projects/ are its active applications; sealed release folders are immutable evidence, not templates to copy.

Manual commissioning

Clone the repository, create a branch, and save the user's original request as a UTF-8 text file:

bash
git clone https://github.com/misko/prompt2device.git
cd prompt2device
git switch -c codex/my-board

Create the governed project scaffold and choose its capability profile:

bash
python3 skills/pcb-design/scripts/commission_project.py my-board \
  --brief-file /path/to/original-brief.txt \
  --signal-integrity ordinary \
  --assembly jlcpcb \
  --firmware forbidden \
  --target design

Use high_speed_digital for USB and similar controlled digital links. Use rf only when the board intentionally carries RF/microwave signals. Add --foreign-mating when the floorplan consumes geometry from third-party hardware. Run the command with --help for enclosure and target options. Here --assembly jlcpcb selects the populated JLCPCB PCBA evidence path, not merely bare-board fabrication.

The command reports PCB-SCAFFOLD OK and leaves PCB-COMMISSION explicitly INCOMPLETE. It preserves the prompt and creates an executable commission hold; it does not accept requirements, adopt the seeded schema examples, or run a board producer.

Inspect the selected lifecycle before spending engineering time:

bash
python3 skills/pcb-design/scripts/skill_reference_router.py \
  --profile projects/my-board/01_docs/capability-profile.json \
  --at-stage PCB-COMMISSION \
  --json

Then give Codex this instruction:

text
Read and follow skills/pcb-design/SKILL.md for projects/my-board. Preserve the
original brief, close the commission fact locks, and stop at the first evidence
or operator checkpoint. Do not create firmware unless the brief explicitly
asks.

Do not run rebuild_all.sh yet. The scaffold contains visible schema examples and 01_docs/COMMISSIONING-HOLD.md; both rebuild conductors refuse to run until the commission boundary is reviewed and that marker is deliberately removed.

Start with skills/pcb-design/SKILL.md. Its canonical lifecycle and runnable command map is execution-graph.md.

How execution is structured

The repository deliberately separates three layers:

text
capability profile
  -> disclosure graph (what stages/references are selected)
  -> project conductor (what bounded commands actually run)
  -> owning gates (what exact subjects passed)
  -> review/seal/publication/physical claims
  • The router is planning only. Its output is never execution evidence.
  • projects/<name>/03_src/rebuild_all.sh is the full source/schematic conductor. It intentionally pauses at review and operator checkpoints.
  • rebuild_reuse.sh is the deterministic route-authority replay when the schematic is unchanged; route.yaml selects the authenticated source.
  • Fresh route exploration is a separate candidate workflow; canonical rebuild replays the authenticated route source selected by route.yaml.
  • Layout seal, PCB release seal, publication, ordering, and first article are different claims with different owners.

The declarative lifecycle is:

text
commission -> architecture -> sourcing
  -> schematic -> placement -> routing -> layout seal
  -> fabrication -> assembly verification
  -> release review -> release seal
  -> publication | first article -> production

RF context/source/realized/fabrication stages and foreign-mating import are conditional branches. High-speed digital composes inside the ordinary stages. Enclosures have an implemented parallel INCOMPLETE-candidate release stream and may bind an unchanged PCB release without resealing it. Higher readiness still requires the enclosure skill's recomputable CAD and physical evidence. Firmware is currently an explicit handoff, not a governed release stream; IMP-234 tracks that missing boundary.

Skills and authority

SkillOwns
pcb-designCommission, lifecycle composition, backtracking, reviews, release seal, publication, first article.
kicad-pcbTSX/KiCad schematic conversion, netlist/parity, placement, geometry, routing, DRC, SI/RF realization.
jlcpcb-fabGerber/drill/BOM/CPL, stock/population/rotation, JLC CAD twin, manufacturer staging, bring-up cards.
pcb-enclosureMechanical commission, PCB interface binding, independent fasteners, motion/clearance, mesh/physical evidence, enclosure releases.
shopping-listProvenance-bound purchase lists for self-supplied parts.

Authority is singular. A skill links to another owner's procedure rather than copying it. Project contracts.md files own exact artifact membership. Script --help text owns exact flags. improvements.md tracks work and rationale but never overrides an executable gate or accepted ADR.

