| Supply voltage VCC | Over operating free-air temperature range; with respect to GND | min -0.3 · max 6 V | 4 |
| Positive output supply voltage V+ | Over operating free-air temperature range; with respect to GND | min -0.3 · max 7 V | 4 |
| Negative output supply voltage V– | Over operating free-air temperature range; with respect to GND; limits retained in printed column order | min 0.3 · max -7 V | 4 |
| Supply voltage difference V+ – V– | Over operating free-air temperature range | max 13 V | 4 |
| Input voltage VI | Drivers | min -0.3 · max 6 V | 4 |
| Input voltage VI | Receivers | min -25 · max 25 V | 4 |
| Output voltage VO | Drivers | min -13.2 · max 13.2 V | 4 |
| Output voltage VO | Receivers; maximum is VCC + 0.3 V | min -0.3 V | 4 |
| Operating virtual junction temperature TJ | | max 150 °C | 4 |
| Storage temperature Tstg | | min -65 · max 150 °C | 4 |
| Electrostatic discharge V(ESD) | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; all pins except RIN and DOUT; ±2000 V | max 2000 V | 4 |
| Electrostatic discharge V(ESD) | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; RIN and DOUT pins; ±15,000 V | max 15000 V | 4 |
| Electrostatic discharge V(ESD) | Charged-device model (CDM), per JEDEC specification JESD22-C101; all pins; ±1500 V | max 1500 V | 4 |
| Electrostatic discharge V(ESD) | IEC61000-4-2, Contact Discharge; RS232 port pins (RIN, DOUT); ±8000 V | max 8000 V | 4 |
| Electrostatic discharge V(ESD) | IEC61000-4-2, Air-Gap Discharge; RS232 port pins (RIN, DOUT); ±15,000 V | max 15000 V | 4 |
| Supply voltage | VCC = 3.3 V; nominal 3.3 V | min 3 · max 3.6 V | 4 |
| Supply voltage | VCC = 5 V; nominal 5 V | min 4.5 · max 5.5 V | 4 |
| Driver high-level input voltage VIH | DIN; VCC = 3.3 V | min 2 · max 5.5 V | 4 |
| Driver high-level input voltage VIH | DIN; VCC = 5 V | min 2.4 · max 5.5 V | 4 |
| Driver low-level input voltage VIL | DIN | min 0 · max 0.8 V | 4 |
| Receiver input voltage VI | RIN | min -25 · max 25 V | 4 |
| Operating free-air temperature TA | MAX3232EI | min -40 · max 85 °C | 4 |
| Junction-to-ambient thermal resistance RθJA | D (SOIC), 16 pins | typ 76.1 °C/W | 5 |
| Junction-to-case (top) thermal resistance RθJCtop | D (SOIC), 16 pins | typ 36.7 °C/W | 5 |
| Junction-to-board thermal resistance RθJB | D (SOIC), 16 pins | typ 33.6 °C/W | 5 |
| Junction-to-top characterization parameter ψJT | D (SOIC), 16 pins | typ 4.2 °C/W | 5 |
| Junction-to-board characterization parameter ψJB | D (SOIC), 16 pins | typ 33.3 °C/W | 5 |
| Supply current ICC | No load, VCC = 3.3 V or 5 V | typ 0.3 · max 1 mA | 5 |
| High-level output voltage VOH | DOUT at RL = 3 kΩ to GND, DIN = GND | min 5 · typ 5.4 V | 5 |
| Low-level output voltage VOL | DOUT at RL = 3 kΩ to GND, DIN = VCC | min -5 · typ -5.4 V | 5 |
| High-level input current IIH | VI = VCC; typical and maximum are ± magnitudes | typ 0.01 · max 1 uA | 5 |
| Low-level input current IIL | VI at GND; typical and maximum are ± magnitudes | typ 0.01 · max 1 uA | 5 |
| Short-circuit output current IOS | VCC = 3.6 V, VO = 0 V; typical and maximum are ± magnitudes | typ 35 · max 60 mA | 5 |
| Short-circuit output current IOS | VCC = 5.5 V, VO = 0 V; typical and maximum are ± magnitudes | typ 35 · max 60 mA | 5 |
| Output resistance rO | VCC, V+, and V– = 0 V, VO = ±2 V; typical printed as 10M Ω | min 300 Ω | 5 |
| Low-level output voltage VOL | IOL = 1.6 mA | max 0.4 V | 5 |
| Positive-going input threshold voltage VIT+ | VCC = 3.3 V | typ 1.5 · max 2.4 V | 5 |
| Positive-going input threshold voltage VIT+ | VCC = 5 V | typ 1.8 · max 2.4 V | 5 |
| Negative-going input threshold voltage VIT– | VCC = 3.3 V | min 0.6 · typ 1.2 V | 5 |
| Negative-going input threshold voltage VIT– | VCC = 5 V | min 0.8 · typ 1.5 V | 5 |
| Input hysteresis (VIT+ – VIT–) Vhys | | typ 0.3 V | 5 |
| Input resistance ri | VI = ±3 V to ±25 V | min 3 · typ 5 · max 7 kΩ | 5 |
| Maximum data rate | RL = 3 kΩ, CL = 1000 pF, one DOUT switching; see Figure 3 | min 150 · typ 250 kbit/s | 6 |
| Driver pulse skew tsk(p) | RL = 3 kΩ to 7 kΩ, CL = 150 pF to 2500 pF; see Figure 4 | typ 300 ns | 6 |
| Driver slew rate, transition region (see Figure 3) SR(tr) | RL = 3 kΩ to 7 kΩ, VCC = 3.3 V, CL = 150 pF to 1000 pF | min 6 · max 30 V/us | 6 |
| Driver slew rate, transition region (see Figure 3) SR(tr) | RL = 3 kΩ to 7 kΩ, VCC = 3.3 V, CL = 150 pF to 2500 pF | min 4 · max 30 V/us | 6 |
| Receiver propagation delay time, low- to high-level output tPLH | CL = 150 pF; see Figure 5 | typ 300 ns | 6 |
| Receiver propagation delay time, high- to low-level output tPHL | CL = 150 pF; see Figure 5 | typ 300 ns | 6 |
| Receiver pulse skew tsk(p) | CL = 150 pF; see Figure 5 | typ 300 ns | 6 |