

Usage
First-party packages 📦 from atopile
- Size
- 83.2 × 44.3 mm
- Copper layers
- 4
- Thickness
- 1.6 mm
- Parts
- 98
- Nets
- 146
- Pads
- 461
- Tracks, vias
- 11,616, 351
- Pours
- 5
- Routed
- Yes
- KiCad
- KiCad 9.0 (file 20241229)
- Created
- 7 Apr 2025
- Updated
- 29 Apr 2026
Overview
Usage is an open-source printed circuit board by atopile, from the atopile/packages repository on GitHub, published under the MIT licence. It is a 4-layer board of 83.2 × 44.3 mm with 98 parts on 146 nets, routed with 11,616 tracks and 351 vias.
Its parts include 37 capacitors, 37 resistors, 8 ICs, 5 diodes and 2 switches.
README
README.mdFirst-party packages 📦 from atopile
This is a monorepo for all the loose packages published by atopile.
Project-specific packages are published from their own repos.
Development
Conventions
Package name restrictions:
-
kebab-case
-
starts with a letter
-
"[a-z][0-9-]+"
-
project directories MUST have the same name as the package
-
drivers for ICs SHOULD be in the format "-x?". eg ti-bq240x
- there should be a single "x" on the end if there are multiple variants of the same part family
- the manufacturer stub should be omitted if the they already do this for ths
-
modules and files should be named like "x?"
- "x" is optional if there is only one variant of the part family
- omit the manufacturer stub from the filename
-
components should be named like ""
-
build names should be:
- "ref-" for reference designs
- "test-" for test builds
- "example-" for example builds
- if only one IC/set of builds exist in a package, the name can be omitted
Contributing
We welcome contributions! Here's how you can help:
- Fork the repository
- Create a new branch for your changes
bash git checkout -b feature/your-feature-name - Make your changes
- Install and run pre-commit hooks to ensure code quality
bash pre-commit install pre-commit run --all-files - Commit your changes with clear, descriptive commit messages
- Push to your fork
- Open a Pull Request with a clear description of your changes
Please ensure your PR:
- Follows the package naming conventions above
- Includes appropriate tests if adding new functionality
- Has all pre-commit checks passing
- Has a clear description of the changes
Building Packages
To build all packages in the repository, use the build-all.sh script:
# Build all packages
./build-all.sh
# Build all packages with specific flags (e.g., --frozen)
./build-all.sh --frozenThe script will attempt to build each package and provide a summary report of successes and failures.
Parts
98| Qty | Value | Footprint | References |
|---|---|---|---|
| 25 | 100nF ±10% 16V X7R | Samsung_Electro_Mechanics_CL05B104KO5NNNC:C0402 | C1, C2, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21, C22, C23, C24, C26 +9 |
| 12 | 10kΩ ±1% 62.5mW | UNI_ROYAL_0402WGF1002TCE:R0402 | R9, R10, R11, R22, R25, R27, R28, R33, R34, R35, R36, R37 |
| 8 | 1kΩ ±1% 62.5mW | UNI_ROYAL_0402WGF1001TCE:R0402 | R1, R2, R3, R4, R5, R6, R7, R8 |
