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MAX3232ID on a board, in 3D

MAX3232ID

Texas Instruments

-40℃~+85℃ 2 2 250Kbps 300uA 3V~5.5V Short-Circuit Protection Transceiver Yes ±15kV SOIC-16 RS232 ICs ROHS

Extended
Category
RS232 ICs
Package
SOIC-16
Pins
16

Overview

The MAX3232ID is a RS232 IC made by Texas Instruments in a SOIC-16 package with 16 pins. -40℃~+85℃ 2 2 250Kbps 300uA 3V~5.5V Short-Circuit Protection Transceiver Yes ±15kV SOIC-16 RS232 ICs ROHS.

PCBKit's library has its KiCad symbol (Interface_UART:MAX3232, from KiCad's library) and its footprint (Package_SO:SOIC-16_3.9x9.9mm_P1.27mm, from KiCad's library), ready for a KiCad board. JLCPCB lists it (part C18261). 186 open-source boards in 154 repositories on GitHub use it.

Symbol

LOGICRS232C1+1VS+2C1-3C2+4C2-5VS-6T2OUT7R2IN8R2OUT9T2IN10T1IN11R1OUT12R1IN13T1OUT14GND15VCC16
Interface_UART:MAX3232From KiCad's library

Footprint

12345678910111213141516
Package_SO:SOIC-16_3.9x9.9mm_P1.27mmFrom KiCad's library

From the datasheet

13
Supply, least
3 V · VCC, recommended operating minimum, 3.3 V operation · p. 4
Supply, most
3.6 V · VCC, recommended operating maximum, 3.3 V operation · p. 4
Supply, least
4.5 V · VCC, recommended operating minimum, 5 V operation · p. 4
Supply, most
5.5 V · VCC, recommended operating maximum, 5 V operation · p. 4
Supply, absolute maximum
6 V · VCC, absolute maximum · p. 4
Works from
-40 °C · Operating free-air temperature minimum, MAX3232I · p. 4
Works up to
85 °C · Operating free-air temperature maximum, MAX3232I · p. 4
Junction, hottest
150 °C · Operating virtual junction temperature maximum · p. 4
Takes working
300 µA · VCC supply current typical, no load, VCC = 3.3 V to 5 V · p. 5
Junction to air (SOIC (D))
85.9 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to case (SOIC (D))
43.1 K/W · Junction-to-case (top) thermal resistance · p. 5
Junction to board (SOIC (D))
44.5 K/W · Junction-to-board thermal resistance · p. 5
Data rate, most
250 kbit/s · Maximum data rate typical, RL = 3 kΩ, CL = 1000 pF, one DOUT switching · p. 6

What it is and has

5
Drivers and receivers
Two drivers and two receivers · p. 1
Data rate
Up to 250 kbit/s · p. 1
External capacitors
4 × 0.1 μF · p. 1
Logic input compatibility
Accepts 5-V logic input with 3.3-V supply · p. 1
Protection
Outputs protected against shorts to ground · p. 9

