
CommonSense
antsouchlos/commonsense-hw
A BLE-based PCB for measuring humidity and temperature

The SHT41-AD1B-R2 is a humidity, Moisture Sensor made by Sensirion in a DFN-4(1.5x1.5) package with 4 pins. -40℃~+125℃ 0%RH~100%RH 1.08V~3.6V 16bit 400nA Factory calibration、Built-in heater I2C ±0.2℃ ±1.8%RH DFN-4(1.5x1.5) Temperature and Humidity Sensor ROHS.
PCBKit's library has its KiCad symbol (Sensor_Humidity:SHT4x, from KiCad's library) and its footprint (Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad, from KiCad's library), ready for a KiCad board. 11,912 are in stock at JLCPCB (part C7461861). 9 open-source boards in 9 repositories on GitHub use it.
| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| SHT41 RH accuracy | SHT41; typical accuracy at 25 °C | typ 1.8 %RH | 4 |
| Repeatability | high; 25 °C and 50 %RH; three times standard deviation | typ 0.08 %RH | 4 |
| Repeatability | medium; 25 °C and 50 %RH; three times standard deviation | typ 0.15 %RH | 4 |
| Repeatability | low; 25 °C and 50 %RH; three times standard deviation | typ 0.25 %RH | 4 |
| Resolution | A/D converter | typ 0.01 %RH | 4 |
| Hysteresis | At 25 °C; ± value | typ 0.8 %RH | 4 |
| Specified range | extended | min 0 · max 100 %RH | 4 |
| Response time | 𝜏63%; measured at 25 °C and 1 m/s airflow | typ 4 s | 4 |
| Supply voltage VDD | min 1.08 · typ 3.3 · max 3.6 V | 9 | |
| Power-up/down VPOR | Static power supply | min 0.6 · max 1.08 V | 9 |
| Slew rate of the supply voltage VDD, slew | Supply between VDD, min and VDD, max; faster slew rates may lead to a reset | max 20 V/ms | 9 |
| Supply current (heater off) IDD | Idle state; At 25 °C | typ 0.08 · max 1 uA | 9 |
| Supply current (heater off) IDD | Idle state; At 125 °C | max 3.4 uA | 9 |
| Supply current (heater off) IDD | Power up | typ 50 uA | 9 |
| Supply current (heater off) IDD | Measurement | typ 320 · max 500 uA | 9 |
| Supply current (heater off) IDD | Avg., high repeatability; continuous operation with 1 meas. per second | typ 2.2 uA | 9 |
| Supply current (heater off) IDD | Avg., med. repeatability; continuous operation with 1 meas. per second | typ 1.2 uA | 9 |
| Supply current (heater off) IDD | Avg., low repeatability; continuous operation with 1 meas. per second | typ 0.4 uA | 9 |
| Supply current (heater on) IDD | Nomin. heater “200 mW” | typ 60 · max 100 mA | 9 |
| Supply current (heater on) IDD | Nomin. heater “110 mW” | typ 33 · max 55 mA | 9 |
| Supply current (heater on) IDD | Nomin. heater “20 mW” | typ 6 · max 10 mA | 9 |
| Power consumpt. at VDD=1.2 V (no heater) | Avg., high repeatability; continuous operation with 1 meas. per second | typ 2.6 uW | 9 |
| Power consumpt. at VDD=1.2 V (no heater) | Avg., med. repeatability; continuous operation with 1 meas. per second | typ 1.4 uW | 9 |
| Power consumpt. at VDD=1.2 V (no heater) | Avg., low repeatability; continuous operation with 1 meas. per second | typ 0.5 uW | 9 |
| Low level input voltage VIL | Maximum is 0.3*VDD | min 0 V | 9 |
| Pull up resistors Rp | VDD < 1.62 V | min 820 Ω | 9 |
| Pull up resistors Rp | VDD ≥ 1.62 V | min 390 Ω | 9 |
| Low level output voltage VOL | VDD > 2.0 V, Rpullup > 390 Ω | max 0.4 V | 9 |
| Capacitive bus load Cb | RP ≤ 820 Ω: fast mode | max 400 pF | 9 |
| Capacitive bus load Cb | Rp = 390 Ω, VDD > 1.62 V: fast mode plus | max 340 pF | 9 |
| Power-up time tPU | After hard reset, VDD ≥ VPOR | typ 0.3 · max 1 ms | 10 |
| Soft reset time tSR | After soft reset; also valid for I2C general call reset | max 1 ms | 10 |
| Measurement duration tMEAS,l | Low repeatability; including tPU | typ 1.3 · max 1.6 ms | 10 |
| Measurement duration tMEAS,m | Med. repeatability; including tPU | typ 3.7 · max 4.5 ms | 10 |
| Measurement duration tMEAS,h | High repeatability; including tPU | typ 6.9 · max 8.3 ms | 10 |
| Heater-on duration tHeater | Long pulse | min 0.9 · typ 1 · max 1.1 s | 10 |
| Heater-on duration tHeater | Short pulse | min 0.09 · typ 0.1 · max 0.11 s | 10 |
