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4 layers160 × 110 mmHPM6E00FULLPORTRevB, the printed circuit board in 3D

HPM6E00FULLPORTRevB

hpmicro/hpm_apps35

hpm apps for hpm sdk

Size
160 × 110 mm
Copper layers
4
Thickness
1.6 mm
Parts
726
Nets
625
Pads
2,379
Tracks, vias
6,974, 1,935
Pours
29
Routed
Yes
KiCad
KiCad 7 (file 20221018)
Created
29 Jul 2024
Updated
22 Jun 2026

Overview

HPM6E00FULLPORTRevB is an open-source printed circuit board by hpmicro, from the hpmicro/hpm_apps repository on GitHub, published under the BSD-3-Clause licence. It is a 4-layer board of 160 × 110 mm with 726 parts on 625 nets, routed with 6,974 tracks and 1,935 vias.

It is built around the TJA1042T/3/1J, JL1111-N032I and YT8531C, with the CH340E, LP5907MFX-3.3/NOPB(MS) and H5007NL among its other parts. Its parts include 248 resistors, 234 capacitors, 50 diodes, 26 ICs and 15 inductors. It belongs with the RISC-V boards of this library.

Main components

12

README

README.md

中文

HPM APPS introduction

HPM APPS is an upper layer application software development kit based on HPM SDK. It provides a variety of typical general-purpose application solutions, including middleware, components, services, etc., for users to use and evaluate.

HPM APPS directory structure

Directory nameDescription
<HPM_APP_BASE>/boardsFiles for various development boards
<HPM_APP_BASE>/componentsSoftware components
<HPM_APP_BASE>/docsDocument
<HPM_APP_BASE>/middlewareMiddleware
<HPM_APP_BASE>/appsSamples of various solutions
<HPM_APP_BASE>/servicesSoftware Services
<HPM_APP_BASE>/toolsTool files

Instructions for using the HPM APP

HPM SDK version requirements

Note: Each CASE of the HPM APP relies on the corresponding HPM SDK version. To ensure that the project can be built and compiled correctly, please refer to the SDK version dependency instructions in the README document located in the corresponding CASE directory.

Build

Recommend using the sdk_env environment on Windows to build the SES compilation and debugging project. In the SDK ENV tool, check Enable User Application Path and select the hpm_apps/apps directory, or choose the demo directory you need. It is recommended to use the former, as it can scan all demo files.

sdk_env

If you want to add some middleware from hpm_apps/middleware, please add code in demo CMakeLists.txt, suggest you add code before generate_ses_project, for example:

text
add_subdirectory(../../.. hpm_apps/build_tmp)
generate_ses_project()

