4 layers38.5 × 47 mm
4 layers56 × 52 mm
EdgeLink S3 Cellular
CDonohoe-Designs/EdgeLink_S3_CellularEdgeLink S3 Cellular is a four-layer embedded hardware platform combining an ESP32-S3 controller, SIM7080G cellular/GNSS modem, USB-C, battery power management and environmental/motion sensing.
- Size
- 56 × 52 mm
- Copper layers
- 4
- Thickness
- 1.56 mm
- Parts
- 114
- Nets
- 148
- Pads
- 470
- Tracks, vias
- 785, 289
- Pours
- 6
- Routed
- Yes
- KiCad
- KiCad 10.0 (file 20260206)
- Created
- 16 Sep 2026
- Updated
- 20 Oct 2026
Overview
EdgeLink S3 Cellular is an open-source printed circuit board by CDonohoe-Designs, from the CDonohoe-Designs/EdgeLink_S3_Cellular repository on GitHub. It is a 4-layer board of 56 × 52 mm with 114 parts on 148 nets, routed with 785 tracks and 289 vias.
It is built around the ESP32-S3-MINI-1-N8, SIM7080G and BMP384, with the SHT40-AD1B-R2, TPS63802DLAR and BMI323 among its other parts. Its parts include 30 capacitors, 30 resistors, 11 ICs, 8 diodes and 3 switches. It belongs with the ESP32 boards of this library.
Main components
12
ESP32-S3-MINI-1-N8
SMD-104.5dBm -40℃~+85℃ 2.4GHz 20.5dBm 330mA 3V~3.6V 97mA Bluetooth5.0 ESP32-S3FN8 Chip On-board PCB Antenna UART、SPI、I2C、I2S、USB SMD WiFi Modules ROHSEspressif SystemsWiFi Modules
SIM7080G
SMD,17.6x15.7mm2.7V~4.8V B2、B3、B1 I2C、USB、UART、PCM、SPI NB-IoT、CAT-M PCM语音功能 SMD,17.6x15.7mm 2G/3G/4G/5G Modules ROHSSIMCom Wireless Solutions2G/3G/4G/5G Modules
BMP384
LGA-10(2x2)-40℃~+85℃ 1.65V~3.6V 1pa/K 2uA 30Kpa~1.25bar 50pa 9pa I2C、SPI LGA-10(2x2) Pressure Sensors ROHSBosch SensortecPressure Sensors
SHT40-AD1B-R2
DFN-4-EP(1.5x1.5)Temperature And Humidity SensorSensirion
TPS63802DLAR
VSON-10(2x3)-40℃~+125℃@(TJ) 1 1.3V~5.5V 1.4MHz、1.6MHz、2.1MHz 1.8V~5.2V 11uA 2A Adjustable Buck-Boost Buck-Boost Built-in Yes VSON-10(2x3) DC-DC Converters ROHSTexas InstrumentsDC-DC Converters
BMI323
LGA-14-40℃~+85℃ IMU (accelerometer + gyroscope) Motion event detection LGA-14 Accelerometers ROHSBosch SensortecAccelerometers
BQ25185DLHR
WSON-10-EP(2.2x2)-40℃~+125℃ 1 1A 2.2V 3V~18V 4.4V 4uA Charging IC Lithium Battery、LiFePO4 Battery Support WSON-10-EP(2.2x2) Battery Management ROHSTexas InstrumentsBattery Management
MAX17048G+T10
DFN-8-EP(2x2)-40℃~+85℃ 1 2.5V~4.5V 3uA I2C Lithium Battery Not supported Not supported DFN-8-EP(2x2) Battery Management ROHSMaxim Integrated (Analog Devices)Battery Management
TPD2EUSB30ADRT
SOT(9x3)-40℃~+85℃ 0.7pF 2 3.6V 4.5V 45W@8/20us 5A@8/20us 8V ESD IEC 61000-4-2、IEC 61000-4-5 Unidirectional SOT(9x3) ESD and Surge Protection (TVS/ESD) ROHSTexas InstrumentsESD And Surge Protection (TVS/ESD)
SKRKAEE020
SMD,3.9x2.9mm-40℃~+85℃ 1.6N 12V 2.9mm 200,000 Cycles 2mm 3.9mm 50mA Round Button SMD(SMT) Tab SPST-NO Surface Mount,Vertical SMD,3.9x2.9mm Tactile Switches ROHSALPSALPINETactile Switches
LXES15AAA1-153
DFN1006-2ESD And Surge Protection (TVS/ESD)TECH PUBLIC
MMBT3904
SOT-23-55℃~+150℃ 1 NPN 100 100nA 200mA 200mW 300MHz 300mV 40V 6V NPN SOT-23 Bipolar (BJT) ROHSJiangsu Changjing Electronics Technology (CJ)Bipolar (BJT)
README
README.mdEdgeLink S3 Cellular
ESP32-S3 Embedded Hardware Design | LTE-M / NB-IoT | GNSS | Battery Power Management | Four-Layer PCB | KiCad
Engineering overview
EdgeLink S3 Cellular is a four-layer embedded hardware platform combining an ESP32-S3 controller, SIM7080G cellular/GNSS modem, USB-C, battery power management and environmental/motion sensing.
