
Nest mini v2-drop in pcb
iMike78/nest-mini-drop-in-pcb
Drop-in PCB replacement for the Google Nest Mini v2 with ESP32-S3, ESP32-P4 and optional ESP32-C6. Inspired by Onju Voice and Home Assistant Voice PE.

The MPR121QR2 is a touch Sensor made by NXP Semiconductors in a QFN-20(3x3) package with 20 pins. -40℃~+85℃ 1.71V~3.6V 12 29uA 2kV 3uA Capacitive Touch QFN-20(3x3) Touch Sensors ROHS.
PCBKit's library has its KiCad symbol (Sensor_Touch:MPR121QR2, from KiCad's library) and its footprint (Package_DFN_QFN:UQFN-20_3x3mm_P0.4mm, from KiCad's library), ready for a KiCad board. 1,147 are in stock at JLCPCB (part C91322). 62 open-source boards in 49 repositories on GitHub use it.
| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply Voltage VDD | With respect to VSS | min -0.3 · max 3.6 V | 8 |
| Supply Voltage VREG | With respect to VSS | min -0.3 · max 2.75 V | 8 |
| Operating Temperature Range TO | min -40 · max 85 °C | 8 | |
| GPIO Source Current per Pin iGPIO | max 12 mA | 8 | |
| GPIO Sink Current per Pin iGPIO | max 1.2 mA | 8 | |
| Storage Temperature Range TS | min -40 · max 125 °C | 8 | |
| Human Body Model (HBM) VESD | Test value ±2000 V | min -2000 · max 2000 V | 8 |
| Machine Model (MM) VESD | Test value ±200 V | min -200 · max 200 V | 8 |
| Charge Device Model (CDM) VESD | Test value ±500 V | min -500 · max 500 V | 8 |
| Latch-up current at TA = 85°C ILATCH | TA = 85°C; test value ±100 mA | min -100 · max 100 mA | 8 |
| High Supply Voltage VDD | Typical Operating Circuit; TA = 25°C | min 2 · typ 3.3 · max 3.6 V | 9 |
| Low Supply Voltage VREG | Typical Operating Circuit; TA = 25°C | min 1.71 · typ 1.8 · max 2.75 V | 9 |
| Average Supply Current(1) IDD | Run Mode @ 1 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3F | typ 393 uA | 9 |
| Average Supply Current(1) IDD | Run Mode @ 2 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3F | typ 199 uA | 9 |
| Average Supply Current(1) IDD | Run Mode @ 4 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3F | typ 102 uA | 9 |
| Average Supply Current(1) IDD | Run Mode @ 8 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3F | typ 54 uA | 9 |
| Average Supply Current(1) IDD | Run Mode @ 16 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3F | typ 29 uA | 9 |
| Average Supply Current(1) IDD | Run Mode @ 32 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3F | typ 17 uA | 9 |
| Average Supply Current(1) IDD | Run Mode @ 64 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3F | typ 11 uA | 9 |
| Average Supply Current(1) IDD | Run Mode @ 128 ms sample period; VDD and VREG = 1.8V; TA = 25°C; ECR = 0x2C; all 12 channels plus proximity activated; CDC = 0x3F | typ 8 uA | 9 |
| Measurement Supply Current IDD | Peak of measurement duty cycle; VDD and VREG = 1.8V; TA = 25°C | typ 1 mA | 9 |
| Idle Supply Current IDD | Stop Mode; VDD and VREG = 1.8V; TA = 25°C | typ 3 uA | 9 |
| Input Leakage Current ELE_ IIH, IIL | VDD and VREG = 1.8V; TA = 25°C | typ 0.025 uA | 9 |
| Input Self-Capacitance on ELE_ | VDD and VREG = 1.8V; TA = 25°C | max 15 pF | 9 |
| Input Leakage Current SDA, SCL IIH, IIL | VDD and VREG = 1.8V; TA = 25°C | typ 0.025 · max 1 uA | 9 |
| Input Capacitance SDA, SCL | VDD and VREG = 1.8V; TA = 25°C | max 7 pF | 9 |
| Output Low Voltage SDA, IRQ VOL | IOL = 6mA; VDD and VREG = 1.8V; TA = 25°C | max 0.5 V | 9 |
| Output Low Voltage ELE4 - ELE11 (GPIO mode) VOLGPIO | IOLGPIOD = 1 mA; VDD and VREG = 1.8V; TA = 25°C | max 0.5 V | 9 |
| Power On Reset VTLH | VDD rising; TA = 25°C | min 1.08 · typ 1.35 · max 1.62 V | 9 |