HPM_APPS documentation

Code repository

Parts

726
QtyValueFootprintReferences
780.5mm01_HPM_Peripheral:TestPoint_Pad_D0.5mmCOL, COL, COL, COUT, COUT, COUT, MDC, MDC, RXC, RXC, RXC, RXC, RXC, RXC, RXD0, RXD0 +62
600.1uF,16V03_HPM_Capacitance:C_0402_1005MetricC10, C12, C13, C14, C101, C102, C106, C107, C111, C112, C116, C117, C126, C129, C140, C143 +44
570.1uF,50V03_HPM_Capacitance:C_0402_1005MetricC122, C127, C128, C136, C141, C142, C150, C155, C156, C165, C168, C169, C170, C172, C173, C175 +41
404.7K02_HPM_Resistor:R_0402_1005MetricR1, R2, R10, R18, R19, R20, R163, R164, R173, R174, R183, R184, R194, R195, R200, R201 +24
3710K02_HPM_Resistor:R_0402_1005MetricR100, R101, R102, R103, R104, R105, R106, R111, R118, R125, R132, R139, R146, R153, R160, R168 +21
3675Ω_060302_HPM_Resistor:R_0603_1608MetricR107, R108, R109, R114, R115, R116, R121, R122, R123, R128, R129, R130, R135, R136, R137, R142 +20
311K02_HPM_Resistor:R_0402_1005MetricR13, R14, R15, R16, R17, R26, R27, R28, R110, R117, R124, R131, R138, R145, R152, R159 +15
24LED_RED01_HPM_Peripheral:LED_0603LED1, LED10, LED11, LED12, LED13, LED14, LED15, LED16, LED17, LED18, LED19, LED24, LED25, LED26, LED27, LED28 +8
20330Ω02_HPM_Resistor:R_0402_1005MetricR3, R11, R12, R204, R205, R206, R207, R225, R226, R227, R228, R246, R247, R248, R249, R257 +4
160Ω_040202_HPM_Resistor:R_0402_1005MetricR47, R51, R52, R56, R57, R58, R60, R81, R86, R90, R165, R166, R175, R176, R185, R186
1647pF,50V03_HPM_Capacitance:C_0402_1005MetricC84, C85, C89, C90, C94, C95, C99, C100, C104, C105, C109, C110, C114, C115, C119, C120
1660.4Ω_120602_HPM_Resistor:R_1206_3216MetricR112, R113, R119, R120, R126, R127, R133, R134, R140, R141, R147, R148, R154, R155, R161, R162
151nF,2kV03_HPM_Capacitance:C_1206_3216MetricC131, C132, C134, C145, C146, C148, C159, C160, C162, C183, C184, C206, C207, C229, C230
154.7uF,10V03_HPM_Capacitance:C_0402_1005MetricC3, C11, C15, C16, C28, C46, C48, C49, C51, C55, C64, C73, C124, C138, C152
120Ω02_HPM_Resistor:R_0402_1005MetricR198, R199, R208, R209, R219, R220, R229, R230, R240, R241, R250, R251
124.7uF,16V03_HPM_Capacitance:C_0603_1608MetricC166, C167, C171, C174, C189, C190, C194, C197, C212, C213, C217, C220
1275Ω02_HPM_Resistor:R_0603_1608MetricR210, R211, R212, R213, R231, R232, R233, R234, R252, R253, R254, R255
11LED_GREEN01_HPM_Peripheral:LED_0603LED2, LED4, LED6, LED9, LED20, LED21, LED22, LED23, LED32, LED35, LED38
910uF,10V02_HPM_Resistor:R_0603_1608MetricC125, C130, C133, C139, C144, C147, C153, C158, C161
810nF,50V03_HPM_Capacitance:C_0402_1005MetricC83, C88, C93, C98, C103, C108, C113, C118
8ACT45B-510-2P-TL00307_HPM_Inductance:L4532L5, L6, L7, L8, L9, L10, L11, L12
8KF2EDGR_3.81_3P05_HPM_Connector_KF2EDGR:PhoenixContact_MC_1,5_3-G-3.81_1x03_P3.81mm_HorizontalJ5, J6, J7, J8, J9, J10, J11, J12
8NUP2105L06_HPM_SOT:SOT-23D5, D6, D7, D8, D9, D10, D11, D12
8TJA1042T/3/1J06_HPM_SO:SOIC-8U12, U13, U14, U15, U16, U17, U18, U19
722pF,50V03_HPM_Capacitance:C_0402_1005MetricC57, C163, C164, C186, C187, C209, C210
6100Ω@100MHz_2A02_HPM_Resistor:R_0603_1608MetricFB6, FB7, FB8, FB9, FB11, FB13
62.49K02_HPM_Resistor:R_0402_1005MetricR167, R177, R187, R197, R218, R239
622uF,16V03_HPM_Capacitance:C_0805_2012MetricC54, C56, C60, C61, C63, C65
65.1K02_HPM_Resistor:R_0402_1005MetricR77, R78, R79, R80, R89, R92
6轻触开关4.5mm*4.5mm*4mm01_HPM_Peripheral:轻触开关SMD-4P,4.5x4.5mmSW2, SW3, SW4, SW5, SW7, SW8
5LED_BLUE01_HPM_Peripheral:LED_0603LED3, LED8, LED33, LED36, LED39
