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2 layers201 × 48 mmGringo, the printed circuit board in 3D

Projet à titre educatif :)) hahaha lets go sheesh la Coloc CORP

Size
201 × 48 mm
Copper layers
2
Thickness
1.6 mm
Parts
62
Nets
112
Pads
290
Tracks, vias
487, 38
Pours
4
Routed
Yes
KiCad
KiCad 9.0 (file 20241229)
Created
3 Apr 2025
Updated
15 Jun 2026

Overview

Gringo is an open-source printed circuit board by Coloc-CORP, from the Coloc-CORP/gring-go repository on GitHub. It is a 2-layer board of 201 × 48 mm with 62 parts on 112 nets, routed with 487 tracks and 38 vias.

It is built around the MAX30101EFD+, PAM2401YPADJ and BQ51013ARHLR, with the MAX32664GTGA+T and MCP73831T-2ACI/OT-HXY among its other parts. Its parts include 13 connectors, 8 capacitors, 8 ICs, 7 resistors and 1 inductor.

Main components

5

README

README.md

💍 Smart BLE Ring Project


🧠 Team

  • 🛠️ Hardware Engineers: Mathys Pellen, Pierrick Simon
  • 👨‍💻 Software Engineers: David Cartier, Marius Chritin

📜 Project Description

Development of an ultra-compact smart ring integrating:

  • Bluetooth Low Energy (BLE) communication
  • Heart rate (BPM) measurement
  • Activity and movement tracking
  • Sleep monitoring
  • Skin temperature measurement

Mobile application dedicated to:

  • Real-time collection of biometric data
  • Visualization and analysis of health information
  • Synchronization with Samsung Health using Health Connect API

🛠️ Project Architecture

Hardware

  • Microcontroller: nRF5340 (Nordic Semiconductor)
  • Main Sensors:
    • MAX86150: Heart Rate and SpO2
    • BHI260AP: 6-axis IMU (motion detection)
    • MAX30205 (or equivalent): Skin temperature sensor
  • Charging: Wireless charging with Qi standard (STWLC38 IC)
  • PCB: Flexible PCB (FPC) for compact integration into a ring
  • Casing: Titanium ring, machined or 3D printed

Software

  • Embedded firmware:
    • Developed with nRF Connect SDK (Zephyr RTOS)
    • Standard BLE GATT communication
    • OTA DFU (Firmware update over Bluetooth) supported
  • Android Application:
    • Developed with Android Studio
    • BLE Central communication
    • Integration with Samsung Health via Health Connect

📂 Project Folder Structure

plaintext
/README.md           → Main project documentation
/HW/                 → Hardware designs (schematics, PCB layouts, datasheets)
                     → 3D models of the ring (STEP, STL, F3D formats)
/SW/                 → Embedded firmware for nRF5340 (Zephyr)
                     → Android Studio mobile app project
/doc/                → Specifications, technical documents, research notes

🧩 Technologies and Tools

  • nRF Connect SDK (Zephyr RTOS, Nordic Semiconductor)
  • Segger Embedded Studio or VS Code + nRF Connect Extensions
  • KiCad for PCB design
  • OnShape / SolidWorks for 3D modeling
  • Android Studio for mobile app development
  • GitHub for project management and version control

📈 Roadmap

  • Requirements and specifications definition
  • Component selection
  • BLE basic firmware development
  • BLE mobile application creation
  • First prototype PCB design
  • Hardware prototype fabrication
  • Full system integration and testing
  • Low-power optimization
  • Final miniaturization and industrialization

⚡ Inspirations

  • Samsung Galaxy Ring
  • Oura Ring Gen 3

Parts

62
QtyValueFootprintReferences
21, , , , , , , , , , , , , , , +5
11Conn_01x06Connector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_VerticalJ1, J2, J3, J5, J6, J7, J8, J9, J10, J11, J12
54K7Resistor_SMD:R_0603_1608MetricR1, R2, R3, R6, R7
41uCapacitor_SMD:C_0603_1608MetricC5, C6, C7, C8
210uCapacitor_SMD:C_0603_1608MetricC1, C3
2PTPS7A2018PDBVRPTPS7A2018PDBVR:DBV0005A-IPC_AU4, U6
1100KResistor_SMD:R_0603_1608MetricR5
1100nCapacitor_SMD:C_0603_1608MetricC2
122uCapacitor_SMD:C_0603_1608MetricC4
12u2Inductor_SMD:L_APV_ANR4030L1
132k768ECS-327-12-5-12-TR:XTAL_ECX-12_2X1P2_ECSY1
1750KResistor_SMD:R_0603_1608MetricR4
1AlimConnector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_VerticalJ4
1BQ500212ARGZTBQ500212ARGZT:RGZ0048AU2
1BQ51013ARHLRBQ51013ARHLR:RHL20_2P05X3P05U1
1Conn_01x05_PinConnector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_VerticalJ13
1MAX30101EFD+MAX30101EFD-:21-1048_F143A5&plus_1_MXMU5
1MAX32664GTGA+TMAX32664GTGA-T:21-100264_T2433&plus_2C_MXMU8
1MCP73831T-2ACI/OTMCP73831T-2ACI-OT:SOT-23-5_MC_MCHU3
1PAM2401YPADJPAM2401YPADJ:SON12_U-DFN3030-12_DIO-MU7

The 59 most common of 62 parts.

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Questions

How big is the Gringo PCB?

It measures 201 × 48 mm and has 2 copper layers, 1.6 mm thick.

What parts does the Gringo use?

62 parts, built around the MAX30101EFD+, PAM2401YPADJ, BQ51013ARHLR and MAX32664GTGA+T. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Gringo KiCad files?

From the Coloc-CORP/gring-go repository on GitHub, at the commit this page was made from: the board is HARDWARE/Gringo/Gringo.kicad_pcb and its schematic HARDWARE/BPM-Module/BPM-Module.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the Gringo design in my own project?

Its repository states no licence, so its author keeps all rights: ask Coloc-CORP before reusing the design.