4 layers65 × 99 mm
2 layers196 × 176 mm
Hb chip test
telco69/Hb2025- Size
- 196 × 176 mm
- Copper layers
- 2
- Thickness
- 1.6 mm
- Parts
- 189
- Nets
- 169
- Pads
- 665
- Tracks, vias
- 834, 424
- Pours
- 9
- Routed
- Yes
- KiCad
- KiCad 8.0 (file 20240108)
- Created
- 31 Mar 2025
- Updated
- 11 Jun 2025
Overview
Hb chip test is an open-source printed circuit board by telco69, from the telco69/Hb2025 repository on GitHub. It is a 2-layer board of 196 × 176 mm with 189 parts on 169 nets, routed with 834 tracks and 424 vias.
It is built around the THS4051ID, OPA548T and INA111AP, with the MCP3202-BI/SN, TL082CM and TL084 among its other parts. Its parts include 72 resistors, 58 capacitors, 17 ICs, 16 connectors and 8 inductors.
Main components
12
THS4051ID
SOIC-8-16V~-4.5V、4.5V~16V -40℃~+85℃ 1 100mA 14nV/√Hz@10kHz 15uV/℃ 2.5mV 2.5uA 240V/us 250nA 70MHz 70dB 8.5mA 9V~32V Built-in compensation、ESD protection Rail-to-rail output SOIC-8 Operational Amplifier ROHSTexas InstrumentsOperational Amplifier
OPA548T
TO-220-7-30V~-4V、4V~30V -40℃~+85℃ 1 10V/us 17mA 1MHz 2mV 30uV/℃ 3A 500nA 50nA 8V~60V 90nV/√Hz@1kHz 95dB Enable/shutdown function TO-220-7 Operational Amplifier ROHSTexas InstrumentsOperational Amplifier
INA111AP
PDIP-8-18V~-6V、6V~18V -40℃~+85℃ 0.1pA 1 100dB 10nV/√Hz@1kHz 17V/us 200uV 2MHz 2pA 2uV/℃ 3.3mA 30mA 4us External resistor gain、Overvoltage protection PDIP-8 Instrumentation Amplifiers ROHSTexas InstrumentsInstrumentation AmplifiersMCP3202-BI/SN
SOIC-8-40℃~+85℃ 100kHz 12 1LSB 2 2.7V~5.5V 500nA 900kHz~1.8MHz、1.8MHz External SAR SPI、Serial port Yes SOIC-8 Analog to Digital Converters (ADC) ROHSMicrochip TechnologyAnalog To Digital Converters (ADCs)
TL082CM
SOIC-8100dB 10uV/℃ 13V/us 3.6mA 4MHz 50pA 5mV SOIC-8 FET Input Amplifiers ROHSTexas InstrumentsFET Input Amplifiers
TL084
SOP-14-18V~18V 0℃~+70℃ 1.4mA 16V/us 20nA 3mV 4MHz 4nA 60mA 75dB Four channels Short-Circuit Protection、Built-in compensation SOP-14 FET Input Amplifiers ROHSGcoreOperational AmplifierDG417DY-E3
SOIC-8-15V~15V -40℃~+85℃ 100ns 20Ω 30pF 60ns SOIC-8 Analog Switches, Multiplexers ROHSVishay IntertechnologyAnalog Switches, Multiplexers
L7812ABD2T-TR
TO-263-2-40℃~+125℃@(Tj) 1 1.5A 12V 2V@(1A) 35V 4.4mA 60dB@(120Hz) Fixed Over Current Protection、Short Circuit Protection、Thermal shutdown Positive TO-263-2 Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHSSTMicroelectronicsVoltage Regulators - Linear, Low Drop Out (LDO) Regulators
LM311DT
SOP-80℃~+70℃ 1 100nA 200ns 200ns 2mV 36V 5.1mA 5V 6nA TTL、CMOS ±15V SOP-8 Comparators ROHSSTMicroelectronicsComparators
MC7912ACD2TR4G
TO-2630℃~+125℃ 1 1.3V@(1A) 12V 1A 35V 61dB@(120Hz) 75uV Fixed Negative Over Current Protection、Short Circuit Protection、Thermal shutdown TO-263 Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHSonsemiLinear Voltage Regulators (LDO)REF5050ID
SOIC-8-40℃~+125℃@(Ta) 1.2mA 10mA 3ppm/℃ 3uVp-p 5.2V~18V 5V Fixed Series ±0.05% SOIC-8 Voltage Reference ROHSTexas InstrumentsVoltage Reference
0805YC104JAT2A
