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MAX3232EID

Texas InstrumentsExtended

-40℃~+85℃ 0.3mA 2 2 250Kbps 3V~5.5V Transceiver Yes ±15kV SOIC-16 RS232 ICs ROHS

Part id
ti/MAX3232EID
Category
RS232 ICs
Package
SOIC-16
Pins
16
In stock
34,541 at JLCPCB (C193666)
Used on
1 open-source board

Overview

The MAX3232EID is a RS232 IC made by Texas Instruments in a SOIC-16 package with 16 pins. -40℃~+85℃ 0.3mA 2 2 250Kbps 3V~5.5V Transceiver Yes ±15kV SOIC-16 RS232 ICs ROHS.

PCBKit's library has its KiCad symbol (Interface_UART:MAX3232, from KiCad's library) and its footprint (Package_SO:SOIC-16_3.9x9.9mm_P1.27mm, from KiCad's library), ready for a KiCad board. 34,541 are in stock at JLCPCB (part C193666). 1 open-source board in 1 repository on GitHub use it.

Symbol

LOGICRS232C1+1VS+2C1-3C2+4C2-5VS-6T2OUT7R2IN8R2OUT9T2IN10T1IN11R1OUT12R1IN13T1OUT14GND15VCC16
Interface_UART:MAX3232From KiCad's library

Footprint

12345678910111213141516
Package_SO:SOIC-16_3.9x9.9mm_P1.27mmFrom KiCad's library

From the datasheet

13
Supply, least
3 V · VCC, recommended operating min, 3.3 V operation · p. 4
Supply, most
3.6 V · VCC, recommended operating max, 3.3 V operation · p. 4
Supply, least
4.5 V · VCC, recommended operating min, 5 V operation · p. 4
Supply, most
5.5 V · VCC, recommended operating max, 5 V operation · p. 4
Supply, absolute maximum
6 V · VCC, absolute max · p. 4
Works from
-40 °C · Operating free-air temperature min, MAX3232EI · p. 4
Works up to
85 °C · Operating free-air temperature max, MAX3232EI · p. 4
Junction, hottest
150 °C · Operating virtual junction temperature absolute max · p. 4
Takes working
300 µA · VCC supply current typical, no load, VCC = 3.3 V or 5 V · p. 5
Junction to air (D (SOIC))
76.1 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to case (D (SOIC))
36.7 K/W · Junction-to-case (top) thermal resistance · p. 5
Junction to board (D (SOIC))
33.6 K/W · Junction-to-board thermal resistance · p. 5
Data rate, most
250 kbit/s · Recommended bit rate max · p. 11

What it is and has

10
Drivers and receivers
Two drivers and two receivers · p. 1
Maximum data rate
250 kbit/s · p. 1
Logic input compatibility
5-V logic input with 3.3-V supply · p. 1
External capacitors
4 × 0.1 μF · p. 1
ESD protection
±15 kV HBM on RS-232 bus pins · p. 1
ESD protection
±8 kV IEC61000-4-2 contact discharge on RS-232 bus pins · p. 1
ESD protection
±15 kV IEC61000-4-2 air-gap discharge on RS-232 bus pins · p. 1
Protection
Outputs protected against shorts to ground · p. 8
Receiver open-input behavior
High output on ROUT · p. 8
Package
D, SOIC (16), 9.90 mm × 3.91 mm nominal body · p. 1

Around it

6
cap 0.1 µF
between C1+ and C1–; C1, VCC = 3.3 V ± 0.3 V; nonpolarized ceramic acceptable. · p. 10
cap 0.047 µF
between C1+ and C1–; C1, VCC = 5 V ± 0.5 V; nonpolarized ceramic acceptable. · p. 10
cap 0.33 µF
between C2+ and C2–; C2, VCC = 5 V ± 0.5 V; nonpolarized ceramic acceptable. · p. 10
cap 0.1 µF
between C1+ and C1–; C1, VCC = 3 V to 5.5 V; nonpolarized ceramic acceptable. · p. 10
cap 0.47 µF
between C2+ and C2–; C2, VCC = 3 V to 5.5 V; nonpolarized ceramic acceptable. · p. 10
cap 0.1µF
between VCC and GND; CBYPASS in Figure 7. · p. 10

