

Pandore
pandore is an open-source digital audio instrument protyping platform based on the LattePanda Mu.
- Size
- 260 × 110 mm
- Copper layers
- 4
- Thickness
- 1.58 mm
- Parts
- 804
- Nets
- 833
- Pads
- 3,193
- Tracks, vias
- 8,837, 2,217
- Pours
- 12
- Routed
- Yes
- KiCad
- KiCad 10.0 (file 20260206)
- Created
- 23 Mar 2026
- Updated
- 6 Nov 2026
Overview
Pandore is an open-source printed circuit board by filliformes, from the filliformes/pandore repository on GitHub. It is a 4-layer board of 260 × 110 mm with 804 parts on 833 nets, routed with 8,837 tracks and 2,217 vias.
It is built around the OPA1656ID, AP63356QZV and LDL212DR, with the 0402B104K160CT, CR0402-FX-1002GLF and RC0402JR-070RL among its other parts. Its parts include 288 capacitors, 277 resistors, 40 diodes, 21 ICs and 15 transistors. It belongs with the audio and music boards of this library.
Main components
12OPA1656ID
SOIC-8-18V~-2.25V、2.25V~18V -40℃~+125℃ 100mA 120dB 1mV 2 20pA 20pA 24V/us 2uV/℃ 3.9mA 4.3nV/√Hz@1kHz 4.5V~36V 53MHz Rail-to-rail output SOIC-8 FET Input Amplifiers ROHSTexas InstrumentsAudio AmplifiersAP63356QZV
VDFN-13(2x3)-40℃~+125℃@(TA) 1 22uA 3.5A 3.8V~32V 450kHz Adjustable Buck Buck Built-in Yes VDFN-13(2x3) DC-DC Converters ROHSDiodes IncorporatedDC-DC ConvertersLDL212DR
SOIC-8-40℃~+125℃@(Tj) 1 1.18V~17.4V 1.2A 18V 350mV@(1.2A) 380uA 50dB@(100kHz) 60uVrms Adjustable Over Current Protection、Enable Positive SOIC-8 Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHSSTMicroelectronicsVoltage Regulators - Linear, Low Drop Out (LDO) Regulators0402B104K160CT
0402100nF 16V X7R ±10% 0402 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSWalsin TechnologyMultilayer Ceramic Capacitors MLCC - SMD/SMTCR0402-FX-1002GLF
0402-55℃~+155℃ 10kΩ 50V 62.5mW Thick Film Resistor ±1% ±100ppm/℃ 0402 Chip Resistor - Surface Mount ROHSBournsChip Resistor - Surface MountRC0402JR-070RL
UncategorisedUnknown makerRT0805DRE075K1L
0805-55℃~+155℃ 125mW 5.1kΩ Thin Film Resistor ±0.5% ±50ppm/℃ 0805 Chip Resistor - Surface Mount ROHSYAGEOChip Resistor - Surface MountJMK105BBJ475MV-F
04024.7uF 6.3V X5R ±20% 0402 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSTaiyo YudenMultilayer Ceramic Capacitors MLCC - SMD/SMTBSS138P,215-ES
SOT-231 N-channel 1.1V 1.3pF 1.6nC@4.5V 1.8Ω@10V、2Ω@4.5V 15pF 3.3pF 300mA 350mW 60V N-Channel SOT-23 MOSFETs ROHSElecSuperMOSFETsA768EB107M1ELAE036
SMD,D6.3xL6mm-55℃~+125℃ 100uF 2000hrs@125℃ 25V 36mΩ 6.3mm 62.75mA@120Hz 6mm Polarized Polymer ±20% SMD,D6.3xL6mm Polymer Aluminum Capacitors ROHSKEMETPolymer Aluminum CapacitorsESD204DQAR
USON-10(1x2.5)-40℃~+125℃ 0.55pF 10nA 3.6V 5.5A@8/20us 50W@8/20us 7.9V 8.5V Bidirectional ESD Four channels IEC 61000-4-2、IEC 61000-4-5、IEC 61000-4-4 USON-10(1x2.5) ESD and Surge Protection (TVS/ESD) ROHSTexas InstrumentsESD And Surge Protection (TVS/ESD)VJ1206A101JXGCW1HV
1206100pF 1kV C0G ±5% 1206 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSVishay IntertechnologyMultilayer Ceramic Capacitors MLCC - SMD/SMT
README
README.mdPandore

Open-source digital audio instrument prototyping platform.
