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2 layers40 × 100 mmBack prototype, the printed circuit board in 3D

This page contains the software used in the open hardware smartphone (libresmartphone)

Size
40 × 100 mm
Copper layers
2
Thickness
1.6 mm
Parts
86
Nets
60
Pads
299
Tracks, vias
1,052, 185
Pours
8
Routed
Yes
KiCad
KiCad 4
Created
20 Apr 2015
Updated
28 Jan 2021

Overview

Back prototype is an open-source printed circuit board by libresmartphone, from the libresmartphone/libresmartphone repository on GitHub. It is a 2-layer board of 40 × 100 mm with 86 parts on 60 nets, routed with 1,052 tracks and 185 vias.

It is built around the MCP23017-E/SS, IRLML6401 and SS14. Its parts include 21 capacitors, 10 connectors, 9 resistors, 6 ICs and 3 transistors. It belongs with the AVR (ATmega, ATtiny) boards of this library.

Main components

3

README

README.md

Libre Smartphone - Open hardware phone

This page contains the software used in the open hardware smartphone, related projects files and documentation. Mechanical (Freecad) and PCB schematic (Kicad) designs will be added here in the future. Visit libresmartphone.com or our YouTube channel for more information.

Objective

Libresmartphone is a smartphone that can be connected to a bigger screen and used as a desktop computer to edit documents, watch videos, listen to music, edit images, videos and much more.

Our goal is to have a 6" screen, HDMI output, cameras, Bluetooth, WiFi, GPS, 4G or better and GSM. It will also have two or more micro-usb ports that will allow you to connect a printer or other peripherals.

It will be Open Software and Open Hardware, designed with free software (Kicad) to let other users study, change and improve both the software and the hardware.

The design will allow one to add hardware kill switches for the camera, GPS, 4G, GSM. This offers security & privacy for those who want full control over their devices.

Roadmap

  1. Make a Raspberry Pi prototype work as desired (Estimated time: 3 months – 1 year)(Estimated cost: <500€):

    • Software to make calls, send/receive SMS (with the Adafruit 3G Fona or similar), import contacts (csv) and take photos in any GNU/linux or BSD OS.
    • GPS navigation with navit.
    • Easy to make case (MDF) / CAD files to 3d print the case.
    • 7" capacitive screen from the Raspberry Pi foundation.
    • Make a manual so every user with a Raspberry Pi can achieve a working prototype easily.

    The Raspberry Pi prototype will attract a larger user base for the project (currently there are 8 million Raspberry Pi in the market and a lot of their users are DIY enthusiast). Many of them are not willing to pay for an open source smartphone but would love to make calls with the Raspberry Pi, send SMS for their projects, build an simple GPS unit for their car, etc.

  2. Make a prototype with the components more open (Estimated time: 6 months – 4 years)(Estimated cost: 500-40.000€):

    • Use a more open HW board (A64 OLinuXino or similar) instead of the Raspberry Pi.
    • Use a more open HW screen (Manga Screen or similar) or design a 6" capacitive screen if there isn't any open hardware option available at that time (initiate a crowdfunding campaign to let others interested contribute).
    • Use a more open HW modem breakout if there is one available instead of the Adafruit 3G or design a LTE (PLS8-E) or better modem breakout (try to make a crowdfunding campaign to let others interested contribute).

    The prototype will have replaceable parts if better / smaller alternatives appear in the market.

    If no suitable screens or modem breakout are found, a crowdfunding campaign will be made. The reason to make it that way is because there are other people that could want these parts for a different project and help to make it possible faster. Even if there is not enough people willing to support a crowdfunding campaign, the current people interested in making libresmartphone are able to pay Elias Bakken, Nikolaus Schaller or others to make them.

When the prototype has the size and requirements desired, libresmartphone development will start part 3.

  1. Libresmartphone final design (Estimated time: <2 years)(Estimated cost: 50.000-200.000€).
    • Design a pcb that has the CPU, GPU, RAM, modem, WiFi, etc in the same board taking in consideration all the designs used in part 2 of the development.
    • Design a case to fit all the components inside that is easy to 3D print. If there are enough people interested an injection case could be made.

