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MPR121QR2, in 3D

MPR121QR2

NXP Semiconductors

-40℃~+85℃ 1.71V~3.6V 12 29uA 2kV 3uA Capacitive Touch QFN-20(3x3) Touch Sensors ROHS

Extended
DatasheetJLCPCBLCSCnxp/MPR121QR2
Category
Touch Sensors
Package
QFN-20(3x3)
Pins
20

Overview

The MPR121QR2 is a touch Sensor made by NXP Semiconductors in a QFN-20(3x3) package with 20 pins. -40℃~+85℃ 1.71V~3.6V 12 29uA 2kV 3uA Capacitive Touch QFN-20(3x3) Touch Sensors ROHS.

PCBKit's library has its KiCad symbol (Sensor_Touch:MPR121QR2, from KiCad's library) and its footprint (Package_DFN_QFN:UQFN-20_3x3mm_P0.4mm, from KiCad's library), ready for a KiCad board. 1,147 are in stock at JLCPCB (part C91322). 62 open-source boards in 49 repositories on GitHub use it.

Symbol

IRQ1SCL2SDA3ADDR4VREG5VSS6REXT7ELE08ELE19ELE210ELE311LED0/ELE412LED1/ELE513LED2/ELE614LED3/ELE715LED4/ELE816LED5/ELE917LED6/ELE1018LED7/ELE1119VDD20
Sensor_Touch:MPR121QR2From KiCad's library

Footprint

Package_DFN_QFN:UQFN-20_3x3mm_P0.4mmFrom KiCad's library

From the datasheet

13
Supply, least
2 V · VDD, recommended operating min, internal regulator enabled · p. 9
Supply, most
3.6 V · VDD, recommended operating max, internal regulator enabled · p. 9
Supply, least
1.71 V · VREG, recommended operating min, VDD and VREG connected · p. 9
Supply, most
2.75 V · VREG, recommended operating max, VDD and VREG connected · p. 9
Supply, absolute maximum
3.6 V · VDD, absolute max · p. 8
Supply, absolute maximum
2.75 V · VREG, absolute max · p. 8
Works from
-40 °C · Operating temperature min · p. 8
Works up to
85 °C · Operating temperature max · p. 8
Takes working
29 µA · IDD, typical run current at 16 ms sample period, all 13 channels active · p. 9
Takes at most
1 mA · IDD, typical peak of measurement duty cycle · p. 9
Takes asleep
3 µA · IDD, typical Stop Mode current · p. 9
A pin gives at most
12 mA · GPIO source current per pin, absolute max · p. 8
A pin gives at most
1.2 mA · GPIO sink current per pin, absolute max · p. 8

What it is and has

9
Supply range
1.71V to 3.6V · p. 1
Electrodes
12 capacitance sensing inputs · p. 1
Autocalibration
Independent for each electrode input · p. 1
I2C
IRQ interrupt output for electrode status changes · p. 1
Package
3 mm x 3 mm x 0.65 mm 20 lead QFN · p. 1
Operating temperature
-40°C to +85°C · p. 1
ADC
10-bit · p. 4
GPIO and LED drive
8 multifunctional electrode inputs · p. 4
Proximity detection
Independent 13th measurement channel · p. 4

Around it

3
cap 0.1 μF
between VDD and VSS; Ceramic supply decoupling capacitor. · p. 4
cap 0.1 μF
between VREG and VSS; Bypass capacitor for the internal regulator node; ceramic when using a separate VREG bypass. · p. 2
res 75 kΩ
between REXT and VSS; 1% tolerance; sets internal reference current. · p. 2

