Skip to the content
PCBKitNew board
2 layers129.8 × 82 mmUberamp1, the printed circuit board in 3D

8-channel tpa3255 amp with dsp (adau1701) and bluetooth (esp32)

Size
129.8 × 82 mm
Copper layers
2
Thickness
1.6 mm
Parts
585
Nets
367
Pads
1,577
Tracks, vias
3,790, 727
Pours
28
Routed
Yes
KiCad
KiCad 8.0 (file 20240108)
Created
2 Jul 2024
Updated
26 Jan 2025

Overview

Uberamp1 is an open-source printed circuit board by DeepSOIC, from the DeepSOIC/uberamp1 repository on GitHub. It is a 2-layer board of 129.8 × 82 mm with 585 parts on 367 nets, routed with 3,790 tracks and 727 vias.

It is built around the OPA1642AID, TPA3255DDV and AK4454VN, with the MC33275D-3.3 among its other parts. Its parts include 232 resistors, 192 capacitors, 26 diodes, 23 switches and 22 ICs.

Main components

4

README

README.md

Feautures

  • output channels: 8 independent(*) single-ended power outputs (TPA3255) + 2 headphone-amplified output channels + 2 non-amplified adau1701 dacs
    • independent 8 single-ended outputs can be arbitrarily combined into btl or even 3-phase-like arrangements.
    • BTL protections of the tpa chip can be enabled with solder bridges on the board
  • two tpa3255 amps with full coverage of their supply range and peak output current(**)
  • easy-to-program yet flexible adau1701 dsp chip, with self-boot memory on the board
  • low-noise AK4454 dacs allow to use the full 113db(***) of dynamic range of the TPA3255
  • 2 "feedbass" amplifiers on board, and places for resistors for custom analog mixing of feedbass into outputs.
  • capacitor-free analog signal path (except analog inputs) allows to output dc, so uberamp1 can be used to drive motors
  • 2 analog input channels
  • bluetooth receiver with digital connection to the dsp (firmware = TODO)
  • pads for summing inputs for each amp channel to allow adding custom analog feedbacks

(*) there is no place for decoupling capacitors on the board. So you might use one of the outputs as "ground", leaving you with 7 channels. In BTL, there are 4 output channels.

(**) at high supply voltage or high load currents, heatsinking becomes a challenge. It dissipates about 11W total in silence at 48 V.

(***) 113db is for BTL only. In SE mode, or across amps, the dynamic range of TPA3255 is much lower at 101 db.

known problems (v1):

  • power amps don't start exactly in sync, causing large excursion at powerup if a speaker is connected between amps. Seems unfixable.
  • i don't have a good heat sink solution yet.
  • dacs don't start up if the supply is raised slowly. Can be fixed with a bodge wire connecting "pg" net to "pd" pins of the dac chips
  • it is very challenging to solder.

soldering

TLDR: manufacturability is screwed up on v1.

While the board was designed for hand-soldering, the footprints for 0603 passives turned out to not work well for hand-soldering. It is further exacerbated by some bad placements - some pads are unreachable with a reasonable soldering iron. It seems that a lot of 0603 footprints can instead be populated with 0402 parts, that should make hand-soldering somewhat easier...

Reflow soldering for passives whould probably work well... but some other foorprints are completely unusable for reflow soldering.

