
Iot esp eth ind
wayri/SPIKE
PCB-focused multiphysics simulation, from board to complete assembly: PI, SI, circuits, thermal, EM/RF and mechanical workflows, with MCAD collaboration and a roadmap toward large-scale coupled assemblies.

PCB-focused multiphysics simulation, from board to complete assembly: PI, SI, circuits, thermal, EM/RF and mechanical workflows, with MCAD collaboration and a roadmap toward large-scale coupled assemblies.
Ebrake1 is an open-source printed circuit board by wayri, from the wayri/SPIKE repository on GitHub. It is a 4-layer board of 144 × 83.5 mm with 141 parts on 102 nets, routed with 787 tracks and 103 vias.
It is built around the AS5600L-ASOM, DRV8711DCPR and TC4420VOA713, with the RBT10W24S12, SC0918 and CML0603X7R104KT50V among its other parts. Its parts include 34 resistors, 32 capacitors, 15 diodes, 12 connectors and 9 transistors. It belongs with the radio and wireless boards of this library.
This fixture pairs a 40 mm x 30 mm two-layer FR-4 patch board with one
explicit external dielectric object. The board copper and stackup are in
patch_with_radome.kicad_pcb; the radome is intentionally kept outside the
PCB file in antenna_with_radome_run.json so it can be passed as solver input.
bare_antenna_run.json and antenna_with_radome_run.json define a paired
bare-versus-radome experiment on exactly the same board, feed, frequency sweep,
and requested mesh size. The latter keeps parameters.surrounding_geometry
inline with the solver parameters.
For the radome case, its first corner is (95, 95, 10) mm and its dimensions
are (50, 40, 1.5) mm. The board occupies x=100..140 mm and y=100..130 mm.
The solver coordinate system uses the top copper as z=0; positive z points
into the air in front of the antenna. The slab therefore begins 10 mm above
the top copper and ends at 11.5 mm.
epsilon_r: 2.1 is an explicit fixture input. No loss tangent is present
because the current surroundings contract and EMerge adapter do not transfer
external dielectric loss. Do not use a lossless result to make radome
transmission, gain, pattern, or compliance claims.
The object uses the spike/emerge-surroundings/v1 contract:
{
"kind": "dielectric_box",
"name": "Radome slab",
"origin_mm": [95, 95, 10],
"size_mm": [50, 40, 1.5],
"epsilon_r": 2.1
}This is a planar surrogate, not a curved radome or a complete vehicle, enclosure, bracket, cable, connector, fastener, or ground-plane model. Any comparison between the bare and radome cases still needs mesh convergence, boundary checks, material characterization, and measurement correlation.
From the repository root with EMerge 3.0.0a19 installed in .venv-emerge3:
python scripts/run_emerge_antenna_example.py --config examples/emerge/radome/bare_antenna_run.json --python-executable .venv-emerge3/Scripts/python.exe --output-dir examples/emerge/radome --output-prefix bare
python scripts/run_emerge_antenna_example.py --config examples/emerge/radome/antenna_with_radome_run.json --python-executable .venv-emerge3/Scripts/python.exe --output-dir examples/emerge/radome --output-prefix covered
python scripts/compare_emerge_radome.pyBoth seven-frequency runs completed through SPIKE's isolated extension host
with model_status: unvalidated; their saved results are
bare_result.json and
covered_result.json. The
comparison_evidence.json checks identical board,
port, frequency and requested mesh inputs. At 3.4 GHz, S11 was -3.53 dB bare
and -4.02 dB covered. At 3 GHz, the independently peak-normalized relative
field sample at theta 180°, phi 0° changed from -9.94 to -11.93 dB. This
angular difference is a change in normalized pattern shape, not radome
insertion loss or absolute gain.
The paired S11 and angular-cut figure and interpolated 3D covered pattern are saved display artifacts. The 3D surface bilinearly interpolates relative linear amplitude from the solver's 13 × 25 angular grid to 5° spacing. SPIKE offers the same display interpolation, the original solved grid, and a relative pattern overlay in the EMI chamber. Its bench can be shown, made translucent, or hidden without changing the FEM case. None of those display choices creates new solved field values.