Specifications

49
ParameterConditionsAs printedPage
Supply voltage VCCOver operating free-air temperature range; with respect to GNDmin -0.3 · max 6 V4
Positive output supply voltage V+Over operating free-air temperature range; with respect to GNDmin -0.3 · max 7 V4
Negative output supply voltage V–Over operating free-air temperature range; with respect to GND; limits retained in printed column ordermin 0.3 · max -7 V4
Supply voltage difference V+ – V–Over operating free-air temperature rangemax 13 V4
Input voltage VIDriversmin -0.3 · max 6 V4
Input voltage VIReceiversmin -25 · max 25 V4
Output voltage VODriversmin -13.2 · max 13.2 V4
Output voltage VOReceivers; maximum is VCC + 0.3 Vmin -0.3 V4
Operating virtual junction temperature TJmax 150 °C4
Storage temperature Tstgmin -65 · max 150 °C4
Electrostatic discharge V(ESD)Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; all pins except RIN and DOUT; ±2000 Vmax 2000 V4
Electrostatic discharge V(ESD)Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; RIN and DOUT pins; ±15,000 Vmax 15000 V4
Electrostatic discharge V(ESD)Charged-device model (CDM), per JEDEC specification JESD22-C101; all pins; ±1500 Vmax 1500 V4
Electrostatic discharge V(ESD)IEC61000-4-2, Contact Discharge; RS232 port pins (RIN, DOUT); ±8000 Vmax 8000 V4
Electrostatic discharge V(ESD)IEC61000-4-2, Air-Gap Discharge; RS232 port pins (RIN, DOUT); ±15,000 Vmax 15000 V4
Supply voltageVCC = 3.3 V; nominal 3.3 Vmin 3 · max 3.6 V4
Supply voltageVCC = 5 V; nominal 5 Vmin 4.5 · max 5.5 V4
Driver high-level input voltage VIHDIN; VCC = 3.3 Vmin 2 · max 5.5 V4
Driver high-level input voltage VIHDIN; VCC = 5 Vmin 2.4 · max 5.5 V4
Driver low-level input voltage VILDINmin 0 · max 0.8 V4
Receiver input voltage VIRINmin -25 · max 25 V4
Operating free-air temperature TAMAX3232EImin -40 · max 85 °C4
Junction-to-ambient thermal resistance RθJAD (SOIC), 16 pinstyp 76.1 °C/W5
Junction-to-case (top) thermal resistance RθJCtopD (SOIC), 16 pinstyp 36.7 °C/W5
Junction-to-board thermal resistance RθJBD (SOIC), 16 pinstyp 33.6 °C/W5
Junction-to-top characterization parameter ψJTD (SOIC), 16 pinstyp 4.2 °C/W5
Junction-to-board characterization parameter ψJBD (SOIC), 16 pinstyp 33.3 °C/W5
Supply current ICCNo load, VCC = 3.3 V or 5 Vtyp 0.3 · max 1 mA5
High-level output voltage VOHDOUT at RL = 3 kΩ to GND, DIN = GNDmin 5 · typ 5.4 V5
Low-level output voltage VOLDOUT at RL = 3 kΩ to GND, DIN = VCCmin -5 · typ -5.4 V5
High-level input current IIHVI = VCC; typical and maximum are ± magnitudestyp 0.01 · max 1 uA5
Low-level input current IILVI at GND; typical and maximum are ± magnitudestyp 0.01 · max 1 uA5
Short-circuit output current IOSVCC = 3.6 V, VO = 0 V; typical and maximum are ± magnitudestyp 35 · max 60 mA5
Short-circuit output current IOSVCC = 5.5 V, VO = 0 V; typical and maximum are ± magnitudestyp 35 · max 60 mA5
Output resistance rOVCC, V+, and V– = 0 V, VO = ±2 V; typical printed as 10M Ωmin 300 Ω5
Low-level output voltage VOLIOL = 1.6 mAmax 0.4 V5
Positive-going input threshold voltage VIT+VCC = 3.3 Vtyp 1.5 · max 2.4 V5
Positive-going input threshold voltage VIT+VCC = 5 Vtyp 1.8 · max 2.4 V5
Negative-going input threshold voltage VIT–VCC = 3.3 Vmin 0.6 · typ 1.2 V5
Negative-going input threshold voltage VIT–VCC = 5 Vmin 0.8 · typ 1.5 V5
Input hysteresis (VIT+ – VIT–) Vhystyp 0.3 V5
Input resistance riVI = ±3 V to ±25 Vmin 3 · typ 5 · max 7 kΩ5
Maximum data rateRL = 3 kΩ, CL = 1000 pF, one DOUT switching; see Figure 3min 150 · typ 250 kbit/s6
Driver pulse skew tsk(p)RL = 3 kΩ to 7 kΩ, CL = 150 pF to 2500 pF; see Figure 4typ 300 ns6
Driver slew rate, transition region (see Figure 3) SR(tr)RL = 3 kΩ to 7 kΩ, VCC = 3.3 V, CL = 150 pF to 1000 pFmin 6 · max 30 V/us6
Driver slew rate, transition region (see Figure 3) SR(tr)RL = 3 kΩ to 7 kΩ, VCC = 3.3 V, CL = 150 pF to 2500 pFmin 4 · max 30 V/us6
Receiver propagation delay time, low- to high-level output tPLHCL = 150 pF; see Figure 5typ 300 ns6
Receiver propagation delay time, high- to low-level output tPHLCL = 150 pF; see Figure 5typ 300 ns6
Receiver pulse skew tsk(p)CL = 150 pF; see Figure 5typ 300 ns6