Repository map

PathPurpose
skills/Reusable workflow, references, tools, and project templates.
projects/Active boards, including manufactured and still-evolving designs.
archived_projects/Retired scaffolds and frozen regression/history units.
docs/Documentation index, accepted ADRs, measured proof, and historical context.
tests/Clean and known-bad fixtures proving gates can both pass and fail.
external_hardware/Measured/cited facts about foreign devices this repo must mate with.
improvements.mdForward work registry and retained improvement history.

See docs/README.md for the documentation authority map.

Design model

The board is generated from committed human-owned source:

  • TSX/tscircuit is the standard schematic authoring front end.
  • Shared scripts convert the circuit, generate KiCad geometry/rules, and grade exact identities. Per-board source is configuration, not a copied backend.
  • KiCad's Python API owns geometry and saves; kicad-cli owns headless ERC/DRC/netlist/export checks.
  • Routing operates on immutable candidates. Only a clean, independently graded candidate can become the promoted route chain.
  • Generated 04_kicad/ is a mutable current snapshot and is never hand-source authority. Immutable history lives under release streams.

This makes design changes diffable and rebuildable. It also means a generator defect can become a physical defect, so freshness, parity, nonzero coverage, registered models, and independent review are first-class gates.

Claims and releases

A release is an immutable reviewed candidate archive. It is not automatically an order event. A design can be electrically sound and sealed while remaining DO-NOT-ORDER because stock, uploader selections, physical fit, or first- article evidence is owed.

PCB and enclosure versions are independent streams. Current enclosure release tooling publishes immutable INCOMPLETE candidates bound to one exact PCB release without forcing that PCB to be resealed; it does not yet publish a higher readiness claim from caller-supplied scope status. A future firmware stream, exact product lock, and integrated product-level digital twin remain tracked work, not current release authority.

Toolchain

Core documentation and planning use normal Python 3. KiCad operations require the KiCad-bundled Python where import pcbnew succeeds plus kicad-cli. TSX generation requires the pinned tscircuit/Bun environment. Fresh routing requires the configured KiCadRoutingTools installation; replaying a selected authenticated route authority does not.

Python entry points expose --help; shell-conductor forms are documented in the execution graph. Use the owning current command rather than copying an old invocation from a project journal.

Validate a workflow change

At minimum:

bash
python3 skills/pcb-design/scripts/skill_authority_check.py
python3 tests/t1_skill_progressive_disclosure.py
python3 tests/t1_pcb_documentation.py
python3 scripts/contracts_audit.py --walk --root skills/pcb-design

Run the domain suites affected by the change, then commit at a green boundary.

License

Except where otherwise noted, all original content in this repository is licensed under the MIT License. This includes software, documentation, prompts, schematics, PCB layouts, mechanical CAD files, and generated design artifacts.

Third-party materials remain subject to their respective copyright and license terms and are not relicensed by this repository.

See third-party notices for material provenance and contribution guidelines for new submissions.