4, , ,
4100Ω@100MHz 2A02_HPM_Resistor:R_0603_1608MetricFB1, FB2, FB3, FB4
410uF,10V03_HPM_Capacitance:C_0402_1005MetricC32, C44, C59, C69
410uF,16V03_HPM_Capacitance:C_0603_1608MetricC72, C123, C137, C151
41M02_HPM_Resistor:R_0402_1005MetricR46, R193, R214, R235
41uF,16V03_HPM_Capacitance:C_0402_1005MetricC70, C71, C75, C232
422uF,10V03_HPM_Capacitance:C_0603_1608MetricC1, C2, C4, C76
4LP5907MFX-3.3/NOPB06_HPM_SOT:SOT-23-5U5, U24, U27, U30
30Ω02_HPM_Resistor:R_0805_2012MetricR42, R43, R44
31uF,10V03_HPM_Capacitance:C_0402_1005MetricC233, C234, C235
32.2uH 2.3A 97mΩ07_HPM_Inductance:L1008L13, L14, L15
32.54-2*2P_立贴99_HPM:HDR-SMD_4P-P2.54-V-M-R2-C2-LS7.5J13, J14, J15
325MHz_±10ppm_12pF09_HPM_Oscillator:3225X3, X4, X5
362pF,50V03_HPM_Capacitance:C_0402_1005MetricC121, C135, C149
3H5007NL11_HPM_Internet:PULSE_H5007NLU25, U28, U31
3HC-RJ45-5JA-1-411_HPM_Internet:RJ45-TH_HC-RJ45-5JA-1-4RJ4, RJ5, RJ6
3JL1111-N032I06_HPM_LQFP:QFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mmU20, U21, U22
3R-RJ45R08P-C00011_HPM_Internet:RJ45-TH_R-RJ45R08P-C000RJ1, RJ2, RJ3
3YT853106_HPM_LQFP:QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mmU23, U26, U29
3网口变压器11FB-05NL11_HPM_Internet:H1102_XFMR16_SMT17, T34, T51
2100K02_HPM_Resistor:R_0402_1005MetricR73, R82
210K_040202_HPM_Resistor:R_0402_1005MetricR98, R99
210uF,6.3V03_HPM_Capacitance:C_0402_1005MetricC33, C36
212pF,50V03_HPM_Capacitance:C_0402_1005MetricC19, C20
215pF,50V03_HPM_Capacitance:C_0402_1005MetricC24, C25
2DLW21SN900SQ2L07_HPM_Inductance:L2012L3, L4
2LOGO00_HPM_LOGO:jiantouG***, G***
2PW151506_HPM_SOT:SOT-23-5U11, U32
2USB_Type-C05_HPM_Connector_other:TYPE-C-16PJ2, J3
10Ω02_HPM_Resistor:R_0603_1608MetricR45
1100Ω@100MHz_2A02_HPM_Resistor:R_0805_2012MetricFB5
110Ω02_HPM_Resistor:R_0402_1005MetricR49
122.1K02_HPM_Resistor:R_0402_1005MetricR74
122uF,10V03_HPM_Capacitance:C_0402_1005MetricC17
124MHz ±10ppm 12pF09_HPM_Oscillator:3225X1
12K02_HPM_Resistor:R_0402_1005MetricR87
12N700206_HPM_SOT:SOT-23Q1
132.768kHz,12.5pF09_HPM_Oscillator:3215X2
14.7uH_1.6A07_HPM_Inductance:L_1210_3225MetricL2
14.7uH_2A07_HPM_Inductance:L_1210_3225MetricL1
151Ω02_HPM_Resistor:R_0402_1005MetricR68
1AP2151WG-706_HPM_SOT:SOT-23-5U10
1BAT54A-7-F06_HPM_SOT:SOT-23D3
1BAT54SWF04_HPM_Diode:SC-70D1
1CAT24C128WI-GT3Package_SO:SOP-8_3.9x4.9mm_P1.27mmU1
1CH340E06_HPM_SO:MSOP-10U9
1Conn_ARM_JTAG_SWD_2005_HPM_Connector_BoxHeader:IDC-Header_2x10_P2.54mmJ1
1DSHP08TS-SButton_Switch_SMD:SW_DIP_SPSTx08_Slide_Copal_CHS-08B_W7.62mm_P1.27mmSW1
1HPM Logo00_HPM_LOGO:HPM LOGO 8MARK2

The 705 most common of 726 parts.

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Questions

How big is the HPM6E00FULLPORTRevB PCB?

It measures 160 × 110 mm and has 4 copper layers, 1.6 mm thick.

What parts does the HPM6E00FULLPORTRevB use?

726 parts, built around the TJA1042T/3/1J, JL1111-N032I, YT8531C and CH340E. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the HPM6E00FULLPORTRevB KiCad files?

From the hpmicro/hpm_apps repository on GitHub, at the commit this page was made from: the board is apps/full_port/hardware/HPM6E00FULLPORTRevB-工程文件/HPM6E00FULLPORTRevB.kicad_pcb and its schematic apps/adc/hardware/HPM5300_ADC_EVK_RevA-工程文件/HPM5300_ADC_EVK_RevA/Assembly.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the HPM6E00FULLPORTRevB design in my own project?

Its repository publishes it under the BSD-3-Clause licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).