Pandore is a custom-designed PCB built around the LattePanda Mu compute module, a Teensy 4.1 audio bridge, dual RP2350 microcontrollers, and a professional audio I/O chain. It provides a complete hardware foundation for building digital audio instruments, effects processors, and experimental sound tools.
Status
Revision A0 — PCBA complete at PCBWay (3 units); hand-assembly of the through-hole/DNP parts and board bring-up in progress. Manufacturing files released 2026-03-19; DRC passing. See the interactive BOM and the A0 bring-up / hand-assembly guide.
PCBWay substitution: RP2350A was unavailable at assembly time; PCBWay substituted RP2350B (QFN-80) for both MCU positions. RP2350A and RP2350B are binary-compatible — same cores, same peripherals, same memory map — they differ only in package size and number of exposed GPIO pins (30 vs 48). Firmware developed on RP2350A Pico boards transfers without modification.
Board Specifications
| Parameter | Value |
|---|---|
| Dimensions | 260 mm x 110 mm |
| Layers | 4 (F.Cu / In1 / In2 / B.Cu) |
| Components | 804 (141 unique part numbers) |
| Vias | 2,217 |
| Design tool | KiCad 10 |
Architecture
+-----------------+
| LattePanda Mu |
| (x86-64 SBC) |
+--------+--------+
|
+----------+-----------+-----------+----------+
| | | |
+--------+-------+ | +---------+--------+ |
| RTIO MCU | | | Management MCU | |
| (RP2350) | | | (RP2350) | |
+--------+-------+ | +---------+--------+ |
| | | |
+--------+-------+ | +---------+--------+ |
| UART, SPI, I2C | | | GPIO, Power Seq, | |
| ADC, 8x PWM | | | Fan, Display | |
+----------------+ | +------------------+ |
| |
+--------+--------+ |
| Teensy 4.1 | |
| (I2S-to-USB | |
| Audio Bridge) | |
+--------+--------+ |
| |
+--------+--------+ +---------+--------+Compute
- LattePanda Mu — x86-64 SBC (Intel N100 or N305), main application processor. Recommended: DFR1147 (N100, 16 GB LPDDR5) — the N305 gives only ~13% single-core gain at ~2× cost, with no meaningful benefit for real-time audio workloads where single-thread performance dominates.
- RTIO MCU (RP2350) — Real-time I/O: UART, SPI, I2C, USB, ADC, 8x PWM channels
- Management MCU (RP2350) — System control: power sequencing, GPIO, fan, display, boot
Audio
- Audio/MIDI bridge: Teensy 4.1 — I2S-to-USB audio bridge between the CS4272 codec and the LattePanda Mu, also handles MIDI data transfer to the host computer
- Codec: Cirrus Logic CS4272 — stereo 24-bit ADC/DAC, I2S interface
- Preamp: THS4521 fully-differential amplifier + OPA1656 op-amp signal conditioning
- Phantom power: 48V supply via TI LM5158 flyback controller + TPS7A4001 ultra-low-noise 40V LDO post-regulation (~10 mA) for condenser microphones
- I2S isolation: TI ISO7762FDBQR — 6-channel digital isolator (4 forward / 2 reverse), 100 Mbps, 5000 VRMS galvanic isolation between digital and audio domains
- I2C isolation: TI ISO1640BDR — isolated I2C for codec control path, 2500 VRMS isolation
- Isolated power: Murata NXE2S1212MC-R7 — 2W isolated 12V→12V DC/DC converter (167 mA) for the isolated audio domain
- MIDI isolation: Isocom H11L1SMT optoisolator with Schmitt-trigger output on MIDI IN
- Monitor output: Dedicated headphone/speaker amplifier with hardware volume knob (Bourns PTR902-2020K-A103 — 10 kΩ audio taper, 20 mm shaft)
- Input buffering: Balanced input stage with line/mic switching
- Output buffering: Line-level outputs
Power
| Rail | Voltage | Current | Purpose |
|---|---|---|---|
| 12V | Main input | LattePanda Mu, OLED drive | |
| 5V | 2A (10W) | Digital logic, USB peripherals | |
| 3.3V | 3A (10W) | MCUs, codec digital, I/O | |
| 48V | 10 mA | Condenser microphone phantom power | |