Parts

86
QtyValueFootprintReferences
11TEST_1PMeasurement_Points:Measurement_Point_Square-SMD-Pad_SmallW1, W2, W3, W4, W9, W10, W13, W14, W25, W26, W29
9100nFCapacitors_SMD:C_0805_HandSolderingC1, C2, C5, C6, C8, C13, C14, C15, C25
610KResistors_SMD:R_0805_HandSolderingR1, R2, R3, R4, R10, R11
610pFCapacitors_SMD:C_0603_HandSolderingC16, C17, C18, C19, C20, C21
3100uFCapacitors_Tantalum_SMD:CP_Tantalum_Case-B_EIA-3528-21_HandC3, C4, C7
31KResistors_SMD:R_0805_HandSolderingR5, R6, R7
333pFCapacitors_SMD:C_0603_HandSolderingC22, C23, C24
3IRLML6401TO_SOT_Packages_SMD:SOT-23_HandsolderingQ1, Q2, Q4
3JUMPERcommon-footprints:GS2_SMALLJP2, JP11, JP12
3Jumper_NC_Smallcommon-footprints:GS2_SMALLJP7, JP9, JP10
2A2common-footprints:GS3_SMALLJP6, JP8
2JUMPERConnect:GS2JP1, JP5
2USB_Afootprints:USB_AP4, P9
132.768HzCrystals:Crystal_SMD_G8-2pin_3.2x1.5mm_HandSolderingY1
1A0common-footprints:GS3_SMALLJP3
1A1common-footprints:GS3_SMALLJP4
1ATMEGA_HEADERPin_Headers:Pin_Header_Straight_1x06_Pitch2.54mmP6
1ATMEGA_VCCMeasurement_Points:Measurement_Point_Square-SMD-Pad_SmallW27
1AUDIO_CONNPin_Headers:Pin_Header_Straight_1x04_Pitch2.54mmP5
1CONN_01X08Pin_Headers:Pin_Header_Straight_1x08_Pitch2.54mmP10
1DC_DC_BREAKOUTfootprints:DC-DC-BREAKOUTU6
1EXPANSION_BOTTOMPin_Headers:Pin_Header_Angled_1x05_Pitch2.54mmP2
1EXPANSION_BOTTOM2Pin_Headers:Pin_Header_Angled_1x03_Pitch2.54mmP7
1EXPANSION_LEFTPin_Headers:Pin_Header_Angled_1x13_Pitch2.54mmP1
1EXPANSION_TOPPin_Headers:Pin_Header_Angled_1x05_Pitch2.54mmP3
1GNDMeasurement_Points:Measurement_Point_Square-SMD-Pad_SmallW6
1JSTfootprints:JST_PH_S2B-PH-SM4-TB_02x2.00mm_AngledP8
1Led_RGB_CA_CCfootprints:RGB_5050D3
1MCP23017Housings_SOIC:SOIC-28W_7.5x17.9mm_Pitch1.27mmU3
1PI ZEROcommon-footprints:pi0outlineU1
1RTCHousings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mmU5
1RTC_BATMeasurement_Points:Measurement_Point_Square-SMD-Pad_SmallW15
1SIM800_BREAKOUTfootprints:SIM800_BREAKOUTU2
1SS14Diodes_SMD:D_MiniMELF_HandsolderingD1
1SW_PUSHfootprints:SW_SPST_EVQPE1SW1
1TP4056_BREAKOUTfootprints:TP4056_BREAKOUTU4

The 79 most common of 86 parts.

Questions

How big is the Back prototype PCB?

It measures 40 × 100 mm and has 2 copper layers, 1.6 mm thick.

What parts does the Back prototype use?

86 parts, built around the MCP23017-E/SS, IRLML6401 and SS14. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Back prototype KiCad files?

From the libresmartphone/libresmartphone repository on GitHub, at the commit this page was made from: the board is Other_projects/Zerophone-PCB/back_pcb/back_prototype.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.

Can I use the Back prototype design in my own project?

Its repository states no licence, so its author keeps all rights: ask libresmartphone before reusing the design.

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