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2 layers253 × 199.1 mmDragon32Issue2aSecam, the printed circuit board in 3D

SECAM specific reproduction of the Issue 2 Dragon 32 main board

Size
253 × 199.1 mm
Copper layers
2
Thickness
1.6 mm
Parts
206
Nets
296
Pads
1,139
Tracks, vias
3,848, 573
Pours
10
Routed
Yes
KiCad
KiCad 8.0 (file 20240108)
Created
27 Jan 2025
Updated
18 Feb 2025

Overview

Dragon32Issue2aSecam is an open-source printed circuit board by jimbro1000, from the jimbro1000/Dragon32Issue2aSecam repository on GitHub, published under the MIT licence. It is a 2-layer board of 253 × 199.1 mm with 206 parts on 296 nets, routed with 3,848 tracks and 573 vias.

It is built around the 74LS390FP-E, 74LS74PC and LM393P, with the BC238BBU among its other parts. Its parts include 77 resistors, 59 capacitors, 28 ICs, 12 diodes and 7 inductors.

Main components

4

README

README.md

Dragon 32 Issue 2a (SECAM) Reproduction

This repository contains the KiCad project files to reproduce the SECAM variation of the Dragon 32 Issue 2a main board.

Render of PCB top

Render of PCB back

This design requires the SECAM power board to operate correctly and will not work with the standard board. See https://github.com/jimbro1000/Dragon32PowerSecam

Notes

The board incorporates some factory bodges to simplify assembly efforts.

A front and back ground plane fill has also been added along with effort to make sure that a ground plane is present across most of the board.

Video Circuit Changes

Compared to the original Dragon 32 (in PAL or NTSC form) the SECAM version of the design requires a significant level of additional work to generate a viable composite signal.

The most significant change is that the board does not make use of a modulator chip (the LM1889N is used on the PAL version). Instead the generation of the FM based composite signal is generated through discrete components.

The board is effectively split into two areas. The regular PAL design (with a few small tweaks) and the SECAM composite generation - located in the north section of the PCB.

Power Board Changes

While the same 9 wire interconnect is present on both designs, the SECAM version repurposes the 5 non-voltage connections making the power board incompatible with the PAL/NTSC main board and the SECAM main board incompatible with the PAL/NTSC power board.

The original pin out provided ground, composite, audio, 5v and a bias voltage.

The SECAM board uses the same pins as audio, composite, luma, phiA and phiB (the last 3 forming a YPrPb signal). By passing the raw output of the VDG to the power board there is space to perform additional transformation into a genuine RGB output that is sorely missing from the original.

RGB Calculation

The transformation is performed in two stages - first to homogenise the signal levels of the VDG output (while it broadly follows the YPrPb format it doesn't meet the requried signal voltages). The second stage performs some analogue computation to create R-Y, G-Y and B-Y components. These then can be added to the homogenised Y signal to create the three R, G and B signals.

An exta calculation is needed to isolate the sync signal that appears on the G channel.