| AV5 / AV3P3 | — | Analog audio supply (isolated domain) | |
| VSTBY | ~3.3V | Standby (CR2032 backup) |
Power ICs:
| Part | Role |
|---|---|
| Diodes AP63356Q (×2) | Synchronous buck converters (3.5A), main DC-DC regulation |
| STM LDL212DR (×3) | Ultra-low-dropout LDOs, local clean rails |
| ETEK ET20162 (×5) | USB VBUS current-limit load switches, 1A fixed each (U29–U32 = 4 USB-A ports, U33 = Teensy USB host) |
| TI LM5158RTER | Flyback controller for 48V phantom supply |
| TI TPS7A4001DGNR | Ultra-low-noise 40V LDO, phantom post-regulation |
| Murata NXE2S1212MC-R7 | 2W isolated 12V DC/DC (167 mA) for audio analog domain |
- Reverse-polarity, overcurrent, and overvoltage protection
- USB VBUS overcurrent handled by the ET20162 load switches (1A fixed limit each)
- PTC fuses (Bel Fuse 0ZCM0010FF2G, 0.1A) protect the Grove ports (J17/J18) on the standby rail
- Managed power-on sequencing via Management MCU
Connectivity
- Ethernet — 2× Gigabit Ethernet via Realtek RTL8111H-CG PCIe controllers (U7, U8), 2× shielded RJ45 with isolation transformers (Würth 749020111A)
- USB — 4× USB-A ports (2× USB 3.0 via J3 + 2× USB 2.0 via J2) broken out from the LattePanda Mu's 8 USB lanes (remaining lanes are internal — Teensy audio bridge, AX210 WiFi/BT); plus the Teensy 4.1's own USB-C jack exposed at the back panel
- MIDI — 5-pin DIN IN/OUT with H11L1 optoisolation
- Display — 24-pin 0.5mm FPC ZIF connector (GCT FFC2A32-24-T) for OLED status display (SSD1309, 128×64 px, 1.54") — see Components Requiring Separate Assembly
- M.2 Key-M — PCIe x4 (NVMe SSD)
- M.2 Key-A+E — WiFi/Bluetooth (tested: Intel AX210 — WiFi 6E tri-band + BT 5.3) or alternate storage
- Expansion headers — GPIO, analog, I/O breakouts; 2× Grove I2C connectors (3.3V, use Qwiic / STEMMA QT sensors — see below); I2S header; UART debug
User Interface
- Encoder: Bourns PEL12T-4225T-S1024 — 24 PPR optical rotary encoder with momentary push switch and RGB LED illumination
- Tactile switches: 4× C&K PTS810 momentary switches (B1–B4)
- Volume knob: Bourns PTR902-2020K-A103 potentiometer — 10 kΩ audio taper, 20 mm shaft (monitor output level; replaces BOM part 2015K-B103, linear, 15 mm)
- RGBA LED: AMS-OSRAM multi-colour LEDs — blue (×3), green (×4), orange (×7), red (×1) status/indicator outputs
Sensors
- BMI270 — 6-axis IMU (accelerometer + gyroscope) for motion-based control
External sensor expansion (Grove ports)
The two Grove connectors (J17/J18) are I2C sensor ports running at 3.3V — each on its own management-MCU I2C bus (J17 = I2C0, J18 = I2C1), powered from the standby rail through a 0.1A PTC fuse.
Because the ports are 3.3V, use the Qwiic / STEMMA QT sensor ecosystem (SparkFun, Adafruit, Arduino Modulino) — it is 3.3V-native, so modules plug in safely with no level shifting. A standard Grove-to-Qwiic adapter cable (Adafruit #4528 or SparkFun PRT-15109) connects them. Note: M5Stack Units are powered at 5V and are not directly compatible.
Flash Storage
3× Winbond W25Q128JVSIM (128 Mbit / 16 MB, QSPI):
- U2 — BIOS flash (LattePanda Mu)
- U5 — RTIO MCU flash (RP2350, U3)
- U6 — Management MCU flash (RP2350, U4)
Thermal
- 2× 4-pin PWM fan headers (J27 CPU, J38 system), Molex KK 254 47053-1000
- Fan header pinout: 1=GND, 2=5V, 3=Tach, 4=PWM (fed directly from the 5V rail — note: 5V, not the 12V of a standard PC fan header)
- PWM-controlled fan driver circuit
- Three heatsink options: active cooler (DFRobot FIT0981, 5V fan), thin passive, fanless
Audio Performance
See Audio Performance for the full signal chain, component specs, system-level estimates, physical I/O, and performance class.