Parts

585
QtyValueFootprintReferences
7610uinvendelirium_audio:C_0603C1, C13, C15, C100, C101, C102, C103, C107, C108, C133, C136, C137, C141, C143, C146, C147 +60
52t2kinvendelirium_audio:R_0603R1, R2, R3, R4, R5, R6, R53, R54, R55, R56, R57, R58, R59, R60, R103, R104 +36
3010kinvendelirium_audio:R_0603R134, R135, R136, R137, R138, R139, R140, R141, R142, R143, R144, R145, R147, R149, R150, R151 +14
23100invendelirium_audio:R_0603R10, R100, R130, R131, R132, R133, R146, R148, R152, R154, R189, R192, R193, R194, R195, R207 +7
16150invendelirium_audio:R_0603R109, R110, R114, R115, R122, R123, R124, R125, R161, R162, R163, R164, R173, R174, R175, R176
16470pFinvendelirium_audio:C_0603C86, C88, C90, C91, C92, C93, C94, C95, C113, C114, C115, C116, C119, C120, C121, C122
16D_Schottkyinvendelirium_general:D_0805D1, D2, D3, D4, D5, D6, D7, D8, D9, D10, D11, D12, D13, D14, D15, D16
16t3.6kinvendelirium_audio:R_0603R108, R111, R116, R117, R126, R127, R128, R129, R165, R166, R167, R168, R177, R178, R179, R180
16t4.32kinvendelirium_audio:R_0603R106, R107, R112, R113, R118, R119, R120, R121, R157, R158, R159, R160, R169, R170, R171, R172
131uinvendelirium_audio:C_0603C3, C9, C12, C14, C42, C43, C45, C50, C79, C109, C155, CU10, CU13
123.3invendelirium_audio:R_0603R22, R23, R26, R27, R28, R29, R44, R45, R49, R50, R51, R52
12OPA1642invendelirium_audio:SOIC-8U1, U2, U3, U4, U5, U6, U7, U8, U11, U12, U16, U17
810nF 63Vinvendelirium_audio:C_0603C31, C32, C33, C34, C65, C66, C67, C68
810u 63VCapacitor_SMD:C_1210_3225MetricC23, C24, C25, C26, C53, C56, C59, C60
810uH 14Ainvendelirium_audio:SPM12565VT-D-verticalL1, L2, L3, L4, L5, L6, L7, L8
81uF 63Vinvendelirium_audio:CB052D0105KBC film capC27, C28, C29, C30, C61, C62, C63, C64
83.9ninvendelirium_audio:C_0603C84, C85, C87, C89, C111, C112, C117, C118
833ninvendelirium_audio:C_0603C19, C20, C21, C22, C54, C55, C57, C58
84.7ninvendelirium_audio:C_0603C5, C6, C7, C8, C35, C36, C40, C41
8sum0TestPoint:TestPoint_Pad_D1.5mms0, s1, s2, s3, s4, s5, s6, s7
8t10kinvendelirium_audio:R_0603R15, R16, R17, R18, R32, R33, R41, R42
8t330invendelirium_audio:R_0603R11, R12, R13, R14, R30, R31, R39, R40
61kinvendelirium_audio:R_0603R185, R203, R204, R211, R227, R236
533uF 16Vinvendelirium_audio:C_1206_polC129, C130, C131, C142, CU18_2
547kinvendelirium_audio:R_0603R9, R19, R35, R46, R182
5t18kinvendelirium_audio:R_0603R190, R224, R225, R231, R232
4100ninvendelirium_audio:C_0603C123, C126, C144, C156
42.2uinvendelirium_audio:C_0603C10, C11, C51, C52
42.7Kinvendelirium_audio:R_0603R7, R8, R37, R43
4220uF 65Vinvendelirium_general:CP_Radial_D12.5mm_P5.00mmC127, C128, C132, C162
430kinvendelirium_audio:R_0603R25, R38, R73, R101
44.7kinvendelirium_audio:R_0603R20, R21, R47, R48
4470uF 6.3Vinvendelirium_general:CP_Radial_D8.0mm_P3.50mmC80, C81, C105, C110
45.6ninvendelirium_audio:C_0603C158, C159, C160, C161
45Vinvendelirium_general:D_SOD-523_bidiD19, D20, D21, D22
4t4.7kinvendelirium_audio:R_0603R228, R230, R234, R235
4t470invendelirium_audio:R_0603R223, R233, R237, R238
4~MountingHole:MountingHole_3.2mm_M3_DIN965_Pad_TopBottomH2, H3, H4, H5
310invendelirium_audio:R_0603R105, R156, R239
3resetinvendelirium_general:pad_1.2x1.5s28, s30, s31
20.33uFCapacitor_SMD:C_1206_3216MetricC72, C76
2100nFinvendelirium_audio:C_0603C71, C73
2100pinvendelirium_audio:C_0603C4, C39
210kinvendelirium_audio:TC33X-2 trimpotRV1, RV2
212Vbrinvendelirium_general:D_SOD-323D17, D23
21nFCapacitor_SMD:C_0805_2012MetricC70, C75
21uFinvendelirium_audio:C_0603C124, C125
2240invendelirium_audio:R_0603R74, R102
227kinvendelirium_audio:R_0603R24, R36
22kinvendelirium_audio:PV37XRV3, RV4
23.3kinvendelirium_audio:R_0603R181, R188
23n3invendelirium_audio:C_0603C145, C148
2AK4454invendelirium_audio:QFN-8p8p-5x5mmU9, U14
2AudioJack4Connector_Audio:Jack_3.5mm_PJ320D_HorizontalJ6, J8
2Conn_Coaxialinvendelirium_audio:mmcx_f_vertJ2, J9
2L78L05_SOT89Package_TO_SOT_SMD:SOT-89-3U10, U13
2LMR36520invendelirium_audio:SOIC-8-ppadU18, U19
2M1invendelirium_audio:solder-switchJP2, JP5
2M2invendelirium_audio:solder-switchJP1, JP6
2MC33275invendelirium_general:SOT-223-3_TabPin2U23, U24
2Q_NPN_BCEinvendelirium_general:SOT23-3_PO123Q2, Q3
2TPA3255invendelirium_audio:tssop44-powerpadIC1, IC2
2bootinvendelirium_general:pad_1.2x1.5s26, s29
2clippinginvendelirium_general:D_0805LED1, LED4
2faultinvendelirium_general:D_0805LED2, LED3
2out0TestPoint:TestPoint_Pad_D4.0mmTP4, TP6
2out1TestPoint:TestPoint_Pad_D4.0mmTP3, TP8
2out2TestPoint:TestPoint_Pad_D4.0mmTP2, TP7
2out3TestPoint:TestPoint_Pad_D4.0mmTP1, TP5
2refinvendelirium_general:pad_1.2x1.5s36, s45
2sclinvendelirium_general:pad_1.2x1.5s37, s38
2sdinvendelirium_general:pad_1.2x1.5s23, s24
2sdainvendelirium_general:pad_1.2x1.5s39, s40
2slaveinvendelirium_audio:solder-jumperJP3, JP4
2t1kinvendelirium_audio:R_0603R202, R205
2t560invendelirium_audio:R_0603R226, R229
2t6.8kinvendelirium_audio:R_0603R201, R206
2tbdCapacitor_SMD:C_0805_2012MetricC69, C74
1+3v3ainvendelirium_general:pad_1.2x1.5s21
1+3v3dinvendelirium_general:pad_1.2x1.5s22

