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TS3USB221RSE on a board, in 3D

TS3USB221RSE

Texas Instruments

-40℃~+85℃ 1.1GHz 10ns 17ns 2.3V~3.6V 250ps 2:1 6pF 6Ω USB UQFN-10(1.5x2) Analog Switches - Special Purpose ROHS

Extended
DatasheetJLCPCBLCSCti/TS3USB221RSE
Category
Analog Switches Special Purpose
Package
UQFN-10(1.5x2)
Pins
10

Overview

The TS3USB221RSE is an analog Switches Special Purpose made by Texas Instruments in a UQFN-10(1.5x2) package with 10 pins. -40℃~+85℃ 1.1GHz 10ns 17ns 2.3V~3.6V 250ps 2:1 6pF 6Ω USB UQFN-10(1.5x2) Analog Switches - Special Purpose ROHS.

PCBKit's library has its KiCad symbol (Gekkio_Interface_USB:TS3USB221RSER, from Gekkio) and its footprint (Package_DFN_QFN:UQFN-10_1.6x2.1mm_P0.5mm, from KiCad's library), ready for a KiCad board. 64,325 are in stock at JLCPCB (part C130085). 2 open-source boards in 2 repositories on GitHub use it.

Symbol

1D+11D-22D+32D-4GND5OE6D-7D+8S9VCC10
Gekkio_Interface_USB:TS3USB221RSERFrom Gekkio

Footprint

Package_DFN_QFN:UQFN-10_1.6x2.1mm_P0.5mmFrom KiCad's library

From the datasheet

12
Supply, least
2.3 V · VCC, recommended operating min · p. 4
Supply, most
3.6 V · VCC, recommended operating max · p. 4
Supply, absolute maximum
4.6 V · VCC, absolute max · p. 4
Works from
-40 °C · Operating free-air temperature min · p. 4
Works up to
85 °C · Operating free-air temperature max · p. 4
Takes working
30 µA · VCC supply current max, switch ON or OFF · p. 5
Takes asleep
1 µA · VCC low-power current max, OE high · p. 5
A pin gives at most
120 mA · ON-state switch current absolute max magnitude · p. 4
Junction to air (RSE (UQFN))
204.8 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to board (RSE (UQFN))
121.5 K/W · Junction-to-board thermal resistance · p. 5
Junction to case (RSE (UQFN))
118.1 K/W · Junction-to-case (top) thermal resistance · p. 5
Data rate, most
480 Mbit/s · High-speed USB 2.0 supported data rate · p. 12

What it is and has

8
Switch topology
2-channel SPDT, bidirectional USB 2.0 switch · p. 12
Signal voltage tolerance
Up to 5.5V · p. 1
Control inputs
1.8V compatible · p. 1
Low-power mode
1μA when OE is disabled · p. 1
ON resistance
6Ω maximum · p. 1
ON resistance matching
0.2Ω typical · p. 1
ON capacitance
6pf maximum · p. 1
Package
RSE (UQFN, 10), 2mm × 1.5mm · p. 1

Around it

2
cap 0.1 μF
between VCC and GND; Supply bypass capacitor in the typical application; place as close to VCC as possible. · p. 13
res 50Ω
between unused pins and GND; Recommended termination to prevent signal reflections. · p. 13