| Operating temperature range | min -40 · max 125 °C | 10 | |
| Storage temperature range | min -40 · max 150 °C | 10 | |
| ESD HBM | max 2 kV | 10 | |
| ESD CDM | max 500 V | 10 | |
| Latch up, JESD78 Class II, 125 °C | ±100 mA | min -100 · max 100 mA | 10 |
| Junction-to-ambient thermal resistance 𝑅𝜃𝐽𝐴 | Heater off, die pad soldered; simulation | typ 246 K/W | 16 |
| Junction-to-ambient thermal resistance 𝑅𝜃𝐽𝐴 | Heater on, die pad soldered; heater power 200 mW; simulation | typ 308 K/W | 16 |
| Junction-to-ambient thermal resistance 𝑅𝜃𝐽𝐴 | Heater off, die pad not soldered; simulation | typ 297 K/W | 16 |
| Junction-to-ambient thermal resistance 𝑅𝜃𝐽𝐴 | Heater on, die pad not soldered; heater power 200 mW; simulation | typ 357 K/W | 16 |
| Junction-to-case thermal resistance 𝑅𝜃𝐽𝐶 | Heater off, die pad soldered; simulation | typ 189 K/W | 16 |
| Junction-to-case thermal resistance 𝑅𝜃𝐽𝐶 | Heater on, die pad soldered; heater power 200 mW; simulation | typ 255 K/W | 16 |
| Junction-to-case thermal resistance 𝑅𝜃𝐽𝐶 | Heater off, die pad not soldered; simulation | typ 191 K/W | 16 |
| Junction-to-case thermal resistance 𝑅𝜃𝐽𝐶 | Heater on, die pad not soldered; heater power 200 mW; simulation | typ 257 K/W | 16 |
| Junction-to-board thermal resistance 𝑅𝜃𝐽𝐵 | Heater off, die pad soldered; simulation | typ 159 K/W | 16 |
| Junction-to-board thermal resistance 𝑅𝜃𝐽𝐵 | Heater on, die pad soldered; heater power 200 mW; simulation | typ 225 K/W | 16 |
| Junction-to-board thermal resistance 𝑅𝜃𝐽𝐵 | Heater off, die pad not soldered; simulation | typ 193 K/W | 16 |
| Junction-to-board thermal resistance 𝑅𝜃𝐽𝐵 | Heater on, die pad not soldered; heater power 200 mW; simulation | typ 258 K/W | 16 |
| Junction-to-board characterization param. Ψ𝐽𝐵 | Heater off, die pad soldered; simulation | typ 159 K/W | 16 |
| Junction-to-board characterization param. Ψ𝐽𝐵 | Heater on, die pad soldered; heater power 200 mW; simulation | typ 223 K/W | 16 |
| Junction-to-board characterization param. Ψ𝐽𝐵 | Heater off, die pad not soldered; simulation | typ 191 K/W | 16 |
| Junction-to-board characterization param. Ψ𝐽𝐵 | Heater on, die pad not soldered; heater power 200 mW; simulation | typ 254 K/W | 16 |
| Junction-to-top characterization param. Ψ𝐽𝑇 | Heater off, die pad soldered; simulation | typ 38 K/W | 16 |
| Junction-to-top characterization param. Ψ𝐽𝑇 | Heater on, die pad soldered; heater power 200 mW; simulation | typ 105 K/W | 16 |
| Junction-to-top characterization param. Ψ𝐽𝑇 | Heater off, die pad not soldered; simulation | typ 44 K/W | 16 |
| Junction-to-top characterization param. Ψ𝐽𝑇 | Heater on, die pad not soldered; heater power 200 mW; simulation | typ 112 K/W | 16 |
| Pin | Name | Type |
|---|---|---|
| 1 | SDA | Input/output |
| 2 | SCL | Input |
| 3 | VDD | Power in |
| 4 | VSS | Power in |

antsouchlos/commonsense-hw
A BLE-based PCB for measuring humidity and temperature


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jayis1/hardware-design-lab
Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

<iframe src="https://pcbkit.io/embed/parts/sensirion/SHT41-AD1B-R2" title="SHT41-AD1B-R2 in PCBKit" width="100%" height="480" style="border:0;border-radius:12px" allow="fullscreen" loading="lazy"></iframe><img src="https://pcbkit.io/embed/parts/sensirion/SHT41-AD1B-R2.jpg" alt="SHT41-AD1B-R2" width="1200" height="900">[](https://pcbkit.io/parts/sensirion/SHT41-AD1B-R2)Yes. The symbol is Sensor_Humidity:SHT4x and the footprint Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad, both drawn on this page. PCBKit places them on a board for you when you design with it.
DFN-4(1.5x1.5), with 4 pins. Its footprint is drawn on this page.
Sensirion publishes it: the Datasheet link on this page opens it.
JLCPCB lists it as part C7461861, with 11,912 in stock; the sellers' links on this page open their listings.
9 boards in 9 repositories on GitHub; the most starred are listed on this page, with their KiCad files.