Specifications

44
ParameterConditionsAs printedPage
Supply voltage range(2) VCCmin -0.3 · max 6 V4
Positive output supply voltage range(2) V+min -0.3 · max 7 V4
Negative output supply voltage range(2) V–min -7 · max 0.3 V4
Supply voltage difference(2) V+ – V–max 13 V4
Input voltage range VIDriversmin -0.3 · max 6 V4
Input voltage range VIReceiversmin -25 · max 25 V4
Output voltage range VODriversmin -13.2 · max 13.2 V4
Output voltage range VOReceiversmin -0.3 V4
Operating virtual junction temperature TJmax 150 °C4
Storage temperature range Tstgmin -65 · max 150 °C4
Electrostatic discharge V(ESD)Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; RIN, DOUT, and GND pinsmax 15000 V4
Electrostatic discharge V(ESD)Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; all other pinsmax 3000 V4
Electrostatic discharge V(ESD)Charged device model (CDM), per JEDEC specification JESD22-C101, all pinsmax 1000 V4
Supply voltage VCCVCC = 3.3 V; nominal 3.3 Vmin 3 · max 3.6 V4
Supply voltage VCCVCC = 5 V; nominal 5 Vmin 4.5 · max 5.5 V4
Driver high-level input voltage VIHDIN, VCC = 3.3 Vmin 2 V4
Driver high-level input voltage VIHDIN, VCC = 5 Vmin 2.4 V4
Driver low-level input voltage VILDINmax 0.8 V4
Driver input voltage VIDINmin 0 · max 5.5 V4
Receiver input voltage VIRINmin -25 · max 25 V4
Operating free-air temperature TAMAX3232Imin -40 · max 85 °C4
Junction-to-ambient thermal resistance RθJASOIC (D), 16 pinstyp 85.9 °C/W5
Junction-to-case (top) thermal resistance RθJC(top)SOIC (D), 16 pinstyp 43.1 °C/W5
Junction-to-board thermal resistance RθJBSOIC (D), 16 pinstyp 44.5 °C/W5
Junction-to-top characterization parameter ψJTSOIC (D), 16 pinstyp 10.1 °C/W5
Junction-to-board characterization parameter ψJBSOIC (D), 16 pinstyp 44.1 °C/W5
Supply current ICCNo load, VCC = 3.3 V to 5 Vtyp 0.3 · max 1 mA5
High-level output voltage VOHDOUT at RL = 3 kΩ to GND, DIN = GNDmin 5 · typ 5.4 V5
Low-level output voltage VOLDOUT at RL = 3 kΩ to GND, DIN = VCCmin -5 · typ -5.4 V5
Output resistance rOVCC, V+, and V– = 0 V; VO = ±2 Vmin 300 Ω5
Low-level output voltage VOLIOL = 1.6 mAmax 0.4 V6
Positive-going input threshold voltage VIT+VCC = 3.3 Vtyp 1.5 · max 2.4 V6
Positive-going input threshold voltage VIT+VCC = 5 Vtyp 1.8 · max 2.4 V6
Negative-going input threshold voltage VIT–VCC = 3.3 Vmin 0.6 · typ 1.2 V6
Negative-going input threshold voltage VIT–VCC = 5 Vmin 0.8 · typ 1.5 V6
Input hysteresis (VIT+ – VIT–) Vhystyp 0.3 V6
Input resistance rIVI = ±3 V to ±25 Vmin 3 · typ 5 · max 7 kΩ6
Maximum data rateRL = 3 kΩ, CL = 1000 pF, one DOUT switching; see Figure 7-1min 150 · typ 250 kbit/s6
Driver Pulse skew(2) tsk(p)RL = 3 kΩ to 7 kΩ, CL = 150 to 2500 pF; see Figure 7-2typ 300 ns6
Slew rate, transition region (see Figure 7-1) SR(tr)RL = 3 kΩ to 7 kΩ, CL = 150 to 1000 pFmin 6 · max 30 V/us6
Slew rate, transition region (see Figure 7-1) SR(tr)RL = 3 kΩ to 7 kΩ, VCC = 5 V, CL = 150 to 2500 pFmin 4 · max 30 V/us6
Propagation delay time, low- to high-level output tPLH®)CL = 150 pFtyp 300 ns6
Propagation delay time, high- to low-level output tPHL®)CL = 150 pFtyp 300 ns6
Receiver Pulse skew(3) tsk(p)CL = 150 pFtyp 300 ns6

Pins, by the datasheet

16
1 C1+
Positive lead of C1 capacitor. · p. 3
2 V+
Positive charge pump output for storage capacitor only. · p. 3
3 C1–
Negative lead of C1 capacitor. · p. 3
4 C2+
Positive lead of C2 capacitor. · p. 3
5 C2–
Negative lead of C2 capacitor. · p. 3
6 V–
Negative charge pump output for storage capacitor only. · p. 3
7 DOUT2
RS232 line data output to remote RS232 system. · p. 3
8 RIN2
RS232 line data input from remote RS232 system. · p. 3
9 ROUT2
Logic data output to UART. · p. 3
10 DIN2
Logic data input from UART. · p. 3
11 DIN1
Logic data input from UART. · p. 3
12 ROUT1
Logic data output to UART. · p. 3
13 RIN1
RS232 line data input from remote RS232 system. · p. 3
14 DOUT1
RS232 line data output to remote RS232 system. · p. 3
15 GND
Ground. · p. 3
16 VCC
Connect to external 3 V to 5.5 V power supply. · p. 3