0805100nF 16V X7R ±5% 0805 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSKyocera AVXMultilayer Ceramic Capacitors MLCC - SMD/SMT
Parts
189| Qty | Value | Footprint | References |
|---|---|---|---|
| 19 | C_0805_100nF_16V_X7R_CID1.2.3078 | dtuspace_ipc:C0805_CAPC200X125X130L45N | C10, C11, C13, C15, C24, C26, C27, C28, C37, C38, C40, C41, C42, C44, C45, C49 +3 |
| 16 | R_0805_10R0_CID10.9.4757 | dtuspace_ipc:R0805_RESC200X125X50L35N | R13, R14, R16, R17, R22, R23, R24, R28, R29, R32, R33, R36, R37, R48, R62, R65 |
| 10 | R_0805_100k_CID10.9.5903 | dtuspace_ipc:R0805_RESC200X125X50L35N | R3, R4, R5, R7, R9, R10, R12, R18, R39, R42 |
| 9 | R_0805_1K_CID10.99.611 | dtuspace_ipc:R0805_RESC200X125X50L35N | R1, R2, R6, R8, R11, R27, R53, R68, R70 |
| 8 | C_2917_47uF_20V_20%_CID1.3.892 | dtuspace_ipc:C2917_CAPC730X430X310L130N | C51, C52, C53, C54, C58, C59, C60, C61 |
| 8 | L_3.3uH_870mA_CID7.3.944 | dtuspace_ipc:L0805_INDC200X125X140L50N | L1, L2, L3, L4, L5, L6, L7, L8 |
| 6 | 1x1-header | dtuspace_ipc:HEADER-P254-1x1 | J9, J10, J11, J12, J14, J15 |
| 6 | 31-5431-2010_CID2.5.196 | dtuspace_ipc:AMPHENOL_31-5431-2010 | J1, J2, J3, J5, J6, J7 |
| 6 | Jumper_3_Open | dtuspace_ipc:HEADER-P254-1x3 | JP1, JP2, JP3, JP4, JP5, JP6 |
| 6 | R_0805_11k5_CID10.9.5870 | dtuspace_ipc:R0805_RESC200X125X50L35N | R38, R40, R41, R43, R44, R45 |
| 4 | C_0402_10nF_16V_X7R_CID1.2.2607 | dtuspace_ipc:C0402_CAPC100X50X61L25N | C9, C30, C33, C36 |
| 4 | C_2220_10uF_50V_X7R_CID1.2.4299 | dtuspace_ipc:C2220_CAPC570X500X270L60N | C3, C4, C17, C18 |
| 4 | C_2220_22uF_25V_X7R_CID1.2.4254 | dtuspace_ipc:C2220_CAPC570X500X270L60N | C14, C16, C22, C25 |
| 4 | LD_SML-P11VTT86R | dtuspace_ipc:SML_P11 | D3, D4, D5, D6 |
| 3 | C_0402_22nF_16V_X7R_CID1.2.2613 | dtuspace_ipc:C0402_CAPC100X50X61L25N | C39, C46, C47 |
| 3 | C_0402_3.3nF_16V_X7R_CID1.2.2599 | dtuspace_ipc:C0402_CAPC100X50X61L25N | C1, C2, C57 |
| 3 | C_0805_1uF_16V_X7R_CID1.2.3095 | dtuspace_ipc:C0805_CAPC200X125X130L45N | C6, C20, C21 |
| 3 | R_0805_10k0_CID10.9.476 | dtuspace_ipc:R0805_RESC200X125X50L35N | R56, R71, R72 |
| 3 | R_0805_26k1_CID10.9.5881 | dtuspace_ipc:R0805_RESC200X125X50L35N | R35, R46, R47 |
| 3 | R_0805_511k_CID10.9.489 | dtuspace_ipc:R0805_RESC200X125X50L35N | R58, R59, R60 |
| 3 | THS4051 | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U11, U12, U17 |
| 2 | 2x8 | dtuspace_ipc:HEADER-P254-2x8 | J8, J13 |
| 2 | 5R | Package_TO_SOT_THT:TO-220-2_Horizontal_TabDown | R51, R52 |
| 2 | CUS520,H3F_CID4.2.447 | dtuspace_ipc:SOD250X130X120L30X30N | D1, D2 |
| 2 | C_0402_100pF_50V_C0G_CID1.2.681 | dtuspace_ipc:C0402_CAPC100X50X61L25N | C8, C19 |
| 2 | C_0805_1nF_50V_C0G_CID1.2.505 | dtuspace_ipc:C0805_CAPC200X125X130L45N | C12, C62 |
| 2 | C_0805_330nF_50V_X7R_CID1.2.632 | dtuspace_ipc:C0805_CAPC200X125X130L45N | C5, C7 |
| 2 | C_1812_4.7uF_25V_X7R_CID1.2.4026 | dtuspace_ipc:C1812_CAPC450X320X280L60N | C23, C48 |
| 2 | OPA548 | Package_TO_SOT_THT:TO-220-7_P2.54x3.8mm_StaggerOdd_Lead5.85mm_TabDown | U10, U13 |
