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4 layers83.2 × 44.3 mmUsage, the printed circuit board in 3D

First-party packages 📦 from atopile

Size
83.2 × 44.3 mm
Copper layers
4
Thickness
1.6 mm
Parts
98
Nets
146
Pads
461
Tracks, vias
11,616, 351
Pours
5
Routed
Yes
KiCad
KiCad 9.0 (file 20241229)
Created
7 Apr 2025
Updated
29 Apr 2026

Overview

Usage is an open-source printed circuit board by atopile, from the atopile/packages repository on GitHub, published under the MIT licence. It is a 4-layer board of 83.2 × 44.3 mm with 98 parts on 146 nets, routed with 11,616 tracks and 351 vias.

Its parts include 37 capacitors, 37 resistors, 8 ICs, 5 diodes and 2 switches.

README

README.md

First-party packages 📦 from atopile

This is a monorepo for all the loose packages published by atopile.

Project-specific packages are published from their own repos.

Development

Conventions

Package name restrictions:

  • kebab-case

  • starts with a letter

  • "[a-z][0-9-]+"

  • project directories MUST have the same name as the package

  • drivers for ICs SHOULD be in the format "-x?". eg ti-bq240x

    • there should be a single "x" on the end if there are multiple variants of the same part family
    • the manufacturer stub should be omitted if the they already do this for ths
  • modules and files should be named like "x?"

    • "x" is optional if there is only one variant of the part family
    • omit the manufacturer stub from the filename
  • components should be named like ""

  • build names should be:

    • "ref-" for reference designs
    • "test-" for test builds
    • "example-" for example builds
    • if only one IC/set of builds exist in a package, the name can be omitted

Contributing

We welcome contributions! Here's how you can help:

  1. Fork the repository
  2. Create a new branch for your changes
    bash
    git checkout -b feature/your-feature-name
  3. Make your changes
  4. Install and run pre-commit hooks to ensure code quality
    bash
    pre-commit install
    pre-commit run --all-files
  5. Commit your changes with clear, descriptive commit messages
  6. Push to your fork
  7. Open a Pull Request with a clear description of your changes

Please ensure your PR:

  • Follows the package naming conventions above
  • Includes appropriate tests if adding new functionality
  • Has all pre-commit checks passing
  • Has a clear description of the changes

Building Packages

To build all packages in the repository, use the build-all.sh script:

bash
# Build all packages
./build-all.sh

# Build all packages with specific flags (e.g., --frozen)
./build-all.sh --frozen

The script will attempt to build each package and provide a summary report of successes and failures.

Parts

98
QtyValueFootprintReferences
25100nF ±10% 16V X7RSamsung_Electro_Mechanics_CL05B104KO5NNNC:C0402C1, C2, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21, C22, C23, C24, C26 +9
1210kΩ ±1% 62.5mWUNI_ROYAL_0402WGF1002TCE:R0402R9, R10, R11, R22, R25, R27, R28, R33, R34, R35, R36, R37
81kΩ ±1% 62.5mWUNI_ROYAL_0402WGF1001TCE:R0402R1, R2, R3, R4, R5, R6, R7, R8
8470Ω ±1% 62.5mWUNI_ROYAL_0402WGF4700TCE:R0402R12, R13, R14, R15, R16, R17, R18, R19
4HANRUN_HR911130A:RJ45-TH_HR911130ARJ1, RJ2, RJ3, RJ4
418pF ±5% 50V C0GYAGEO_CC0402JRNPO9BN180:C0402C10, C11, C34, C35
2ALPSALPINE_SKRPACE010:KEY-SMD_4P-L4.2-W3.2-P2.20-LS4.6SW1, SW2
2HCTL_PM254_2_04_W_8_5:HDR-TH_8P-P2.54-H-F-R2-C4-W8.5U6, U7
2Yangxing_Tech_X322525MRB4SI:OSC-SMD_4P-L3.2-W2.5-BL_SIT8008BIX1, X2
210µF ±10% 25V X7RMurata_Electronics_GRM21BZ71E106KE15L:C0805C5, C6
222µF ±20% 10V X7RMurata_Electronics_GRM21BZ71A226ME15L:C0805C36, C37
24.7kΩ ±1% 62.5mWUNI_ROYAL_0402WGF4701TCE:R0402R20, R21
25.1kΩ ±1% 62.5mWUNI_ROYAL_0402WGF5101TCE:R0402R29, R30
1STMicroelectronics_USBLC6_2SC6:SOT-23-6_L2.9-W1.6-P0.95-LS2.8-BLD1
1Hubei_KENTO_Elec_KT_0603G:LED0603-RDLED2
1Diodes_Incorporated_74LVC1T45DW_7:SC-70-6_L2.2-W1.3-P0.65-LS2.1-BRU8
1Hubei_KENTO_Elec_KT_0603Y:LED0603-R-RDLED1
1WIZNET_W5500:LQFP-48_L7.0-W7.0-P0.50-LS9.0-BLU3
1SHOU_HAN_TYPE_C_16PIN_2MD_073:USB-C-SMD_TYPE-C-6PIN-2MD-073USB1
1BHFUSE_BSMD0805_050_15V:F0805F1
1atopile_Logo_25x6mm:atopile_Logo_25x6mmLOGO1
1Realtek_Semicon_RTL8305NB_VB_CG:QFN-48_L6.0-W6.0-P0.40-TL-EP4.4U2
1Hubei_KENTO_Elec_KT_0603R:LED0603-RDLED4
1OPSCO_Optoelectronics_SK6805SIDE_G_003:LED-SMD_4P-L3.5-W1.6_SK6805SIDE-G-001U5
1Hubei_KENTO_Elec_Blue_light_0603:LED0603-RDLED3
1TEXAS_INSTRUMENTS_TPSM863257RDXR:QFN-7_L4.0-W3.3_TPSM863257RDXRU4
1Espressif_Systems_ESP32_C3_MINI_1_N4:WIFIM-SMD_ESP32-C3-MINI-1U1
1100kΩ ±1% 62.5mWUNI_ROYAL_0402WGF1003TCE:R0402R26
110nF ±10% 50V X7RSamsung_Electro_Mechanics_CL05B103KB5NNNC:C0402C32
110µF ±10% 10V X5RSamsung_Electro_Mechanics_CL21A106KPFNNNE:C0805C25
112.4kΩ ±1% 62.5mWYAGEO_RC0402FR_0712K4L:R0402R31
11MΩ ±1% 62.5mWUNI_ROYAL_0402WGF1004TCE:R0402R32
12.2kΩ ±1% 62.5mWUNI_ROYAL_0402WGF2201TCE:R0402R23
12.49kΩ ±1% 62.5mWRALEC_RTT022491FTH:R0402R24
122µF ±20% 6.3V X5RSamsung_Electro_Mechanics_CL10A226MQ8NRNC:C0603C3
14.7µF ±10% 10V X7RSamsung_Electro_Mechanics_CL21B475KPFNNNE:C0805C33

Questions

How big is the Usage PCB?

It measures 83.2 × 44.3 mm and has 4 copper layers, 1.6 mm thick.

What parts does the Usage use?

98 parts. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Usage KiCad files?

From the atopile/packages repository on GitHub, at the commit this page was made from: the board is packages/realtek-rtl8305nb/layouts/usage/usage.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.

Can I use the Usage design in my own project?

Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).

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