Highlights: 24-bit / 192 kHz, 114 dB dynamic range, -100 dB THD+N, 5000 VRMS galvanic isolation, 2× Neutrik combo XLR+TRS inputs with 48V phantom power.
Repository Structure
pandore/
hw/ Schematics (.kicad_sch) and PCB layout (.kicad_pcb)
doc/
arch/ Architecture diagrams (draw.io)
img/ Board renders
reference/ Datasheets, app notes, design guides (PDF)
lib/ 3D models (.step), KiCad symbols and footprints
release/ Manufacturing artifacts (Gerbers, BOM, placement, 3D)Schematic Hierarchy
The top-level schematic (pandore.kicad_sch) references 24 sub-sheets organized by subsystem:
Audio — audio, audio-codec, audio-inputs, audio-inbuf, audio-outputs, audio-outbuf, audio-isolation, audio-monitor, audio-power
Compute — computer, cpumod, mcu, mgmtmcu, rtmcu
Power — power, audio-power
Interface — eth, usbport, midi, display, extraport, mdot2
System — bootctl, bios, fan
Components Requiring Separate Assembly
The PCBWay PCBA order covers all SMD components. The following through-hole and DNP parts must be sourced and hand-soldered separately. BOM part numbers are listed; substitutions are noted where a different part is recommended over the original BOM.
| BOM# | Per board | Ref | Description | Part (installed) | Notes |
|---|---|---|---|---|---|
| 40 | 1 | E1 | Encoder + RGB LED + switch | Bourns PEL12T-4225T-S1024 | 24 PPR, push switch, RGB illuminated |
| 47 | 2 | J4, J5 | Mic/Line input combo jack | Neutrik NCJ9FI-H-0 | XLR + 6.35mm TRS + 3-way switch |
| 50 | 2 | J8, J9 | Ethernet RJ45 | Amphenol RJE58-188-5441 | 8P8C shielded, dual LEDs, Cat5e (replaces BOM -5411, backordered; same footprint) |
| 51 | 2 | J10, J11 | MIDI DIN | Same Sky SDS-50J | 5-pin DIN 180° |
| 52 | 1 | J12 | Line output TRS | Neutrik NSJ12HF-1 | 6.35mm stacking stereo |
| 55 | 2 | J15, J16 | GPIO expansion header | Samtec MTSW-108-22-L-T-330-RA | 3×8 right-angle, 2.54mm pitch |
| 56 | 2 | J17, J18 | Grove connectors | TE 440055-4 | HPI 2.0mm R/A THT (replaces BOM 2041145-4, same family) |
| 105 | 1 | R273 | Headphone volume pot | Bourns PTR902-2020K-A103 | Audio taper, 20mm shaft (replaces BOM 2015K-B103, linear, 15mm) |
| — | 1 | J25 | OLED display panel | Microtips REX012864AYAP3N00000 (primary) or Midas MCOT128064B1V-WM (alt) | SSD1309, 128×64, 24-pin 0.5mm FPC; J25 ZIF socket is PCBWay-assembled |
| — | 1 | U9 | Audio/MIDI bridge module | PJRC Teensy 4.1 (SparkFun DEV-20359, headerless) | Mounted on Samtec TSW headers; its own USB-C jack is exposed at the panel |
| — | 2 | J28, J29 | Teensy USB-D± pogo pins | Same Sky CPG-23-SMT-TR | Spring contacts tapping the Teensy's underside USB-D+/D− pads — not USB-C receptacles; hand-soldered |
| — | 1 | J13 | NVMe SSD | User choice | M.2 2280 Key-M, PCIe x4 |
| — | 1 | J19 | WiFi/BT module | Intel AX210 (WiFi 6E + BT 5.3) | M.2 2230 Key-E |
Manufacturing
The release/ directory contains two packages dated 2026-03-19 (revision A0):
pandore_*_A0_pcba.zip— PCBA package: Gerbers, drill files, BOM (.csv), pick-and-place (.pos)pandore_*_A0_release.zip— Full release: PCBA files + 3D assembly model (.step), assembly drawings (PDF), rendered board images, ERC/DRC reports
4-layer stackup. 2,439 drill holes. All components have manufacturer part numbers assigned.