I developed the Rev A schematic and PCB as an engineering portfolio project, demonstrating system architecture, wireless module integration, power-tree design, digital interfaces, multilayer layout and manufacturing documentation.
Project status: The schematic, PCB and manufacturing package are complete as design deliverables. Rev A is an unbuilt design; hardware bring-up and physical performance testing have not been completed.
Engineering portfolio — start here
| Resource | Contents |
|---|---|
| Illustrated engineering portfolio (PDF) | Six-page visual case study with genuine PCB renders, schematic extracts and manufacturing evidence |
| Editable portfolio (Word) | Editable report |
| Portfolio images | PCB top/bottom views, four copper layers, circuit extracts and CAD renders |
| System architecture | Functional system diagram |
| Complete schematic PDF | Hierarchical schematic |
| Editable KiCad project | PCB, schematic and supporting libraries |
| Manufacturing package | Gerbers, BOM and component placement |
Hardware architecture
| Subsystem | Implementation |
|---|---|
| Controller | ESP32-S3-MINI-1-N8 with Wi-Fi/Bluetooth LE and native USB |
| Cellular and positioning | SIMCom SIM7080G LTE-M / NB-IoT and GNSS |
| Charging and power path | TI BQ25185 |
| 3.3 V regulation | TI TPS63802 buck-boost |
| Battery monitoring | MAX17048 fuel gauge |
| Motion sensing | Bosch BMI323 six-axis IMU |
| Environmental sensing | SHT40 temperature/humidity and BMP384 pressure |
| External interfaces | USB-C, Nano-SIM, LTE/GNSS U.FL, battery and I²C |
USB-C provides input power and native USB data. The BQ25185 manages the battery and system supply, while the TPS63802 generates the main 3.3 V rail. The cellular modem is powered from the battery supply through its input filtering. The sensor subsystem uses I²C connections to the ESP32-S3.
Schematic engineering
The hierarchical schematic separates power and USB, ESP32-S3 processing, cellular/GNSS and sensor interfaces. Key circuits include battery charging and regulation, modem power and UART connectivity, RF antenna interfaces, USB-C protection and digital sensor integration.
ESP32-S3 controller core
The ESP32-S3-MINI-1-N8 schematic brings together the controller supply and decoupling, native USB connections, modem control signals, I²C interfaces, reset/boot circuitry and status LED.
USB-C interface
Four-layer PCB implementation
The Rev A PCB integrates power conversion, digital processing, wireless communications and sensors on a nominal 56 × 52 mm board. The layout uses four copper layers with local component decoupling and functional grouping of power, RF and digital circuitry.
Additional PCB views and genuine KiCad CAD renders are included in the illustrated portfolio.
Manufacturing documentation
The Rev A package includes fabrication Gerbers, drill files, a supplier-oriented BOM with LCSC references and component placement data for JLCPCB-oriented assembly preparation.
The assembly BOM contains 46 component groups covering 89 fitted references, matched by the component placement list.