Ordering codes, by the datasheet

29
MAX3232CD
SOIC (D) · 0 to 70 °C; obsolete · p. 15
MAX3232CDB
SSOP (DB) · 0 to 70 °C; obsolete · p. 15
MAX3232CDBR
SSOP (DB) · 0 to 70 °C; 2000, LARGE T&R · p. 15
MAX3232CDBR.A
SSOP (DB) · 0 to 70 °C; 2000, LARGE T&R · p. 15
MAX3232CDR
SOIC (D) · 0 to 70 °C; 2500, LARGE T&R · p. 15
MAX3232CDR.A
SOIC (D) · 0 to 70 °C; 2500, LARGE T&R · p. 15
MAX3232CDR1G4
SOIC (D) · -40 to 85 °C as listed; 2500, LARGE T&R · p. 15
MAX3232CDR1G4.A
SOIC (D) · -40 to 85 °C as listed; 2500, LARGE T&R · p. 15
MAX3232CDW
SOIC (DW) · 0 to 70 °C; obsolete · p. 15
MAX3232CDWR
SOIC (DW) · 0 to 70 °C; obsolete · p. 15
MAX3232CPW
TSSOP (PW) · 0 to 70 °C; obsolete · p. 15
MAX3232CPWR
TSSOP (PW) · 0 to 70 °C; 2000, LARGE T&R; NIPDAU | SN · p. 15
MAX3232CPWR.A
TSSOP (PW) · 0 to 70 °C; 2000, LARGE T&R; NIPDAU · p. 15
MAX3232CPWRE4
TSSOP (PW) · 0 to 70 °C; 2000, LARGE T&R · p. 15
MAX3232CPWRG4
TSSOP (PW) · 0 to 70 °C; 2000, LARGE T&R · p. 15
MAX3232CPWRG4.A
TSSOP (PW) · 0 to 70 °C; 2000, LARGE T&R · p. 15
MAX3232IDBR
SSOP (DB) · -40 to 85 °C; 2000, LARGE T&R · p. 15
MAX3232IDBR.A
SSOP (DB) · -40 to 85 °C; 2000, LARGE T&R · p. 15
MAX3232IDBRE4
SSOP (DB) · -40 to 85 °C; 2000, LARGE T&R · p. 15
MAX3232IDRG4
SOIC (D) · -40 to 85 °C; obsolete · p. 15
MAX3232IDW
SOIC (DW) · -40 to 85 °C; obsolete · p. 15
MAX3232IDWR
SOIC (DW) · -40 to 85 °C; 2000, LARGE T&R; NIPDAU | SN · p. 15
MAX3232IDWR.B
SOIC (DW) · -40 to 85 °C; 2000, LARGE T&R; NIPDAU · p. 15
MAX3232IDWRG4
SOIC (DW) · -40 to 85 °C; obsolete · p. 15
MAX3232IPWR
TSSOP (PW) · -40 to 85 °C; 2000, LARGE T&R; NIPDAU | SN · p. 15
MAX3232IPWR.A
TSSOP (PW) · -40 to 85 °C; 2000, LARGE T&R; NIPDAU · p. 15
MAX3232IPWRE4
TSSOP (PW) · -40 to 85 °C; 2000, LARGE T&R · p. 15
MAX3232IPWRG4
TSSOP (PW) · -40 to 85 °C; 2000, LARGE T&R · p. 15
MAX3232IPWRG4.A
TSSOP (PW) · -40 to 85 °C; 2000, LARGE T&R · p. 15

Parameters

16
Current - Supply
300uA
Data Rate
250kbps
ESD Protect
±15kV
Features
Short-Circuit Protection
Junction Temperature(Max)
150℃
Number of Drivers
2
Number of Receivers
2
Operating Temperature
-40℃~+85℃
Quiescent Supply Current
300uA
Thermal Resistance(Junction to Ambient)
85.9℃/W
Thermal Resistance(Junction to Board)
44.5℃/W
Thermal Resistance(Junction to Case)
43.1℃/W
Type
Transceiver
Voltage - Supply
3V~5.5V
Voltage - Supply(Absolute Max)
6V
charge pump
Yes

Order codes

3

Pinout

16
The pins of the MAX3232ID
PinNameType
1C1+Passive
2VS+Power out
3C1-Passive
4C2+Passive
5C2-Passive
6VS-Power out
7T2OUTOutput
8R2INInput
9R2OUTOutput
10T2INInput
11T1INInput
12R1OUTOutput
13R1INInput
14T1OUTOutput
15GNDPower in
16VCCPower in

Open-source boards using it

All 186
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    Socket

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  • 4 layers98.8 × 85.1 mmSsc, the printed circuit board in 3D

    Ssc

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Questions

Is there a KiCad symbol and footprint for the MAX3232ID?

Yes. The symbol is Interface_UART:MAX3232 and the footprint Package_SO:SOIC-16_3.9x9.9mm_P1.27mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the MAX3232ID?

SOIC-16, with 16 pins. Its footprint is drawn on this page.

Where is the MAX3232ID datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the MAX3232ID?

JLCPCB lists it as part C18261, with 0 in stock; the sellers' links on this page open their listings.

What can replace the MAX3232ID?

Parts like it in the library: the SP3232EEN-L/TR by MaxLinear, the SP3232EEN(UMW) by UMW, the MAX3232EID by Texas Instruments and the MAX3232ESE(UMW) by UMW. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the MAX3232ID?

186 boards in 154 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

8