Specifications

58
ParameterConditionsAs printedPage
Supply voltage VCCOver operating free-air temperature rangemin -0.5 · max 4.6 V4
Control input voltage VINOver operating free-air temperature rangemin -0.5 · max 7 V4
Switch I/O voltage VI/OOver operating free-air temperature rangemin -0.5 · max 7 V4
Control input clamp current IIKVIN < 0max -50 mA4
I/O port clamp current II/OKVI/O < 0max -50 mA4
ON-state switch current II/OMaximum magnitude; printed rating ±120 mAmax 120 mA4
Continuous current through VCC or GNDMaximum magnitude; printed rating ±100 mAmax 100 mA4
Storage temperature Tstgmin -65 · max 150 °C4
Electrostatic discharge V(ESD)Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; ±2000 Vmax 2000 V4
Electrostatic discharge V(ESD)Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002; ±1500 Vmax 1500 V4
Supply voltage VCCmin 2.3 · max 3.6 V4
Low-level control input voltage VILVCC = 2.3V to 2.7V; maximum 0.25 × VCCmin 0 V4
Low-level control input voltage VILVCC = 2.7V to 3.6V; maximum 0.25 × VCCmin 0 V4
Data input/output voltage VI/Omin 0 · max 5.5 V4
Operating free-air temperature TAmin -40 · max 85 °C4
Junction-to-ambient thermal resistance RθJARSE (UQFN), 10 PINStyp 204.8 °C/W5
Junction-to-case (top) thermal resistance RθJC(top)RSE (UQFN), 10 PINStyp 118.1 °C/W5
Junction-to-board thermal resistance RθJBRSE (UQFN), 10 PINStyp 121.5 °C/W5
Junction-to-top characterization parameter ψJTRSE (UQFN), 10 PINStyp 13.9 °C/W5
Junction-to-board characterization parameter ψJBRSE (UQFN), 10 PINStyp 121.2 °C/W5
Control inputs VIKVCC = 3.6V, 2.7V; II = –18mAmin -1.8 V5
Control inputs IINVCC = 3.6V, 2.7V, 0V; VIN = 0V to 3.6V; maximum magnitude ±1 uAmax 1 uA5
IOZ IOZVCC = 3.6V, 2.7V; VIN = VCC or GND; VO = 0V to 3.6V; VI = 0V; Switch OFF; maximum magnitude ±1 uAmax 1 uA5
IOFF IOFFVCC = 0V; VI/O = 0V to 3.6V; maximum magnitude ±2 uAmax 2 uA5
IOFF IOFFVCC = 0V; VI/O = 0V to 2.7V; maximum magnitude ±1 uAmax 1 uA5
ICC ICCVCC = 3.6V, 2.7V; II/O = 0V; VIN = VCC or GND; Switch ON or OFFmax 30 uA5
ICC (low power mode) ICCVCC = 3.6V, 2.7V; VIN = VCC or GND; Switch disabled (OE in high state)max 1 uA5
Control inputs ΔICCOne input at 1.8V; Other inputs at VCC or GND; VCC = 3.6Vmax 20 uA5
Control inputs ΔICCOne input at 1.8V; Other inputs at VCC or GND; VCC = 2.7Vmax 0.5 uA5
Control inputs CinVCC = 3.3V, 2.5V; VIN = 3.3V or 0Vtyp 1 · max 2 pF5
Cio(OFF) Cio(OFF)VCC = 3.3V, 2.5V; VI/O = 3.3V or 0V; Switch OFFtyp 3 · max 4 pF5
Cio(ON) Cio(ON)VCC = 3.3V, 2.5V; VI/O = 3.3V or 0V; Switch ONtyp 5 · max 6 pF5
ron ronVCC = 3V, 2.3V; VI = 0V; IO = 30mAmax 6 Ω5
ron ronVCC = 3V, 2.3V; VI = 2.4V; IO = –15mAmax 6 Ω5
Δron ΔronVCC = 3V, 2.3V; VI = 0V; IO = 30mAtyp 0.2 Ω5
Δron ΔronVCC = 3V, 2.3V; VI = 1.7; IO = –15mAtyp 0.2 Ω5
ron(flat) ron(flat)VCC = 3V, 2.3V; VI = 0V; IO = 30mAtyp 1 Ω5
ron(flat) ron(flat)VCC = 3V, 2.3V; VI = 1.7; IO = –15mAtyp 1 Ω5
Crosstalk XTALKTA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0V; RL = 50Ω, f = 250MHztyp -40 dB6
OFF isolation OIRRTA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0V; RL = 50Ω, f = 250MHztyp -41 dB6
Bandwidth (–3dB) BWTA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0V; RL = 50Ωtyp 1 GHz6
Crosstalk XTALKTA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0V; RL = 50Ω, f = 250MHztyp -39 dB6
OFF isolation OIRRTA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0V; RL = 50Ω, f = 250MHztyp -40 dB6
Bandwidth (–3dB) BWTA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0V; RL = 50Ωtyp 1 GHz6
Propagation delay tpdTA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0Vtyp 0.25 ns6
Line enable time tONTA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0V; S to D, nDmax 30 ns6
Line enable time tONTA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0V; OE to D, nDmax 17 ns6
Line disable time tOFFTA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0V; S to D, nDmax 12 ns6
Line disable time tOFFTA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0V; OE to D, nDmax 10 ns6
Output skew between center port to any other port tSK(O)TA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0Vtyp 0.1 · max 0.2 ns6
Skew between opposite transitions of the same output (tPHL – tPLH) tSK(P)TA = –40°C to 85°C; VCC = 3.3V ± 10%; GND = 0Vtyp 0.1 · max 0.2 ns6
Propagation delay tpdTA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0Vtyp 0.25 ns6
Line enable time tONTA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0V; S to D, nDmax 50 ns6
Line enable time tONTA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0V; OE to D, nDmax 32 ns6
Line disable time tOFFTA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0V; S to D, nDmax 23 ns6
Line disable time tOFFTA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0V; OE to D, nDmax 12 ns6
Output skew between center port to any other port tSK(O)TA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0Vtyp 0.1 · max 0.2 ns6
Skew between opposite transitions of the same output (tPHL – tPLH) tSK(P)TA = –40°C to 85°C; VCC = 2.5V ± 10%; GND = 0Vtyp 0.1 · max 0.2 ns6