Engineering capabilities demonstrated
- ESP32-S3 and wireless modem hardware integration
- USB-C and digital peripheral interfaces
- Battery charging, power-path and buck-boost architecture
- Four-layer PCB design and RF-aware placement/routing
- Hierarchical KiCad schematic capture and component libraries
- Supplier-oriented BOM, CPL and Gerber preparation
- Technical documentation and traceable engineering deliverables
Repository guide
| Location | Contents |
|---|---|
| Portfolio | Illustrated PDF, Word report and supporting images |
| KiCad source | Editable design and local assets |
| Architecture notes | Functional interfaces and power tree |
| Manufacturing | Fabrication and assembly files |
| Verification records | Detailed internal design-check documentation |
| References | Manufacturer sources and CAD attribution |
Tools: KiCad 10, ESP32-S3 hardware design, wireless module integration, LCSC/JLCPCB-oriented manufacturing workflow and Git/GitHub.
No project-wide licence has been selected. Third-party assets retain their respective rights; see references.
Parts
114| Qty | Value | Footprint | References |
|---|---|---|---|
| 12 | 100n | Capacitor_SMD:C_0402_1005Metric | C1, C8, C9, C10, C11, C12, C13, C26, C27, C28, C29, C30 |
| 6 | 4.7k | Resistor_SMD:R_0402_1005Metric | R15, R16, R30, R31, R32, R33 |
| 6 | PWRKEY | TestPoint:TestPoint_Pad_D1.0mm | TP11, TP12, TP13, TP14, TP15, TP16 |
| 5 | 22R | Resistor_SMD:R_0402_1005Metric | R3, R4, R22, R23, R24 |
| 4 | 1k | Resistor_SMD:R_0402_1005Metric | R6, R13, R19, R20 |
| 4 | DNP | Capacitor_SMD:C_0402_1005Metric | C19, C20, C21, C22 |
| 3 | 100u | Capacitor_SMD:C_0805_2012Metric | C16, C17, C18 |
| 3 | 10K | Resistor_SMD:R_0402_1005Metric | R12, R14, R25 |
| 3 | 1u | Capacitor_SMD:C_0402_1005Metric | C3, C4, C15 |
| 3 | SKRKAEE020 | SKRKAEE020:SW-SMD_L3.9-W3.0-P4.45 | SW1, SW2, SW3 |
| 2 | 0R | Resistor_SMD:R_0402_1005Metric | R27, R28 |
| 2 | 100n | Capacitor_SMD:C_0603_1608Metric | C14, C25 |
| 2 | 100p | Capacitor_SMD:C_0402_1005Metric | C23, C24 |
| 2 | 10u | Capacitor_SMD:C_0603_1608Metric | C2, C5 |
| 2 | 22u | Capacitor_SMD:C_0603_1608Metric | C6, C7 |
| 2 | 47k | Resistor_SMD:R_0402_1005Metric | R17, R18 |
| 2 | 5.1K | Resistor_SMD:R_0402_1005Metric | R1, R2 |
| 2 | LED_R | LED_SMD:LED_0603_1608Metric | D2, D3 |
| 2 | LXES15AAA1-153_C7472903 | LXES15AAA1-153:DFN1006-2L-BI | D7, D8 |
| 2 | MMBT3904 | Package_TO_SOT_SMD:SOT-23 | Q1, Q2 |
| 2 | U.FL-R-SMT-1 | U:RF-SMD_FRF05002-JSS103M | JP1, JP2 |
| 1 | 0.47u | DFE201612E-R47M_P2:INDC2016X120N | L1 |
| 1 | 100k | Resistor_SMD:R_0402_1005Metric | R26 |
| 1 | 1042240820 | 1042240820:SIM-SMD_1042240820 | Card1 |
| 1 | 10R | Resistor_SMD:R_0402_1005Metric | R29 |
| 1 | 10k | Resistor_SMD:R_0402_1005Metric | R8 |
| 1 | 18k | Resistor_SMD:R_0402_1005Metric | R7 |
| 1 | 47n | Inductor_SMD:L_0402_1005Metric | L3 |