Pins, by the datasheet

16
1 C1+
Positive lead of C1 capacitor. · p. 3
2 V+
Positive charge pump output for storage capacitor only. · p. 3
3 C1–
Negative lead of C1 capacitor. · p. 3
4 C2+
Positive lead of C2 capacitor. · p. 3
5 C2–
Negative lead of C2 capacitor. · p. 3
6 V–
Negative charge pump output for storage capacitor only. · p. 3
7 DOUT2
RS232 line data output to remote RS232 system. · p. 3
8 RIN2
RS232 line data input from remote RS232 system. · p. 3
9 ROUT2
Logic data output to UART. · p. 3
10 DIN2
Logic data input from UART. · p. 3
11 DIN1
Logic data input from UART. · p. 3
12 ROUT1
Logic data output to UART. · p. 3
13 RIN1
RS232 line data input from remote RS232 system. · p. 3
14 DOUT1
RS232 line data output to remote RS232 system. · p. 3
15 GND
Ground. · p. 3
16 VCC
Supply voltage; connect to external 3-V to 5.5-V power supply. · p. 3

Ordering codes, by the datasheet

30
MAX3232ECD
D (SOIC), 16 pins · 0 to 70 °C; package quantity 40 · p. 14
MAX3232ECDB
DB (SSOP), 16 pins · 0 to 70 °C; package quantity 80 · p. 14
MAX3232ECDBG4
DB (SSOP), 16 pins · 0 to 70 °C; package quantity 80 · p. 14
MAX3232ECDBR
DB (SSOP), 16 pins · 0 to 70 °C; package quantity 2000 · p. 14
MAX3232ECDE4
D (SOIC), 16 pins · 0 to 70 °C; package quantity 40 · p. 14
MAX3232ECDG4
D (SOIC), 16 pins · 0 to 70 °C; package quantity 40 · p. 14
MAX3232ECDR
D (SOIC), 16 pins · 0 to 70 °C; package quantity 2500 · p. 14
MAX3232ECDRE4
D (SOIC), 16 pins · 0 to 70 °C; package quantity 2500 · p. 14
MAX3232ECDW
DW (SOIC), 16 pins · 0 to 70 °C; package quantity 40 · p. 14
MAX3232ECDWG4
DW (SOIC), 16 pins · 0 to 70 °C; package quantity 40 · p. 14
MAX3232ECDWR
DW (SOIC), 16 pins · 0 to 70 °C; package quantity 2000 · p. 14
MAX3232ECPW
PW (TSSOP), 16 pins · 0 to 70 °C; package quantity 90 · p. 14
MAX3232ECPWE4
PW (TSSOP), 16 pins · 0 to 70 °C; package quantity 90 · p. 14
MAX3232ECPWR
PW (TSSOP), 16 pins · 0 to 70 °C; package quantity 2000 · p. 14
MAX3232EID
D (SOIC), 16 pins · -40 to 85 °C; package quantity 40 · p. 14
MAX3232EIDB
DB (SSOP), 16 pins · -40 to 85 °C; package quantity 80 · p. 14
MAX3232EIDBE4
DB (SSOP), 16 pins · -40 to 85 °C; package quantity 80 · p. 14
MAX3232EIDBG4
DB (SSOP), 16 pins · -40 to 85 °C; package quantity 80 · p. 15