| Power On Reset VTHL | VDD falling; TA = 25°C | min 0.88 · typ 1.15 · max 1.42 V | 9 |
| 8 MHz Internal Oscillator fH | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 7.44 · typ 8 · max 8.56 MHz | 9 |
| 1 kHz Internal Oscillator fL | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 0.65 · typ 1 · max 1.35 kHz | 9 |
| Serial Clock Frequency fSCL | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | max 400 kHz | 10 |
| Bus Free Time Between a STOP and a START Condition tBUF | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 1.3 us | 10 |
| Hold Time, (Repeated) START Condition tHD, STA | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 0.6 us | 10 |
| Repeated START Condition Setup Time tSU, STA | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 0.6 us | 10 |
| STOP Condition Setup Time tSU, STO | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 0.6 us | 10 |
| Data Hold Time tHD, DAT | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | max 0.9 us | 10 |
| Data Setup Time tSU, DAT | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 100 ns | 10 |
| SCL Clock Low Period tLOW | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 1.3 us | 10 |
| SCL Clock High Period tHIGH | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | min 0.7 us | 10 |
| Rise Time of Both SDA and SCL Signals, Receiving tR | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C; typical expression 20+0.1Cb | max 300 ns | 10 |
| Fall Time of Both SDA and SCL Signals, Receiving tF | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C; typical expression 20+0.1Cb | max 300 ns | 10 |
| Fall Time of SDA Transmitting tF.TX | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C; typical expression 20+0.1Cb | max 250 ns | 10 |
| Pulse Width of Spike Suppressed tSP | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | typ 25 ns | 10 |
| Capacitive Load for Each Bus Line Cb | Typical Operating Circuit, VDD and VREG = 1.8V, TA = 25°C | max 400 pF | 10 |
| Pin | Name | Type |
|---|---|---|
| 1 | IRQ | Open collector |
| 2 | SCL | Input |
| 3 | SDA | Input/output |
| 4 | ADDR | Input |
| 5 | VREG | Passive |
| 6 | VSS | Power in |
| 7 | REXT | Passive |
| 8 | ELE0 | Passive |
| 9 | ELE1 | Passive |
| 10 | ELE2 | Passive |
| 11 | ELE3 | Passive |
| 12 | LED0/ELE4 | Passive |
| 13 | LED1/ELE5 | Passive |
| 14 | LED2/ELE6 | Passive |
| 15 | LED3/ELE7 | Passive |
| 16 | LED4/ELE8 | Passive |
| 17 | LED5/ELE9 | Passive |
| 18 | LED6/ELE10 | Passive |
| 19 | LED7/ELE11 | Passive |
| 20 | VDD | Power in |

iMike78/nest-mini-drop-in-pcb
Drop-in PCB replacement for the Google Nest Mini v2 with ESP32-S3, ESP32-P4 and optional ESP32-C6. Inspired by Onju Voice and Home Assistant Voice PE.


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<iframe src="https://pcbkit.io/embed/parts/nxp/MPR121QR2" title="MPR121QR2 in PCBKit" width="100%" height="480" style="border:0;border-radius:12px" allow="fullscreen" loading="lazy"></iframe><img src="https://pcbkit.io/embed/parts/nxp/MPR121QR2.jpg" alt="MPR121QR2" width="1200" height="900">[](https://pcbkit.io/parts/nxp/MPR121QR2)Yes. The symbol is Sensor_Touch:MPR121QR2 and the footprint Package_DFN_QFN:UQFN-20_3x3mm_P0.4mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
QFN-20(3x3), with 20 pins. Its footprint is drawn on this page.
NXP Semiconductors publishes it: the Datasheet link on this page opens it.
JLCPCB lists it as part C91322, with 1,147 in stock; the sellers' links on this page open their listings.
62 boards in 49 repositories on GitHub; the most starred are listed on this page, with their KiCad files.