| 8 | 470Ω ±1% 62.5mW | UNI_ROYAL_0402WGF4700TCE:R0402 | R12, R13, R14, R15, R16, R17, R18, R19 |
| 4 | HANRUN_HR911130A:RJ45-TH_HR911130A | RJ1, RJ2, RJ3, RJ4 | |
| 4 | 18pF ±5% 50V C0G | YAGEO_CC0402JRNPO9BN180:C0402 | C10, C11, C34, C35 |
| 2 | ALPSALPINE_SKRPACE010:KEY-SMD_4P-L4.2-W3.2-P2.20-LS4.6 | SW1, SW2 | |
| 2 | HCTL_PM254_2_04_W_8_5:HDR-TH_8P-P2.54-H-F-R2-C4-W8.5 | U6, U7 | |
| 2 | Yangxing_Tech_X322525MRB4SI:OSC-SMD_4P-L3.2-W2.5-BL_SIT8008BI | X1, X2 | |
| 2 | 10µF ±10% 25V X7R | Murata_Electronics_GRM21BZ71E106KE15L:C0805 | C5, C6 |
| 2 | 22µF ±20% 10V X7R | Murata_Electronics_GRM21BZ71A226ME15L:C0805 | C36, C37 |
| 2 | 4.7kΩ ±1% 62.5mW | UNI_ROYAL_0402WGF4701TCE:R0402 | R20, R21 |
| 2 | 5.1kΩ ±1% 62.5mW | UNI_ROYAL_0402WGF5101TCE:R0402 | R29, R30 |
| 1 | STMicroelectronics_USBLC6_2SC6:SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BL | D1 | |
| 1 | Hubei_KENTO_Elec_KT_0603G:LED0603-RD | LED2 | |
| 1 | Diodes_Incorporated_74LVC1T45DW_7:SC-70-6_L2.2-W1.3-P0.65-LS2.1-BR | U8 | |
| 1 | Hubei_KENTO_Elec_KT_0603Y:LED0603-R-RD | LED1 | |
| 1 | WIZNET_W5500:LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL | U3 | |
| 1 | SHOU_HAN_TYPE_C_16PIN_2MD_073:USB-C-SMD_TYPE-C-6PIN-2MD-073 | USB1 | |
| 1 | BHFUSE_BSMD0805_050_15V:F0805 | F1 | |
| 1 | atopile_Logo_25x6mm:atopile_Logo_25x6mm | LOGO1 | |
| 1 | Realtek_Semicon_RTL8305NB_VB_CG:QFN-48_L6.0-W6.0-P0.40-TL-EP4.4 | U2 | |
| 1 | Hubei_KENTO_Elec_KT_0603R:LED0603-RD | LED4 | |
| 1 | OPSCO_Optoelectronics_SK6805SIDE_G_003:LED-SMD_4P-L3.5-W1.6_SK6805SIDE-G-001 | U5 | |
| 1 | Hubei_KENTO_Elec_Blue_light_0603:LED0603-RD | LED3 | |
| 1 | TEXAS_INSTRUMENTS_TPSM863257RDXR:QFN-7_L4.0-W3.3_TPSM863257RDXR | U4 | |
| 1 | Espressif_Systems_ESP32_C3_MINI_1_N4:WIFIM-SMD_ESP32-C3-MINI-1 | U1 | |
| 1 | 100kΩ ±1% 62.5mW | UNI_ROYAL_0402WGF1003TCE:R0402 | R26 |
| 1 | 10nF ±10% 50V X7R | Samsung_Electro_Mechanics_CL05B103KB5NNNC:C0402 | C32 |
| 1 | 10µF ±10% 10V X5R | Samsung_Electro_Mechanics_CL21A106KPFNNNE:C0805 | C25 |
| 1 | 12.4kΩ ±1% 62.5mW | YAGEO_RC0402FR_0712K4L:R0402 | R31 |
| 1 | 1MΩ ±1% 62.5mW | UNI_ROYAL_0402WGF1004TCE:R0402 | R32 |
| 1 | 2.2kΩ ±1% 62.5mW | UNI_ROYAL_0402WGF2201TCE:R0402 | R23 |
| 1 | 2.49kΩ ±1% 62.5mW | RALEC_RTT022491FTH:R0402 | R24 |
| 1 | 22µF ±20% 6.3V X5R | Samsung_Electro_Mechanics_CL10A226MQ8NRNC:C0603 | C3 |
| 1 | 4.7µF ±10% 10V X7R | Samsung_Electro_Mechanics_CL21B475KPFNNNE:C0805 | C33 |
Questions
How big is the Usage PCB?
It measures 83.2 × 44.3 mm and has 4 copper layers, 1.6 mm thick.
What parts does the Usage use?
98 parts. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Usage KiCad files?
From the atopile/packages repository on GitHub, at the commit this page was made from: the board is packages/realtek-rtl8305nb/layouts/usage/usage.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.
Can I use the Usage design in my own project?
Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).
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