| 2 | R_0805_10k5_CID10.9.5868 | dtuspace_ipc:R0805_RESC200X125X50L35N | R21, R25 |
| 2 | R_0805_1M05_CID10.9.5947 | dtuspace_ipc:R0805_RESC200X125X50L35N | R31, R49 |
| 2 | R_0805_1k21_CID10.9.203 | dtuspace_ipc:R0805_RESC200X125X50L35N | R15, R69 |
| 2 | R_0805_3k83_CID10.9.461 | dtuspace_ipc:R0805_RESC200X125X50L35N | R19, R50 |
| 2 | R_0805_511R_CID10.9.5837 | dtuspace_ipc:R0805_RESC200X125X50L35N | R30, R34 |
| 2 | R_0805_5k11_CID10.9.467 | dtuspace_ipc:R0805_RESC200X125X50L35N | R64, R67 |
| 1 | 1945193_12P_CID2.2.928 | dtuspace_ipc:PHOENIX_1945193_12P | J4 |
| 1 | 1x2-header | dtuspace_ipc:HEADER-P254-1x2 | J16 |
| 1 | C_0402_470pF_50V_C0G_CID1.2.184 | dtuspace_ipc:C0402_CAPC100X50X61L25N | C43 |
| 1 | C_0805_4.7nF_16V_X7R_CID1.2.3054 | dtuspace_ipc:C0805_CAPC200X125X130L45N | C63 |
| 1 | DG419 | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U16 |
| 1 | INA111 | Package_DIP:DIP-8_W7.62mm | U15 |
| 1 | L7812ABD2T-TR_CID8.52.934 | dtuspace_ipc:DPAK3P508_1419X457L172X97T635X1023N | U1 |
| 1 | LM311DT | Package_SO:SO-8_3.9x4.9mm_P1.27mm | U4 |
| 1 | LP2981IM5-5.0-NOPB_CID8.52.176 | dtuspace_ipc:SOT23-5P95_270X145L35X35N | U3 |
| 1 | MC7912ACD2TR4G_CID8.52.429 | dtuspace_ipc:DPAK3P508_1419X457L172X97T635X1023N | U2 |
| 1 | MCP3202 | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U6 |
| 1 | REF5050ID | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U7 |
| 1 | R_0402_470R_CID10.9.70 | dtuspace_ipc:R0402_RESC100X50X37L20N | R20 |
| 1 | R_0805_1M21_CID10.9.5950 | dtuspace_ipc:R0805_RESC200X125X50L35N | R61 |
| 1 | R_0805_220R_CID10.9.602 | dtuspace_ipc:R0805_RESC200X125X50L35N | R54 |
| 1 | R_0805_2k49_CID10.9.5859 | dtuspace_ipc:R0805_RESC200X125X50L35N | R55 |
| 1 | R_0805_51R1_CID10.9.208 | dtuspace_ipc:R0805_RESC200X125X50L35N | R57 |
| 1 | R_0805_51k1_CID10.9.5890 | dtuspace_ipc:R0805_RESC200X125X50L35N | R63 |
| 1 | R_0805_5k62_CID10.9.159 | dtuspace_ipc:R0805_RESC200X125X50L35N | R26 |
| 1 | R_0805_9k53_CID10.9.5867 | dtuspace_ipc:R0805_RESC200X125X50L35N | R66 |
| 1 | TL082 | dtuspace_ipc:SOIC8P127_490X600X175L83X41N | U9 |
| 1 | TL084 | Package_SO:SOIC-14_3.9x8.7mm_P1.27mm | U5 |
| 1 | Tang_Nano_9K | 0my_project:DIP-48_TangNano9K | U8 |
| 1 | ~ | dtuspace_ipc:HB | U14 |
The 183 most common of 189 parts.
Questions
How big is the Hb chip test PCB?
It measures 196 × 176 mm and has 2 copper layers, 1.6 mm thick.
What parts does the Hb chip test use?
189 parts, built around the THS4051ID, OPA548T, INA111AP and MCP3202-BI/SN. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Hb chip test KiCad files?
From the telco69/Hb2025 repository on GitHub, at the commit this page was made from: the board is hb_chip_test.kicad_pcb and its schematic hb_chip_test.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the Hb chip test design in my own project?
Its repository states no licence, so its author keeps all rights: ask telco69 before reusing the design.
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