| 1 | 511k | Resistor_SMD:R_0402_1005Metric | R9 |
| 1 | 91k | Resistor_SMD:R_0402_1005Metric | R10 |
| 1 | BLM21PG221SN1D | BLM21PG221SN1D:L0805 | L2 |
| 1 | BMI323 | Package_LGA:Bosch_LGA-14_3x2.5mm_P0.5mm | U10 |
| 1 | BMP384 | Sensor_Footprints:BMP390_LGA10_2x2mm | U12 |
| 1 | BQ25185 | BQ25185:WSON10_DLH_TEX | U5 |
| 1 | ESD5651N-2/TR | ESD5651N-2:DFN1006-2L-BI-1 | D6 |
| 1 | ESDA6V1W5 | ESDA6V1W5:SC-70-5_L2.1-W1.3-P0.65-LS2.1-BR | D4 |
| 1 | ESP32-S3-MINI-1-N8 | RF_Module:ESP32-S2-MINI-1 | U6 |
| 1 | ESP_TX_TO_SIM7080 | TestPoint:TestPoint_Pad_D1.0mm | TP9 |
| 1 | GND | TestPoint:TestPoint_Pad_D1.0mm | TP7 |
| 1 | LiPo 1S | Connector_JST:JST_PH_S2B-PH-SM4-TB_1x02-1MP_P2.00mm_Horizontal | JBT1 |
| 1 | MAX17048G+T10 | Package_DFN_QFN:TDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm | U1 |
| 1 | SHT40-AD1B-R2 | Sensor_Footprints:SHT4x_DFN4_1.5x1.5mm | U11 |
| 1 | SIM7080G | SIM7080G:LCC-SMD_SIM7080G | U8 |
| 1 | SIM7080_TX_TO_ESP | TestPoint:TestPoint_Pad_D1.0mm | TP10 |
| 1 | SIM_BAT | TestPoint:TestPoint_Pad_D1.0mm | TP6 |
| 1 | SIM_USB_DM | TestPoint:TestPoint_Pad_D1.0mm | TP4 |
| 1 | SIM_USB_DP | TestPoint:TestPoint_Pad_D1.0mm | TP3 |
| 1 | SIM_USB_VBUS | TestPoint:TestPoint_Pad_D1.0mm | TP5 |
| 1 | SM04B-SRSS-TB | SM04B-SRSS-TB:CONN-SMD_4P-P1.00_SM04B-SRSS-TB-LF-SN | CN1 |
| 1 | SMF5V0A | Diode_SMD:D_SMF | D1 |
| 1 | TPD2EUSB30A | Package_TO_SOT_SMD:Texas_DRT-3 | U2 |
| 1 | TPRCLAMP01892PWQC | TPRCLAMP01892PWQC:DFN1006-2L-BI-1 | D5 |
| 1 | TPS22919DCKR | TPS22919DCKR:SC-70-6_L2.2-W1.3-P0.65-LS2.1-BR | U9 |
| 1 | TPS63802DLAR | TPS63802:TPS63802DLAR | U4 |
| 1 | TXB0108RGYR | TXB0108RGYR:VQFN-20_L4.5-W3.5-P0.50-BL-EP | U7 |
| 1 | USB_BOOT | TestPoint:TestPoint_Pad_D1.0mm | TP2 |
| 1 | USB_C_Receptacle_USB2.0_16P | Connector_USB:USB_C_Receptacle_GCT_USB4105-xx-A_16P_TopMnt_Horizontal | J1 |
| 1 | VBAT | TestPoint:TestPoint_Pad_D1.0mm | TP8 |
| 1 | VDD_EXT | TestPoint:TestPoint_Pad_D1.0mm | TP1 |
The 109 most common of 114 parts.
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Questions
How big is the EdgeLink S3 Cellular PCB?
It measures 56 × 52 mm and has 4 copper layers, 1.56 mm thick.
What parts does the EdgeLink S3 Cellular use?
114 parts, built around the ESP32-S3-MINI-1-N8, SIM7080G, BMP384 and SHT40-AD1B-R2. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the EdgeLink S3 Cellular KiCad files?
From the CDonohoe-Designs/EdgeLink_S3_Cellular repository on GitHub, at the commit this page was made from: the board is hardware/kicad/EdgeLink_S3_Cellular_RevA/EdgeLink_S3_Cellular.kicad_pcb and its schematic hardware/kicad/EdgeLink_S3_Cellular_RevA/00_System_Block_Diagram.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the EdgeLink S3 Cellular design in my own project?
Its repository states no licence, so its author keeps all rights: ask CDonohoe-Designs before reusing the design.