The 531 most common of 585 parts.

Questions

How big is the Uberamp1 PCB?

It measures 129.8 × 82 mm and has 2 copper layers, 1.6 mm thick.

What parts does the Uberamp1 use?

585 parts, built around the OPA1642AID, TPA3255DDV, AK4454VN and MC33275D-3.3. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Uberamp1 KiCad files?

From the DeepSOIC/uberamp1 repository on GitHub, at the commit this page was made from: the board is uberamp1.kicad_pcb and its schematic audio_input.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the Uberamp1 design in my own project?

Its repository states no licence, so its author keeps all rights: ask DeepSOIC before reusing the design.

Similar boards

  • 4 layers140 × 90 mmTPA3255PBTL, the printed circuit board in 3D

    TPA3255PBTL

    EliMattingly22/TPA3255_ClassD_PBTL

    A KiCAD project for the TPA3255 amplifier in PBTL mode

    140 parts15MIT
  • 2 layers200 × 100 mmAmp600w, the printed circuit board in 3D

    Amp600w

    mx-yah/amp600w

    A high-performance high-power class-D amplifier that enables true premium sound quality with high-efficiency class-D technology

    133 parts6
  • 4 layers121 × 40 mmPowerAmplifier, the printed circuit board in 3D

    PowerAmplifier

    BlockWorker/ModularAudio

    Compact, modular, versatile, hi-fi audio system concept.

    156 parts2
  • 2 layers95 × 95 mmPlate amp, the printed circuit board in 3D

    Plate amp

    duanestorey/hifi-amp

    A high-fidelity four-channel amplifier with active-crossovers and room correction

    114 parts1
  • 2 layers110 × 70 mm0000.0123, the printed circuit board in 3D

    0000.0123

    CyberHooves/0000.0123

    Two channel class D audio amplifier based on the TPA3255 IC.

    96 parts
  • 2 layers65 × 95 mmPlate amp, the printed circuit board in 3D

    Plate amp

    duanestorey/hifi-amp-pcbs

    These are the PCBs representing a two-year passive effort to create, from scratch, an entire hi-fi amplifier with built-in DSP support for active crossovers and room correction.

    32 parts
  • 2 layersKicad Workspace, the printed circuit board in 3D

    Kicad Workspace

    maceintu/Ampli-D

    Amplificateur audio stéréo classe D open hardware : entrées filaires et Bluetooth, DAC audiophile, pilotage par microcontrôleur STM32. Le dépôt contient l'ensemble de la conception — schémas, PCB et firmware.

    162 parts
  • 2 layers61.4 × 110.6 mmIRONMix, the printed circuit board in 3D

    IRONMix

    VoltageFoundryMod/IRONMix

    Eurorack Line-level mixer and Headphone Output module in 4HP

    97 parts2MIT