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4 layers85 × 75 mmUsage, the printed circuit board in 3D

First-party packages 📦 from atopile

Size
85 × 75 mm
Copper layers
4
Thickness
1.6 mm
Parts
72
Nets
201
Pads
485
Tracks, vias
1,223, 152
Pours
3
Routed
Yes
KiCad
KiCad 9.0 (file 20241229)
Created
7 Apr 2025
Updated
29 Apr 2026

Overview

Usage is an open-source printed circuit board by atopile, from the atopile/packages repository on GitHub, published under the MIT licence. It is a 4-layer board of 85 × 75 mm with 72 parts on 201 nets, routed with 1,223 tracks and 152 vias.

Its parts include 34 resistors, 14 ICs, 12 capacitors, 8 connectors and 2 diodes.

README

README.md

First-party packages 📦 from atopile

This is a monorepo for all the loose packages published by atopile.

Project-specific packages are published from their own repos.

Development

Conventions

Package name restrictions:

  • kebab-case

  • starts with a letter

  • "[a-z][0-9-]+"

  • project directories MUST have the same name as the package

  • drivers for ICs SHOULD be in the format "-x?". eg ti-bq240x

    • there should be a single "x" on the end if there are multiple variants of the same part family
    • the manufacturer stub should be omitted if the they already do this for ths
  • modules and files should be named like "x?"

    • "x" is optional if there is only one variant of the part family
    • omit the manufacturer stub from the filename
  • components should be named like ""

  • build names should be:

    • "ref-" for reference designs
    • "test-" for test builds
    • "example-" for example builds
    • if only one IC/set of builds exist in a package, the name can be omitted

Contributing

We welcome contributions! Here's how you can help:

  1. Fork the repository
  2. Create a new branch for your changes
    bash
    git checkout -b feature/your-feature-name
  3. Make your changes
  4. Install and run pre-commit hooks to ensure code quality
    bash
    pre-commit install
    pre-commit run --all-files
  5. Commit your changes with clear, descriptive commit messages
  6. Push to your fork
  7. Open a Pull Request with a clear description of your changes

Please ensure your PR:

  • Follows the package naming conventions above
  • Includes appropriate tests if adding new functionality
  • Has all pre-commit checks passing
  • Has a clear description of the changes

Building Packages

To build all packages in the repository, use the build-all.sh script:

bash
# Build all packages
./build-all.sh

# Build all packages with specific flags (e.g., --frozen)
./build-all.sh --frozen

The script will attempt to build each package and provide a summary report of successes and failures.

Parts

72
QtyValueFootprintReferences
1210kΩ ±1% 62.5mWUNI_ROYAL_0402WGF1002TCE:R0402R1, R2, R19, R20, R23, R24, R29, R30, R31, R32, R33, R34
81kΩ ±1% 62.5mWUNI_ROYAL_0402WGF1001TCE:R0402R9, R10, R11, R12, R13, R14, R15, R16
61µF ±10% 25V X5RSamsung_Electro_Mechanics_CL05A105KA5NQNC:C0402C1, C2, C3, C4, C5, C6
5100nF ±10% 16V X7RSamsung_Electro_Mechanics_CL05B104KO5NNNC:C0402C8, C9, C10, C11, C12
410Ω ±1% 62.5mWUNI_ROYAL_0402WGF100JTCE:R0402R3, R4, R5, R6
44.7kΩ ±1% 62.5mWUNI_ROYAL_0402WGF4701TCE:R0402R17, R18, R21, R22
449.9Ω ±1% 62.5mWYAGEO_RC0402FR_0749R9L:R0402R25, R26, R27, R28
3HRS_DF40C_30DP_0_4V_51:CONN-SMD_DF40C-30DP-0.4V-51CN3, CN5, CN7
3HRS_DF40HC_3_0__30DS_0_4V_51:CONN-SMD_30P-P0.40_DF40HC-3.0-30DS-0.4V-51CN4, CN6, CN8
2DIBO_DB125_3_81_2P_BK_S:CONN-TH_2P-P3.81_DB125-3.81-2P-BK-SU11, U12
2ZHOURI_PM2_54_1_5:HDR-TH_5P-P2.54-V-FU5, U8
2Texas_Instruments_ADS1115IDGSR:MSOP-10_L3.0-W3.0-P0.50-LS5.0-BLU13, U14
2Hong_Cheng_HC_PM254_8_5H_1x24PZ:HDR-TH_24P-P2.54-V-FU6, U7
2HCTL_PM254_2_04_W_8_5:HDR-TH_8P-P2.54-H-F-R2-C4-W8.5U2, U3
20Ω 62.5mWUNI_ROYAL_0402WGF0000TCE:R0402R7, R8
1Hong_Cheng_HC_PM200_4_3H_2x3PZ_02A:HDR-TH_6P-P2.00-V-F-R2-C3-S2.00U4
1PJRC_Teensy_4_1:PJRC_Teensy_4_1U9
1Texas_Instruments_DAC6578SPWR:TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BLU10
1Analog_Devices_ADBMS6822WCCSZ_RL:HVQFN-32_L5.0-W5.0-P0.50-TL-EP2.1U1
1Hubei_KENTO_Elec_Blue_light_0603:LED0603-RDLED1
1Nextron_Z_231012820106:IDC-TH_Z-231012820106CN2
1Xinyangze_YZ88715155P_02025_01:CONN-TH_2P-P2.50_YZ88715155P-02025-01CN1
1atopile_Logo_25x6mm:atopile_Logo_25x6mmLOGO1
1kinghelm_KH_TYPE_C_16P:USB-C-SMD_KH-TYPE-C-16PUSB1
1Hubei_KENTO_Elec_KT_0603G:LED0603-RDLED2
110µF ±20% 6.3V X5RSamsung_Electro_Mechanics_CL10A106MQ8NNNC:C0603C7

Questions

How big is the Usage PCB?

It measures 85 × 75 mm and has 4 copper layers, 1.6 mm thick.

What parts does the Usage use?

72 parts. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Usage KiCad files?

From the atopile/packages repository on GitHub, at the commit this page was made from: the board is packages/adi-adbms6822/layouts/usage/usage.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.

Can I use the Usage design in my own project?

Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).

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