Reference Documentation
The doc/reference/ directory includes datasheets and design guides used during development:
- RP2350 datasheet and hardware design guide
- LattePanda Mu evaluation kit guide and carrier board reference
- CS4272 codec (via SuperAudioBoard design guide and schematic)
- THAT1512 microphone preamp gain configuration (reference design)
- 48V phantom power supply design (TI SBOA320A + ultra-low-noise RAQ approach)
- Analog circuit design references (Analog Secrets series, AES mic preamp paper)
- THAT Corporation mic preamp reference design (git submodule)
Requirements
Credits
Designed by Vincent Fillion at Artificiel, with the help of Alexandre Burton.
Hardware engineering and KiCad source files by Laurence Deschênes Villeneuve (@laurencedv).
License
This project is licensed under the CERN Open Hardware Licence Version 2 — Strongly Reciprocal (CERN-OHL-S-2.0).
You are free to use, study, modify, and distribute this design, provided that:
- You credit the original authors
- You distribute any modified versions under the same licence
- You make the source files available
Parts
804| Qty | Value | Footprint | References |
|---|---|---|---|
| 109 | 100nF, 25V, X7R | reekilib_cap:CAPC1005 | C10, C11, C12, C13, C14, C15, C16, C17, C113, C114, C115, C116, C119, C133, C140, C156 +93 |
| 57 | 10kΩ, 1%, 63mW | reekilib_res:RESC1005 | R10, R13, R17, R106, R107, R108, R109, R129, R130, R133, R134, R140, R141, R143, R144, R155 +41 |
| 34 | 10µF, 25V, X5R | reekilib_cap:CAPC2012 | C100, C101, C102, C111, C112, C120, C134, C155, C157, C186, C188, C196, C197, C198, C230, C231 +18 |
| 28 | 0Ω, 5%, 63mW | reekilib_res:RESC1005 | R2, R194, R195, R199, R202, R203, R212, R213, R214, R236, R237, R238, R239, R245, R278, R279 +12 |
| 24 | 1kΩ, 1%, 63mW | reekilib_res:RESC1005 | R14, R15, R16, R21, R22, R23, R132, R139, R177, R207, R218, R220, R229, R230, R234, R235 +8 |
| 22 | 5.1kΩ, 0.5%, thin film | reekilib_res:RESC2012 | R74, R75, R76, R77, R78, R79, R252, R253, R258, R259, R262, R263, R264, R266, R267, R269 +6 |
| 17 | 2.2kΩ, 1%, 63mW | reekilib_res:RESC1005 | R57, R58, R59, R60, R61, R164, R165, R166, R167, R172, R173, R174, R175, R176, R178, R179 +1 |
| 16 | 100pF, 50V, C0G | reekilib_cap:CAPC1608 | C139, C144, C145, C146, C147, C151, C152, C158, C167, C168, C169, C170, C171, C172, C173, C174 |
| 16 | 4.7µF, 6.3V, X5R | reekilib_cap:CAPC1005 | C31, C32, C63, C64, C65, C66, C98, C103, C214, C215, C216, C217, C218, C219, C229, C261 |
| 15 | MOSFET_EN-N | reekilib_sot:SOT95P280X100-3 | Q1, Q2, Q3, Q4, Q5, Q6, Q7, Q8, Q9, Q10, Q11, Q12, Q13, Q14, Q15 |
| 14 | 1µF, 16V, X7R | reekilib_cap:CAPC1608 | C201, C237, C238, C239, C263, C264, C265, C266, C267, C268, C269, C270, C271, C272 |
| 14 | 220nF, 16V, X7R | reekilib_cap:CAPC1005 | C121, C130, C141, C148, C248, C249, C250, C251, C252, C253, C254, C255, C256, C257 |