MAX3232EIDBR
DB (SSOP), 16 pins · -40 to 85 °C; package quantity 2000 · p. 15
MAX3232EIDBRE4
DB (SSOP), 16 pins · -40 to 85 °C; package quantity 2000 · p. 15
MAX3232EIDE4
D (SOIC), 16 pins · -40 to 85 °C; package quantity 40 · p. 15
MAX3232EIDR
D (SOIC), 16 pins · -40 to 85 °C; package quantity 2500 · p. 15
MAX3232EIDW
DW (SOIC), 16 pins · -40 to 85 °C; package quantity 40 · p. 15
MAX3232EIDWG4
DW (SOIC), 16 pins · -40 to 85 °C; package quantity 40 · p. 15
MAX3232EIDWR
DW (SOIC), 16 pins · -40 to 85 °C; package quantity 2000 · p. 15
MAX3232EIPW
PW (TSSOP), 16 pins · -40 to 85 °C; package quantity 90 · p. 15
MAX3232EIPWE4
PW (TSSOP), 16 pins · -40 to 85 °C; package quantity 90 · p. 15
MAX3232EIPWG4
PW (TSSOP), 16 pins · -40 to 85 °C; package quantity 90 · p. 15
MAX3232EIPWR
PW (TSSOP), 16 pins · -40 to 85 °C; package quantity 2000 · p. 15
MAX3232EIPWRG4
PW (TSSOP), 16 pins · -40 to 85 °C; package quantity 2000 · p. 15

Open-source boards using it

1
  • 2 layers147.3 × 55.9 mmNTerm2-S FT231, the printed circuit board in 3D

    NTerm2-S FT231

    RetepV/nTerm2-S-FT231

    This is my rendition of the uTerm2-S by Just4Fun (https://hackaday.io/project/181583-uterm2-s-a-multi-emulation-color-rs232-terminal). My one is in SMD, and I hopefully made it easily hand-solderable for everyone.

    129 parts2

Parts like it

8

Questions

Is there a KiCad symbol and footprint for the MAX3232EID?

Yes. The symbol is Interface_UART:MAX3232 and the footprint Package_SO:SOIC-16_3.9x9.9mm_P1.27mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the MAX3232EID?

SOIC-16, with 16 pins. Its footprint is drawn on this page.

Where is the MAX3232EID datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the MAX3232EID?

JLCPCB lists it as part C193666, with 34,541 in stock; the sellers' links on this page open their listings.

What can replace the MAX3232EID?

Parts like it in the library: the SP3232EEN-L/TR by MaxLinear, the SP3232EEN(UMW) by UMW, the MAX3232ESE(UMW) by UMW and the SP232EEN-L/TR by MaxLinear. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the MAX3232EID?

1 board in 1 repository on GitHub; the most starred are listed on this page, with their KiCad files.