Specifications

46
ParameterConditionsAs printedPage
Supply Voltage VDDWith respect to VSSmin -0.3 · max 3.6 V8
Supply Voltage VREGWith respect to VSSmin -0.3 · max 2.75 V8
Operating Temperature Range TOmin -40 · max 85 °C8
GPIO Source Current per Pin iGPIOmax 12 mA8
GPIO Sink Current per Pin iGPIOmax 1.2 mA8
Storage Temperature Range TSmin -40 · max 125 °C8
Human Body Model (HBM) VESDTest value ±2000 Vmin -2000 · max 2000 V8
Machine Model (MM) VESDTest value ±200 Vmin -200 · max 200 V8
Charge Device Model (CDM) VESDTest value ±500 Vmin -500 · max 500 V8
Latch-up current at TA = 85°C ILATCHTA = 85°C; test value ±100 mAmin -100 · max 100 mA8
High Supply Voltage VDDTypical Operating Circuit; TA = 25°Cmin 2 · typ 3.3 · max 3.6 V9
Low Supply Voltage VREGTypical Operating Circuit; TA = 25°Cmin 1.71 · typ 1.8 · max 2.75 V9
Average Supply Current(1) IDDRun Mode @ 1 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3Ftyp 393 uA9
Average Supply Current(1) IDDRun Mode @ 2 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3Ftyp 199 uA9
Average Supply Current(1) IDDRun Mode @ 4 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3Ftyp 102 uA9
Average Supply Current(1) IDDRun Mode @ 8 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3Ftyp 54 uA9
Average Supply Current(1) IDDRun Mode @ 16 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3Ftyp 29 uA9
Average Supply Current(1) IDDRun Mode @ 32 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3Ftyp 17 uA9
Average Supply Current(1) IDDRun Mode @ 64 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3Ftyp 11 uA9
Average Supply Current(1) IDDRun Mode @ 128 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3Ftyp 8 uA9
Measurement Supply Current IDDPeak of measurement duty cycle; VDD and VREG = 1.8V; TA = 25°Ctyp 1 mA9
Idle Supply Current IDDStop Mode; VDD and VREG = 1.8V; TA = 25°Ctyp 3 uA9
Input Leakage Current ELE_ IIH, IILVDD and VREG = 1.8V; TA = 25°Ctyp 0.025 uA9
Input Self-Capacitance on ELE_VDD and VREG = 1.8V; TA = 25°Cmax 15 pF9
Input Leakage Current SDA, SCL IIH, IILVDD and VREG = 1.8V; TA = 25°Ctyp 0.025 · max 1 uA9
Input Capacitance SDA, SCLVDD and VREG = 1.8V; TA = 25°Cmax 7 pF9
Output Low Voltage SDA, IRQ VOLIOL = 6mA; VDD and VREG = 1.8V; TA = 25°Cmax 0.5 V9
Output Low Voltage ELE4 - ELE11 (GPIO mode) VOLGPIOIOLGPIOD = 1 mA; VDD and VREG = 1.8V; TA = 25°Cmax 0.5 V9
Power On Reset VTLHVDD rising; TA = 25°Cmin 1.08 · typ 1.35 · max 1.62 V9
Power On Reset VTHLVDD falling; TA = 25°Cmin 0.88 · typ 1.15 · max 1.42 V9
8 MHz Internal Oscillator fHTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 7.44 · typ 8 · max 8.56 MHz9
1 kHz Internal Oscillator fLTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 0.65 · typ 1 · max 1.35 kHz9
Serial Clock Frequency fSCLTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmax 400 kHz10
Bus Free Time Between a STOP and a START Condition tBUFTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 1.3 us10
Hold Time, (Repeated) START Condition tHD, STATypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 0.6 us10
Repeated START Condition Setup Time tSU, STATypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 0.6 us10
STOP Condition Setup Time tSU, STOTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 0.6 us10
Data Hold Time tHD, DATTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmax 0.9 us10
Data Setup Time tSU, DATTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 100 ns10
SCL Clock Low Period tLOWTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 1.3 us10
SCL Clock High Period tHIGHTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmin 0.7 us10
Rise Time of Both SDA and SCL Signals, Receiving tRTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C; typical expression 20+0.1Cbmax 300 ns10
Fall Time of Both SDA and SCL Signals, Receiving tFTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C; typical expression 20+0.1Cbmax 300 ns10
Fall Time of SDA Transmitting tF.TXTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C; typical expression 20+0.1Cbmax 250 ns10
Pulse Width of Spike Suppressed tSPTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Ctyp 25 ns10
Capacitive Load for Each Bus Line CbTypical Operating Circuit, VDD and VREG = 1.8V, TA = 25°Cmax 400 pF10

Pins, by the datasheet

20
1 IRQ
Open collector interrupt output, active low. · p. 2
2 SCL
I2C clock. · p. 2
3 SDA
I2C data. · p. 2
4 ADDR
I2C address select; connect to VSS, VDD, SDA or SCL for addresses 0x5A, 0x5B, 0x5C or 0x5D respectively. · p. 2
5 VREG
Internal regulator node; connect a 0.1 uF bypass capacitor to VSS. · p. 2
6 VSS
Ground. · p. 2
7 REXT
Connect a 75 kΩ 1% resistor to VSS to set internal reference current. · p. 2
8 ELE0
Electrode 0. · p. 2
9 ELE1
Electrode 1. · p. 2
10 ELE2
Electrode 2. · p. 2
11 ELE3
Electrode 3. · p. 2
12 ELE4
Electrode 4. · p. 2
13 ELE5
Electrode 5. · p. 2
14 ELE6
Electrode 6. · p. 2
15 ELE7
Electrode 7. · p. 2
16 ELE8
Electrode 8. · p. 2
17 ELE9
Electrode 9. · p. 2
18 ELE10
Electrode 10. · p. 2
19 ELE11
Electrode 11. · p. 2
20 VDD
Connect a 0.1 uF bypass capacitor to VSS. · p. 2

Ordering codes, by the datasheet

1
MPR121QR2
2059 (20-Pin QFN) · -40°C to +85°C; 12-pads; I2C address 0x5A - 0x5D; Tape & Reel · p. 1

Parameters

10
Current - Supply
29uA
Current - Supply(Max)
1mA
ESD Protection Voltage
2kV
Features
Capacitive Touch
Number of Channels
12
Operating Temperature
-40℃~+85℃
Output Current per Pin(Max)
12mA
Standby Current
3uA
Voltage - Supply
1.71V~3.6V
Voltage - Supply(Absolute Max)
3.6V

Order codes

1

Pinout

20
The pins of the MPR121QR2
PinNameType
1IRQOpen collector
2SCLInput
3SDAInput/output
4ADDRInput
5VREGPassive
6VSSPower in
7REXTPassive
8ELE0Passive
9ELE1Passive
10ELE2Passive
11ELE3Passive
12LED0/ELE4Passive
13LED1/ELE5Passive
14LED2/ELE6Passive
15LED3/ELE7Passive
16LED4/ELE8Passive
17LED5/ELE9Passive
18LED6/ELE10Passive
19LED7/ELE11Passive
20VDDPower in

Open-source boards using it

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    Simpl slidrr main

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    Wgr

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Questions

Is there a KiCad symbol and footprint for the MPR121QR2?

Yes. The symbol is Sensor_Touch:MPR121QR2 and the footprint Package_DFN_QFN:UQFN-20_3x3mm_P0.4mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the MPR121QR2?

QFN-20(3x3), with 20 pins. Its footprint is drawn on this page.

Where is the MPR121QR2 datasheet?

NXP Semiconductors publishes it: the Datasheet link on this page opens it.

Where can I order the MPR121QR2?

JLCPCB lists it as part C91322, with 1,147 in stock; the sellers' links on this page open their listings.

Which open-source boards use the MPR121QR2?

62 boards in 49 repositories on GitHub; the most starred are listed on this page, with their KiCad files.