| 12 | 100µF, 25V, 20% | reekilib_cap:CAPAE630Xxxx | C122, C127, C137, C138, C159, C160, C161, C162, C187, C273, C289, C290 |
| 12 | 1kΩ, 0.5%, thin film | reekilib_res:RESC2012 | R94, R95, R96, R97, R100, R101, R102, R103, R118, R119, R120, R121 |
| 12 | 5V | reekilib_dfn:DFN50P100X250X55-10_ESD204 | D6, D7, D8, D9, D10, D11, D12, D13, D14, D15, D16, D27 |
| 11 | 100pF, 1kV, X5R | reekilib_cap:CAPC3216 | C85, C86, C105, C106, C107, C108, C109, C210, C211, C212, C213 |
| 11 | 10Ω, 1%, thin film | reekilib_res:RESC2012 | R52, R82, R83, R88, R89, R204, R205, R265, R268, R271, R272 |
| 10 | 0Ω, 5%, thin film | reekilib_res:RESC2012 | R131, R138, R142, R147, R227, R260, R261, R270, R274, R275 |
| 10 | 49.9Ω, 1%, 63mW | reekilib_res:RESC1005 | R159, R160, R161, R162, R163, R201, R209, R210, R240, R250 |
| 8 | 1.3nF, 16V, C0G | reekilib_cap:CAPC1608 | C117, C118, C128, C129, C142, C143, C149, C150 |
| 8 | 300pF, 16V, C0G | reekilib_cap:CAPC1608 | C123, C124, C131, C132, C281, C282, C287, C288 |
| 8 | 75Ω, 1%, 250mW | reekilib_res:RESMELF0204 | R34, R35, R36, R37, R38, R39, R40, R41 |
| 7 | 560Ω, 5%, 63mW | reekilib_res:RESCAXSR50P200X100X35-8 | R44, R45, R46, R47, R55, R56, R197 |
| 7 | Mounting | reekilib_mnt:mnt_M3 | MNT2, MNT3, MNT4, MNT5, MNT6, MNT7, MNT8 |
| 7 | orange | reekilib_led:LEDM1608X80 | D23, D24, D26, D29, D30, D31, D33 |
| 6 | 100kΩ, 1%, 63mW | reekilib_res:RESC1005 | R135, R145, R152, R211, R221, R285 |
| 6 | 12pF, 6.3V, X7R | reekilib_cap:CAPC1005 | C73, C74, C75, C76, C96, C97 |
| 6 | 22µF, 25V, X5R | reekilib_cap:CAPC3216 | C180, C181, C182, C192, C193, C194 |
| 6 | 75V, 150mA, 1V@100mA | reekilib_sod:sod-123 | D17, D28, D32, D36, D37, D42 |
| 5 | 2.49kΩ, 1%, 63mW | reekilib_res:RESC1005 | R26, R27, R146, R156, R208 |
| 5 | 5.5V 1A | reekilib_sot:SOT95P280X100-5 | U29, U30, U31, U32, U33 |
| 5 | 560Ω, 1%, 63mW | reekilib_res:RESC1005 | R185, R186, R187, R206, R228 |
| 5 | M2 | reekilib_mnt:mnt_M2_ele | M2AE30, M2M42, M2M60, M2M80, M2M110 |
| 4 | 0Ω, 5%, 63mW | reekilib_res:RESCAXSR50P200X100X35-8 | R168, R169, R170, R171 |
| 4 | 100Ω, 1%, thin film | reekilib_res:RESC2012 | R80, R81, R92, R93 |
| 4 | 10kΩ, 0.5%, thin film | reekilib_res:RESC2012 | R254, R255, R256, R257 |
| 4 | 15pF, 6.3V, X7R | reekilib_cap:CAPC1005 | C37, C38, C39, C40 |
| 4 | 33nF, 16V, X7R | reekilib_cap:CAPC1608 | C125, C126, C135, C136 |
| 4 | 33µF, 63V, 20% | reekilib_cap:CAPAE630Xxxx | C163, C164, C165, C166 |
| 4 | 40.2Ω, 0.5%, thin film | reekilib_res:RESC2012 | R98, R99, R104, R105 |
| 4 | 470Ω, 1%, 63mW | reekilib_res:RESC1005 | R28, R29, R30, R31 |
| 4 | 47kΩ, 0.5%, thin film | reekilib_res:RESC2012 | R114, R115, R116, R117 |
| 4 | 6.8kΩ, 0.5%, thin film | reekilib_res:RESC2012 | R122, R123, R124, R125 |
| 4 | 6V | reekilib_dio:dio_sma | D38, D39, D40, D41 |
| 4 | 75V, 140mA, 1.25V@150mA | reekilib_sot:SOT65P210X90-3 | D19, D20, D21, D22 |
| 4 | 9.1kΩ, 0.5%, thin film | reekilib_res:RESC2012 | R110, R111, R112, R113 |
