2 layers201 × 48 mm
2 layers50 × 26 mm
BPM Module
Coloc-CORP/gring-go2Projet à titre educatif :)) hahaha lets go sheesh la Coloc CORP
- Size
- 50 × 26 mm
- Copper layers
- 2
- Thickness
- 2.09 mm
- Parts
- 21
- Nets
- 30
- Pads
- 85
- Tracks, vias
- 201, 24
- Pours
- 2
- Routed
- Yes
- KiCad
- KiCad 9.0 (file 20241229)
- Created
- 3 Apr 2025
- Updated
- 15 Jun 2026
Overview
BPM Module is an open-source printed circuit board by Coloc-CORP, from the Coloc-CORP/gring-go repository on GitHub. It is a 2-layer board of 50 × 26 mm with 21 parts on 30 nets, routed with 201 tracks and 24 vias.
It is built around the MAX32664GWEA+T, MAX30101EFD+ and PAM2401YPADJ. Its parts include 7 capacitors, 7 resistors, 4 ICs, 1 connector and 1 inductor.
Main components
3MAX32664GWEA+T
WLP-16(1.55x1.57)Ambient light suppression function、Hardware reset WLP-16(1.55x1.57) Sensor Modules ROHSMaxim Integrated (Analog Devices)Human Body Sensing Sensor
MAX30101EFD+
--40℃~+85℃ Integrated ambient light cancellation (ALC)、Built-in temperature sensor - Specialized Sensors ROHSMaxim Integrated (Analog Devices)Specialized Sensors
PAM2401YPADJ
U-DFN3030-12-EP-40℃~+85℃ 1 150uA 1A 1MHz 2.5V~5V 900mV~4.75V Adjustable Boost Boost Built-in Yes WDFN-12-EP(3x3) DC-DC Converters ROHSDiodes IncorporatedDC-DC Converters
README
README.md💍 Smart BLE Ring Project
🧠 Team
- 🛠️ Hardware Engineers: Mathys Pellen, Pierrick Simon
- 👨💻 Software Engineers: David Cartier, Marius Chritin
📜 Project Description
Development of an ultra-compact smart ring integrating:
- Bluetooth Low Energy (BLE) communication
- Heart rate (BPM) measurement
- Activity and movement tracking
- Sleep monitoring
- Skin temperature measurement
Mobile application dedicated to:
- Real-time collection of biometric data
- Visualization and analysis of health information
- Synchronization with Samsung Health using Health Connect API
🛠️ Project Architecture
Hardware
- Microcontroller: nRF5340 (Nordic Semiconductor)
- Main Sensors:
- MAX86150: Heart Rate and SpO2
- BHI260AP: 6-axis IMU (motion detection)
- MAX30205 (or equivalent): Skin temperature sensor
- Charging: Wireless charging with Qi standard (STWLC38 IC)
- PCB: Flexible PCB (FPC) for compact integration into a ring
- Casing: Titanium ring, machined or 3D printed
Software
- Embedded firmware:
- Developed with nRF Connect SDK (Zephyr RTOS)
- Standard BLE GATT communication
- OTA DFU (Firmware update over Bluetooth) supported
- Android Application:
- Developed with Android Studio
- BLE Central communication
- Integration with Samsung Health via Health Connect
📂 Project Folder Structure
/README.md → Main project documentation
/HW/ → Hardware designs (schematics, PCB layouts, datasheets)
→ 3D models of the ring (STEP, STL, F3D formats)
/SW/ → Embedded firmware for nRF5340 (Zephyr)
→ Android Studio mobile app project
/doc/ → Specifications, technical documents, research notes🧩 Technologies and Tools
- nRF Connect SDK (Zephyr RTOS, Nordic Semiconductor)
- Segger Embedded Studio or VS Code + nRF Connect Extensions
- KiCad for PCB design
- OnShape / SolidWorks for 3D modeling
- Android Studio for mobile app development
- GitHub for project management and version control
📈 Roadmap
- Requirements and specifications definition
- Component selection
- BLE basic firmware development
- BLE mobile application creation
- First prototype PCB design
- Hardware prototype fabrication
- Full system integration and testing
- Low-power optimization
- Final miniaturization and industrialization
⚡ Inspirations
- Samsung Galaxy Ring
- Oura Ring Gen 3
Parts
21| Qty | Value | Footprint | References |
|---|---|---|---|
| 5 | 4K7 | Resistor_SMD:R_0603_1608Metric | R1, R2, R3, R6, R7 |
| 3 | 1u | Capacitor_SMD:C_0603_1608Metric | C3, C4, C5 |
| 2 | 10u | Capacitor_SMD:C_0603_1608Metric | C1, C7 |
| 1 | 100K | Resistor_SMD:R_0603_1608Metric | R5 |
| 1 | 100n | Capacitor_SMD:C_0603_1608Metric | C2 |
| 1 | 22u | Capacitor_SMD:C_0603_1608Metric | C6 |
| 1 | 2u2 | Inductor_SMD:L_0603_1608Metric | L1 |
| 1 | 32k768 | Crystal:Crystal_SMD_2012-2Pin_2.0x1.2mm | Y1 |
| 1 | 750K | Resistor_SMD:R_0603_1608Metric | R4 |
| 1 | Conn_01x05_Pin | Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical | J1 |
| 1 | MAX30101EFD+ | MAX30101EFD:21-1048_F143A5&plus_1_MXM-M | U1 |
| 1 | MAX32664GWEA+T | MAX32664GWEA-T:21-100241A_W161K1&plus_1_MXM | U2 |
| 1 | PAM2401YPADJ | PAM2401YPADJ:SON12_U-DFN3030-12_DIO-M | U3 |
| 1 | PTPS7A2018PDBVR | PTPS7A2018PDBVR:DBV0005A-IPC_A | U4 |
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Questions
How big is the BPM Module PCB?
It measures 50 × 26 mm and has 2 copper layers, 2.09 mm thick.
What parts does the BPM Module use?
21 parts, built around the MAX32664GWEA+T, MAX30101EFD+ and PAM2401YPADJ. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the BPM Module KiCad files?
From the Coloc-CORP/gring-go repository on GitHub, at the commit this page was made from: the board is HARDWARE/BPM-Module/BPM-Module.kicad_pcb and its schematic HARDWARE/BPM-Module/BPM-Module.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the BPM Module design in my own project?
Its repository states no licence, so its author keeps all rights: ask Coloc-CORP before reusing the design.