Parts

101
QtyValueFootprintReferences
6100n INACapacitor_SMD:C_0805_2012MetricCB1, CB2, CB3, CB4, CB5, CB6
6100n diffCapacitor_SMD:C_0805_2012MetricCD1, CD2, CD3, CD4, CD5, CD6
610R sense+Resistor_SMD:R_0805_2012MetricRP1, RP2, RP3, RP4, RP5, RP6
610R sense-Resistor_SMD:R_0805_2012MetricRN1, RN2, RN3, RN4, RN5, RN6
63557-2 ATO 30A MAXbbar:FuseHolder_Keystone_3557-2F1, F2, F3, F4, F5, F6
6INA238AIDGSRPackage_SO:MSOP-10_3x3mm_P0.5mmU1, U2, U3, U4, U5, U6
6WSLP2726 0.5mRbbar:R_Shunt_WSLP2726RS1, RS2, RS3, RS4, RS5, RS6
4MountingHole_3.2mm_M3MountingHole_3.2mm_M3H1, H2, H3, H4
222u 3V3Capacitor_SMD:C_1206_3216MetricC5, C6
24u7 50VCapacitor_SMD:C_1210_3225MetricC1, C2
1+12-24V IN M5 LUGbbar:Lug_M5J7
10466002 2AFuse:Fuse_1206_3216MetricF7
1100k UVLO loResistor_SMD:R_0805_2012MetricR27
1100n U11Capacitor_SMD:C_0805_2012MetricC9
1100n U7Capacitor_SMD:C_0805_2012MetricC8
1100n VINCapacitor_SMD:C_0805_2012MetricC3
1100n VUSBCapacitor_SMD:C_0805_2012MetricC13
1100n bootCapacitor_SMD:C_0805_2012MetricC4
1100n corridor 3V3Capacitor_SMD:C_0805_2012MetricC14
110k ALERT puResistor_SMD:R_0805_2012MetricR17
110k CS puResistor_SMD:R_0805_2012MetricR19
110k EN puResistor_SMD:R_0805_2012MetricR21
110k FB loResistor_SMD:R_0805_2012MetricR25
110k IO2 puResistor_SMD:R_0805_2012MetricR18
110k IO8 puResistor_SMD:R_0805_2012MetricR20
110u LDO inCapacitor_SMD:C_0805_2012MetricC11
11k ST LEDResistor_SMD:R_0805_2012MetricR29
11u ENCapacitor_SMD:C_0805_2012MetricC10
122u LDO outCapacitor_SMD:C_1206_3216MetricC12
122u SWPA6045SInductor_SMD:L_Sunlord_SWPA6045SL1
122u U7Capacitor_SMD:C_1206_3216MetricC7
12k PWR LEDResistor_SMD:R_0805_2012MetricR28
133k FB hiResistor_SMD:R_0805_2012MetricR24
14k7 SCL puResistor_SMD:R_0805_2012MetricR16
14k7 SDA puResistor_SMD:R_0805_2012MetricR15
1560k UVLO hiResistor_SMD:R_0805_2012MetricR26
15k1 CC1Resistor_SMD:R_0805_2012MetricR22
15k1 CC2Resistor_SMD:R_0805_2012MetricR23
1AMS1117-3.3Package_TO_SOT_SMD:SOT-223-3_TabPin2U9
1B5819W ORDiode_SMD:D_SOD-123D8
1BOOTButton_Switch_SMD:SW_Push_1P1T_XKB_TS-1187ASW2
1DEBUG UART DNPConnector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_VerticalJ10
1ESP32-C3-WROOM-02-N4bbar:ESP32-C3-WROOM-02_D03U7
1GND REF M4 LUGbbar:Lug_M4J8
1KT-0805G PWRLED_SMD:LED_0805_2012MetricLED1
1KT-0805G STLED_SMD:LED_0805_2012MetricLED2
1LMR16006XDDCRPackage_TO_SOT_SMD:TSOT-23-6U8
1PORT 1 M4 LUGbbar:Lug_M4J1
1PORT 2 M4 LUGbbar:Lug_M4J2
1PORT 3 M4 LUGbbar:Lug_M4J3
1PORT 4 M4 LUGbbar:Lug_M4J4
1PORT 5 M4 LUGbbar:Lug_M4J5
1PORT 6 M4 LUGbbar:Lug_M4J6
1RESETButton_Switch_SMD:SW_Push_1P1T_XKB_TS-1187ASW1
1SMBJ33A tap TVSDiode_SMD:D_SMBD10
1SMCJ33A bus TVSDiode_SMD:D_SMCD9
1SS310 catchDiode_SMD:D_SMAD11
1SS310 rev blockDiode_SMD:D_SMAD7
1TYPE-C-31-M-12Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12J9
1USBLC6-2SC6Package_TO_SOT_SMD:SOT-23-6U10
1W25Q64JVSSIQPackage_SO:SOIC-8_5.3x5.3mm_P1.27mmU11

More from misko/prompt2device

12
  • 4 layers220 × 120 mmCandidate filled profile, the printed circuit board in 3D

    Candidate filled profile

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    569 parts3MIT
  • 4 layers156 × 100 mmCrow audio carrier v1, the printed circuit board in 3D

    Crow audio carrier v1

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    340 parts3MIT
  • 6 layers176 × 122 mmRoute, the printed circuit board in 3D