| 4 | OPA1656 | reekilib_soic:SOIC127P600X150-8 | U26, U34, U35, U36 |
| 4 | OPAMP_DIFF_1 | reekilib_sop:SOP65P490X300-8 | U15, U16, U17, U18 |
| 4 | green | reekilib_led:LEDM1608X80 | D3, D4, D5, D35 |
| 4 | mom_tact_no | reekilib_msw:tact_460X320X250 | B1, B2, B3, B4 |
| 3 | 100nF, 100V, X7R | reekilib_cap:CAPC2012 | C205, C209, C224 |
| 3 | 10nF, 100V, X7R | reekilib_cap:CAPC1608 | C199, C225, C226 |
| 3 | 10µH | reekilib_ind:INDC2520 | L1, L2, L3 |
| 3 | 1MΩ, 1%, 63mW | reekilib_res:RESC1005 | R24, R25, R222 |
| 3 | 1nF, 16V, X7R | reekilib_cap:CAPC1005 | C183, C190, C204 |
| 3 | 21kΩ, 1%, 63mW | reekilib_res:RESC1005 | R151, R200, R249 |
| 3 | 33Ω, 1%, 63mW | reekilib_res:RESC1005 | R53, R157, R158 |
| 3 | 47µF, 25V, 20% | reekilib_cap:CAPAE630Xxxx | C94, C104, C110 |
| 3 | 5.6kΩ, 1%, 63mW | reekilib_res:RESC1005 | R73, R188, R226 |
| 3 | 53.6kΩ, 1%, 63mW | reekilib_res:RESC1005 | R149, R154, R276 |
| 3 | LDL212DR | reekilib_soic:SOIC127P600X150-8 | U13, U14, U27 |
| 3 | blue | reekilib_led:LEDM1608X80 | D1, D2, D34 |
| 3 | fiducial | reekilib_vrt:fiducial_1to2_1mm | V5, V6, V7 |
| 3 | mem_flash_spi | reekilib_soic:SOIC127PxxxX200-8 | U2, U5, U6 |
| 3 | tooling hole | reekilib_vrt:mechole_2.0mm | V8, V9, V10 |
| 2 | 12MHz, 30ppm+30ppm, 10pF | reekilib_osc:OSCCC320X250X90 | X1, X2 |
| 2 | 1nF, 1kV, X7R | reekilib_cap:CAPC3216 | C49, C50 |
| 2 | 2.7nF, 16V, C0G | reekilib_cap:CAPC1608 | C153, C154 |
| 2 | 25MHz, 30ppm+30ppm, 10pF | reekilib_osc:OSCCC320X250X90 | X3, X4 |
| 2 | 27Ω, 5%, 63mW | reekilib_res:RESCAXSR65P100X100X35-4 | R11, R12 |
| 2 | 3.3µH, 1.8A | reekilib_ind:INDC2012 | L7, L8 |
| 2 | 30kΩ, 1%, 63mW | reekilib_res:RESC1005 | R127, R137 |
| 2 | 316kΩ, 1%, 63mW | reekilib_res:RESC1005 | R148, R153 |
| 2 | 4.7kΩ, 1%, 63mW | reekilib_res:RESC1005 | R198, R251 |
| 2 | 47pF, 10V, X7R | reekilib_cap:CAPC1005 | C185, C195 |
| 2 | 56µF, 100V, 20% | reekilib_cap:CAPAE1000Xxxx | C206, C208 |
| 2 | 68pF, 10V, X7R | reekilib_cap:CAPC1005 | C184, C191 |
| 2 | 8.2µH, 5A | reekilib_ind:Eaton_HPAL1V0630 | L4, L5 |
| 2 | 8p8c_2led_shield | reekilib_con:amphenol_RJE58-188-54x1-0x | J8, J9 |
| 2 | AP6335xQ | reekilib_dfn:DFN300X200X90-9 | U19, U20 |
The 676 most common of 804 parts.
Questions
How big is the Pandore PCB?
It measures 260 × 110 mm and has 4 copper layers, 1.58 mm thick.
What parts does the Pandore use?
804 parts, built around the OPA1656ID, AP63356QZV, LDL212DR and 0402B104K160CT. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Pandore KiCad files?
From the filliformes/pandore repository on GitHub, at the commit this page was made from: the board is hw/pandore.kicad_pcb and its schematic doc/rp2350.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the Pandore design in my own project?
Its repository states no licence, so its author keeps all rights: ask filliformes before reusing the design.
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