Parts

206
QtyValueFootprintReferences
1447KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR75, R78, R79, R80, R81, R82, R83, R84, R85, R86, R87, R88, R90, R96
130.1uFCapacitor_THT:C_Disc_D4.3mm_W1.9mm_P5.00mmC4, C14, C15, C16, C17, C18, C19, C20, C21, C27, C50, C51, C52
121N914Diode_THT:D_DO-35_SOD27_P12.70mm_HorizontalD1, D2, D3, D4, D5, D6, D7, D8, D9, D10, D11, D12
1122RDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR12, R19, R20, R21, R22, R23, R24, R25, R26, R27, R28
114K7Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR13, R14, R30, R31, R32, R38, R39, R40, R41, R63, R72
10100pFCapacitor_THT:C_Disc_D3.0mm_W2.0mm_P2.50mmC47, C61, C65, C67, C70, C71, C72, C75, C76, C77
8M3732H-20RSPackage_DIP:DIP-16_W7.62mmIC1, IC2, IC3, IC4, IC5, IC6, IC7, IC8
50.01uFCapacitor_THT:C_Disc_D4.3mm_W1.9mm_P5.00mmC1, C38, C39, C43, C45
5100nFCapacitor_THT:C_Disc_D4.3mm_W1.9mm_P5.00mmC49, C53, C54, C55, C56
522nFCapacitor_THT:C_Disc_D5.0mm_W2.5mm_P5.00mmC30, C31, C32, C33, C44
4100nFCapacitor_THT:C_Disc_D4.7mm_W2.5mm_P5.00mmC68, C69, C73, C74
410KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR42, R43, R55, R56
46K5Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR91, R92, R93, R100
3100uFCapacitor_THT:CP_Radial_D8.0mm_P5.00mmC22, C23, C36
31200uHDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR76, R77, R89
33.3uHInductor_THT:L_Axial_L7.0mm_D3.3mm_P12.70mm_Horizontal_Fastron_MICCL1, L2, L99
3BC238BPackage_TO_SOT_THT:TO-92TR2, TR3, TR4
210.7MHzDragon:TOKO_RCL_10KL6, L7
2100KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR36, R64
210uFCapacitor_THT:CP_Radial_D5.0mm_P2.50mmC35, C42
2180pFCapacitor_THT:C_Disc_D3.0mm_W2.0mm_P2.50mmC46, C60
21KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR49, R54
21K6Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR94, R99
233nFCapacitor_THT:C_Disc_D3.0mm_W2.0mm_P2.50mmC97, C98
24.7uFCapacitor_THT:CP_Radial_Tantal_D5.5mm_P5.00mmC11, C37
2470uHDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR95, R98
256KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR50, R52
268A364Package_DIP:DIP-24_W15.24mmIC17, IC18
274LS244NPackage_DIP:DIP-20_W7.62mmIC16, IC24
274LS393NPackage_DIP:DIP-14_W7.62mmIC28, IC29
28K2Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR34, R47
2MC6821Package_DIP:DIP-40_W15.24mmIC26, IC35
1100RDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR1
110KPotentiometer_THT:Potentiometer_ACP_CA6-H2,5_HorizontalVR1
110K 1%Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR62
110MDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR53
110uFCapacitor_THT:CP_Radial_D8.0mm_P5.00mmC78
112KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR35
114.31818MHzCrystal:Crystal_HC49-U_HorizontalXL2
115KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR48
1160K 1%Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR59
1180pFCapacitor_THT:C_Disc_D4.7mm_W2.5mm_P5.00mmC99
11K5Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR37
11K8Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR33
11M5Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR51
12.2nFCapacitor_THT:C_Disc_D4.3mm_W1.9mm_P5.00mmC26
120K 1%Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR57
1220RDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR46
122pFCapacitor_THT:C_Disc_D3.0mm_W2.0mm_P2.50mmC48
122pFDragon:C_Radial_SpecialC40
122uHInductor_THT:L_Axial_L9.5mm_D4.0mm_P15.24mm_Horizontal_Fastron_SMCCL4
1270RDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR97
13.3uHInductor_THT:L_Axial_L9.5mm_D4.0mm_P15.24mm_Horizontal_Fastron_SMCCL5
1330K 1%Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR60
133KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR16
133pFCapacitor_THT:C_Disc_D3.0mm_W1.6mm_P2.50mmC41
1390ns 1K1Dragon:Delay_Line-V9663DL1
140K2 1%Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR61
168KDragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR29
16K8Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR45
174ALS74NPackage_DIP:DIP-14_W7.62mmIC23
174LS00NPackage_DIP:DIP-14_W7.62mmIC22
174LS02NPackage_DIP:DIP-14_W7.62mmIC31
174LS138NPackage_DIP:DIP-16_W7.62mmIC33
174LS20NPackage_DIP:DIP-14_W7.62mmIC27
174LS273NPackage_DIP:DIP-20_W7.62mmIC13
174LS32NPackage_DIP:DIP-14_W7.62mmIC30
174LS390Package_DIP:DIP-16_W7.62mmIC32
174LS74Package_DIP:DIP-14_W7.62mmIC21
174LS86ANPackage_DIP:DIP-14_W7.62mmIC14
180K6 1%Dragon:R_Axial_DIN0309_L9.0mm_D2.5mm_P12.70mm_HorizontalR58
1BC141Package_TO_SOT_THT:TO-92TR1
1DIN-5 (180) CassetteDragon:DIN-5_DELTRON_671-0501_45deg_HorizontalPL4
1DIN-6 J/S LDragon:DIN-6_DELTRON_671-0601_HorizontalPL5
1DIN-6 J/S RDragon:DIN-6_DELTRON_671-0601_HorizontalPL3
1Dragon KeyboardConnector_PinHeader_2.54mm:PinHeader_1x16_P2.54mm_VerticalPL1
1EDAC 392-040-558-201Dragon:Edge_2x20_P2.54mm_OvalMPPL7
1LK2Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_VerticalLK2
1LM393PPackage_DIP:DIP-8_W7.62mmIC25
1MC14050BCPPackage_DIP:DIP-16_W7.62mmIC34

The 196 most common of 206 parts.

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Questions

How big is the Dragon32Issue2aSecam PCB?

It measures 253 × 199.1 mm and has 2 copper layers, 1.6 mm thick.

What parts does the Dragon32Issue2aSecam use?

206 parts, built around the 74LS390FP-E, 74LS74PC, LM393P and BC238BBU. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Dragon32Issue2aSecam KiCad files?

From the jimbro1000/Dragon32Issue2aSecam repository on GitHub, at the commit this page was made from: the board is Dragon32Issue2ASecam.kicad_pcb and its schematic Dragon32Issue2ASecam.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the Dragon32Issue2aSecam design in my own project?

Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).