    Route

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    238 parts3MIT
  • 4 layers188 × 92 mmCooksense, the printed circuit board in 3D

    Cooksense

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    226 parts3MIT
  • 4 layers130 × 90 mmProgrammable usb2 hub, the printed circuit board in 3D

    Programmable usb2 hub

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    218 parts3MIT
  • 4 layers130 × 90 mmFinal chain, the printed circuit board in 3D

    Final chain

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    206 parts3MIT
  • 6 layers170 × 120 mmRv2 final, the printed circuit board in 3D

    Rv2 final

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    203 parts3MIT
  • 4 layers150 × 120 mmPi usb port switch, the printed circuit board in 3D

    Pi usb port switch

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    197 parts3MIT
  • 4 layers252 × 92 mmCooksense, the printed circuit board in 3D

    Cooksense

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    195 parts3MIT
  • 4 layers150 × 115 mmUsb controlled debug hub 2a, the printed circuit board in 3D

    Usb controlled debug hub 2a

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    190 parts3MIT
  • 4 layers185 × 120 mmR1b, the printed circuit board in 3D

    R1b

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    182 parts3MIT
  • 4 layers130 × 100 mmUsb controlled debug hub, the printed circuit board in 3D

    Usb controlled debug hub

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    175 parts3MIT

Similar boards

  • 6 layers78 × 89.5 mmAtx-24pin rev3, the printed circuit board in 3D

    Atx-24pin rev3

    nathanfraske/CEC-Platform

    ONE board file, kept current by the wave (owner directive 2026-07-25: "the current best should be placed into a candidate folder per board and kept current with only one board ideally so we have a reference").

    129 partsApache-2.0
  • 2 layers70 × 64 mmWindpcb, the printed circuit board in 3D

    Windpcb

    lindestad/wind-controller

    LINDESTAD simracing wind controller: ESP32-C3 Zephyr firmware, KiCad PCB and SimHub integration

    82 parts
  • 2 layers71.8 × 62.2 mmAir quality pcb v7, the printed circuit board in 3D

    Air quality pcb v7

    NilsEngelbach/air-quality-pcb

    Seventh iteration: ESP8266 → ESP32-C3 (native USB, no UART bridge), fixes from the v6 design review, right-angle switches with longer actuators, a STEMMA QT port for optional sensors, and charge-status sensing.

    85 parts
  • 4 layers60 × 32 mmSUNNY C1-MAIN, the printed circuit board in 3D

    SUNNY C1-MAIN

    RSXLX/sunny-the-growing-sunflower-lamp

    SUNNY — The Growing Sunflower Lamp | A personal lamp with customizable exteriors, traceable fabrication, and a local creative workspace.

    33 parts
  • 2 layers58 × 42 mmAquarium mine ctrl, the printed circuit board in 3D

    Aquarium mine ctrl

    develmusa/Thermomine

    Thermomine is a 3D-printed naval mine that sits on the gravel of your tank. A sealed LED inside glows blue when the water is too cold, green when it's just right, and red when it's too warm.

    25 parts
  • 2 layers140 × 64 mmThermostat v3, the printed circuit board in 3D

    Thermostat v3

    Connicpu/thermostat

    DIY Zigbee thermostat (ESP32-C6) with day/night schedule and a Home Assistant Lovelace card

    101 partsMIT
  • 2 layers60 × 40 mmAstra board, the printed circuit board in 3D

    Astra board

    verIdyia/astra-board

    ESP32-C3 development board: a documented AI-assisted PCB experiment

    53 parts
  • 4 layers75.9 × 105.9 mmHydroBall, the printed circuit board in 3D

    HydroBall

    CIDCO-dev/Poseidon

    Hydrographic surveying platform operating system

    65 parts11MIT

Questions

How big is the Route PCB?

It measures 165 × 64 mm and has 2 copper layers, 1.6 mm thick.

What parts does the Route use?

101 parts, built around the ESP32-C3-WROOM-02-N4, INA238AIDGSR, LMR16006XDDCR and W25Q64JVSSIQ. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Route KiCad files?

From the misko/prompt2device repository on GitHub, at the commit this page was made from: the board is archived_projects/ble-bus-bar/06_build/route/rB.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.

Can I use the Route design in my own project?

Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).