| Qty | Value | Footprint | References |
|---|---|---|---|
| 19 | 1k_0603 | PCM_fab:R_0603 | R1, R2, R3, R16, R17, R22, R23, R24, R25, R26, R27, R28, R29, R30, R31, R32 +3 |
| 16 | 100n_50V | PCM_fab:C_0603 | C2, C4, C6, C9, C13, C15, C17, C20, C22, C27, C29, C31, C32, C33, C35, C36 |
| 11 | 10R_0603 | Resistor_SMD:R_0603_1608Metric | R5, R6, R8, R9, R10, R11, R12, R13, R14, R15, R33 |
| 10 | SMD310HL-TP | Diode_SMD:Nexperia_CFP3_SOD-123W | D4, D5, D6, D7, D8, D9, D10, D11, D15, D16 |
| 9 | STP60NF06L | Package_TO_SOT_THT:TO-220-3_Horizontal_TabUp | Q1, Q2, Q3, Q4, Q5, Q6, Q7, Q8, Q9 |
| 7 | 10u_50V | Capacitor_SMD:C_0805_2012Metric | C1, C3, C5, C19, C21, C28, C34 |
| 7 | TestPoint | TestPoint:TestPoint_Pad_D1.5mm | TP1, TP2, TP3, TP4, TP5, TP6, TP7 |
| 6 | 01x04 | Connector_JST:JST_XH_B4B-XH-AM_1x04_P2.50mm_Vertical | J5, J7, J9, J10, J11, J15 |
| 6 | 100u_100V | Capacitor_THT:CP_Radial_D12.5mm_P5.00mm | C7, C10, C11, C18, C23, C26 |
| 6 | stb01x02 | TerminalBlock:TerminalBlock_MaiXu_MX126-5.0-02P_1x02_P5.00mm | J2, J6, J8, J12, J13, J14 |
| 5 | SolderJumper_2_Open | Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm | JP6, JP7, JP8, JP9, JP10 |
| 4 | MountingHole_Pad | MountingHole:MountingHole_3.5mm_Pad_TopOnly | H1, H2, H3, H4 |
| 4 | SW_MEC_5E | Button_Switch_SMD:SW_Push_1P1T_XKB_TS-1187A | SW1, SW2, SW3, SW4 |
| 2 | 0.033R_2512 | Resistor_SMD:R_2512_6332Metric_Pad1.40x3.35mm_HandSolder | R4, R7 |
| 2 | 1u_50V | PCM_fab:C_0603 | C14, C16 |
| 2 | R_Potentiometer_Trim | Potentiometer_THT:Potentiometer_Alps_RK09Y11_Single_Horizontal | RV1, RV2 |
| 2 | red | PCM_fab:LED_0603 | D2, D12 |
| 2 | yellow | PCM_fab:LED_0603 | D13, D14 |
| 1 | 1.02k_0603 | PCM_fab:R_0603 | R38 |
| 1 | 10k_0603 | PCM_fab:R_0603 | R37 |
| 1 | 15A_100V | Package_TO_SOT_SMD:TO-252-2 | D3 |
| 1 | 1n_50V | PCM_fab:C_0603 | C25 |
| 1 | AS5600L-ASOM | Package_SO:JEITA_SOIC-8_3.9x4.9mm_P1.27mm | U5 |
| 1 | DRV8711 | Package_SO:HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias | U3 |
| 1 | Fuse_holder_10A | 696108003002:696108003002 | F1 |
| 1 | MCP1501-25xCH | Package_TO_SOT_SMD:SOT-23-6 | U6 |
| 1 | RBT10W24S12 | XPPower_RTB10:rtb10_fp | U9 |
| 1 | RBT10W24S3V3 | XPPower_RTB10:rtb10_fp | U10 |
| 1 | SC0918 | SC0918:MODULE_SC0918 | U2 |
| 1 | SolderJumper_2_Bridged | Jumper:SolderJumper-2_P1.3mm_Bridged_RoundedPad1.0x1.5mm | JP5 |
| 1 | TC4420VOA713 | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U7 |
| 1 | TLV1701AIDBVR | Package_TO_SOT_SMD:SOT-23-5_HandSoldering | U8 |
The 134 most common of 141 parts.

wayri/SPIKE
PCB-focused multiphysics simulation, from board to complete assembly: PI, SI, circuits, thermal, EM/RF and mechanical workflows, with MCAD collaboration and a roadmap toward large-scale coupled assemblies.


Valar-Systems/VAL3100
The VAL3100 is now part of the Valar Motion mono-repo, alongside the VAL3000 and VAL3101 controllers:

Aykut-Gencer-KARACA/BLDC-Driver
PCB'nin Blender'da hazırlanmış 3D render'ı · tam çözünürlüklü video için görsele tıklayın

he1ias/programmable-guitar-pedal
A programmable acoustic guitar pedal that doubles as a wireless instrument recording device.

meierh/Embedded_System_Hands_On_I
All files related to the group project can be found in the Project folder. It contains the following parts of our project:


MicroType-Engineering/MTE_USB_HUB
As designed on the MicroType Engineering's YouTube series: https://youtu.be/uzqXgHHZUUs

It measures 144 × 83.5 mm and has 4 copper layers, 1.6 mm thick.
141 parts, built around the AS5600L-ASOM, DRV8711DCPR, TC4420VOA713 and RBT10W24S12. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
From the wayri/SPIKE repository on GitHub, at the commit this page was made from: the board is app/public/demo/ebrake1.kicad_pcb and its schematic examples/esp32/source/iot-esp-eth-ind-cpu.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Its repository states no licence, so its author keeps all rights: ask wayri before reusing the design.