Pins, by the datasheet

10
1 1D+
USB port 1. · p. 3
2 1D–
USB port 1. · p. 3
3 2D+
USB port 2. · p. 3
4 2D–
USB port 2. · p. 3
5 GND
Ground. · p. 3
6 OE
Bus-switch enable. · p. 3
7 D–
Common USB port. · p. 3
8 D+
Common USB port. · p. 3
9 S
Select input. · p. 3
10 VCC
Supply voltage. · p. 3

Parameters

21
-3dB Bandwidth
1.1GHz
Applications
USB
Bandwidth
1.1GHz
Con
6pF
Current - Supply
30uA
Data Rate
480Mbps
Features
Bidirectional analog channel
Number of Channels
2
Operating Temperature
-40℃~+85℃
Output Current per Pin(Max)
120mA
Propagation Delay (tpd)
250ps
Ron
6Ω
Standby Current
1uA
Switch Circuit
2:1
Thermal Resistance(Junction to Ambient)
204.8℃/W
Thermal Resistance(Junction to Board)
121.5℃/W
Thermal Resistance(Junction to Case)
118.1℃/W
Turn-off time
10ns
Turn-on time
17ns
Voltage - Supply
2.3V~3.6V
Voltage - Supply(Absolute Max)
4.6V

Order codes

2

Pinout

10
The pins of the TS3USB221RSE
PinNameType
11D+Input/output
21D-Input/output
32D+Input/output
42D-Input/output
5GNDPower in
6OEInput
7D-Input/output
8D+Input/output
9SInput
10VCCPower in

Open-source boards using it

All 2
  • 2 layers130 × 115 mmObd2-simulator, the printed circuit board in 3D

    Obd2-simulator

    FilipRaic/obd2-simulator

    Open-source OBD-II simulator board: emulates a vehicle ECU per SAE J1979 and ISO 15031-5 over CAN. ESP32-S3 + MCP2515, 21 simulated parameters, DTC bank with MIL.

    107 partsMIT
  • 4 layers88 × 88 mmPump, the printed circuit board in 3D

    Pump

    EpicQuestBio/MR1

    MR1 specs

    28 parts1CC0-1.0

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Questions

Is there a KiCad symbol and footprint for the TS3USB221RSE?

Yes. The symbol is Gekkio_Interface_USB:TS3USB221RSER and the footprint Package_DFN_QFN:UQFN-10_1.6x2.1mm_P0.5mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the TS3USB221RSE?

UQFN-10(1.5x2), with 10 pins. Its footprint is drawn on this page.

Where is the TS3USB221RSE datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the TS3USB221RSE?

JLCPCB lists it as part C130085, with 64,325 in stock; the sellers' links on this page open their listings.

What can replace the TS3USB221RSE?

Parts like it in the library: the TS3USB221ARSE by Texas Instruments, the TS3USB221ARSER-HXY by HXY MOSFET, the TS3USB3000RSER-HXY by HXY MOSFET and the PI3USB4000DQ1ZUAEX-HXY by HXY MOSFET. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the TS3USB221RSE?

2 boards in 2 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

4